AbstractIn enhancing the lifespan of anode‐free Li metal batteries (AFLMBs), current collector (CC) engineering is crucial for achieving uniform and dendrite‐free lithium deposition. The commonly used copper (Cu) CC is unsatisfactory because of its poor lithiophilicity. Here, we consider Zn doping on the Cu CC surface (Zn−Cu) and explore the reductive stability of a high‐concentration electrolyte (HCE), consisting of 3.6 M Lithium Hexafluorophosphate (LiPF6) salt in a mixture of ethylene carbonate (EC) and diethylcarbonate (DEC), on the Zn−Cu (111) surface (HCE|Zn−Cu) using density functional theory (DFT) and ab initio molecular dynamics (AIMD) simulations. The interfacial reactions in the HCE|Zn−Cu system are compared to those on the pristine Cu (111) surface (HCE|Cu). We have also studied the effect of electron‐rich environments on the decomposition mechanism of the HCE mixture on both the CC surfaces. It is found that the HCE mixture is electrochemically stable on both Cu and Zn−Cu surfaces in a neutral environment. However, under electron‐rich conditions, only one DEC molecule has decomposed upon contact with the Cu CC surface, while the two PF6− anion groups from Li salts have decomposed much faster (within 100 fs) when the HCE mixture interacts with the Zn−Cu surface. Our results indicate that Zn doping suppresses undesirable solvent decomposition and improves the quality of the solid electrolyte interphase (SEI) layer.
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