Zr–Ti and Hf–Ti composite nitrates were successfully developed as single-source precursors for the chemical vapor deposition (CVD) of Zr x Ti 1− x O 2 and Hf x Ti 1− x O 2 thin films. The Zr–Ti nitrate can be assumed as a solid solution of the individual Zr and Ti nitrates, and the Zr/Ti molar ratio in the deposited Zr x Ti 1− x O 2 films is consistent with that in the precursor. The Hf–Ti nitrate appears to be a mixture of the Hf and Ti nitrates and the composition of the deposited Hf x Ti 1− x O 2 films depends remarkably on the heating time of precursor. Both Zr x Ti 1− x O 2 and Hf x Ti 1− x O 2 films exhibit trade-off properties between band gap and dielectric constant. The obtained results suggest that Zr x Ti 1− x O 2 and Hf x Ti 1− x O 2 films are promising candidates for gate dielectric application to improve the scalability and reduce the leakage current of the future complementary metal-oxide-semiconductor (CMOS) devices.
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