ABSTRACT Sweet sorghum syrup was heated at 49° to 71°C and filled into glass jars of 200 mL capacity that contained each of four microorganisms (Bacillus subtilis; Byssochlamys nivea; Saccharomyces rouxii; and Aspergillus niger) at 0, 1,000 or 10,000 CFU/mL syrup. Counts were determined on syrup immediately after filling into the jars and after four months storage. The heated syrup at all temperatures significantly reduced the survival of bacteria and fungi at the time of filling. After four months, no bacteria could be detected in syrup at each temperature, and no fungi could be detected at 66° and 71°C. The heat of syrup at 71°C or lower did not cause single layer polypropylene jars to become deformed; however, at 77° and 82°C deformation occurred such that the jars were unsatisfactory for the packaging of syrup. Therefore, syrup can be filled at 66° and 71° into single layer polypropylene jars. At these temperatures, common spoilage microflora were destroyed or inactivated during storage, and the plastic jars did not become deformed.
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