A new SOS technology utilizing the non-doped silicon film without any process steps to dope impurities deep into the film under the gate is presented. The minimal junction capacitance is realized even with the shallow junction depth. The small source-drain leakage current is obtained. The threshold voltage is controlled by the film thickness. The simplified process is realized. A 1 K-bit RAM is fabricated with this technology. The access time of the SOS-RAM is faster than that on bulk-silicon by a factor of 1.5 at the same power supply voltage VCC. The shortest access times of 20 ns and 40 ns are measured at VCC=10 and 5 V, respectively. The active power dissipation is 65% of that on bulk-silicon. The quiescent power dissipation of the SOS-RAM is obtained as 30 µW at VCC=5 V.
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