Solid Solution Of Copper Research Articles

Defect microstructure in copper alloys irradiated with 750 MeV protons

Transmission electron microscopy (TEM) disks of pure copper and solid solution copper alloys containing 5 at% of Al, Mn, or Ni were irradiated with 750 MeV protons to damage levels between 0.4 and 2 displacements per atom (dpa) at irradiation temperatures between 60 and 200°C. The defect cluster density in copper was observed to be constant for irradiation temperatures below about 130°C, and to decrease with increasing temperature above 150°C. About 60% of the defect clusters in copper were resolvable as stacking fault tetrahedra (SFT). Cavity formation was observed for irradiation temperatures above about 150°C. The dislocation loop and network densities were relatively low in all of the irradiated pure copper specimens. Contrary to expectations, the loop density and size both decreased with increasing irradiation temperature. Solute additions did not have any significant effect on the total density of small defect clusters, but they did cause a significant decrease in the fraction of defect clusters resolvable as SFT to ~ 20 to 25%. In addition, the dislocation loop density (> 5 nm diameter) was more than an order of magnitude higher in the alloys compared to pure copper.

Vibrational spectra of two phases of copper pyrovanadate and some solid solutions of copper and magnesium pyrovanadate

Infrared and Raman spectra of both the α- and β-phases of Cu 2V 2O 7 are presented. Of the 13A′ + 8 A″ vibrational modes of V 2O 4− 7 all of the ones predicted to be terminal stretching modes can be distinguished for both phases in the Raman. Both the symmetric and asymmetric bridge stretching modes are observed for α-Cu 2V 2O 7. The Raman spectra of the solid solution series Cu 2−xMg xV 2O 7 (x = 0.5; 0.67) are similar to that of β-Cu 2V 2O 7. The influence of magnesium substitution in the copper pyrovanadate lattice can be observed from the shift of vibrational bands.

Cooling and heating rate dependence of precipitation in an Al—Cu alloy

Differential scanning calorimetry and X-ray diffraction were used to study the cooling and heating rate dependence of precipitation in an Al-1.66 at.% Cu alloy. After homogenizing, cooling at a rate of 22 K min−1 (SC22) is sufficient to retain all copper in solid solution. GP-zone formation during subsequent heat treatment is hindered; this is ascribed to an insufficient number of (excess) vacancies. After a water quench (WQ) a large number of GP zones are formed during subsequent storage at room temperature for 1 h. The heat content of the GP-zone dissolution effect can quantitatively be described in terms of the heat of precipitation of GP I zones and the solid solubilities as derived from the GP I zone solvus. The heat content of the combined θ′-/θ-phase precipitation effect appeared to be proportional to the number of copper atoms precipitated, yielding an average value for the heat of copper precipitation of 36 kJ mol−1 copper. The activation energy for θ′-phase formation is 0.75 eV for SC22 specimens and 1.10 ± 0.10 eV for WQ specimens. The differences in reported activation energies for θ′-phase formation are discussed in terms of mobility of dissolve atoms (related to the vacancy concentration), interfacial energy and direction of growth (normal or perpendicular to the θ′-phase plate).

Steady-state deformation of copper solid-solution alloys

The plasticity of copper solid solutions exhibits unusual properties, which are not yet understood. Two basically different classes may be distinguished. Alloys of the first type behave similarly as “normal” metallic solid solutions such as AlMg, the steady-state deformation characteristics of which are more or less established in the literature. The second type shows properties as pure metals although, according to the material parameters involved, typical alloy effects should be expected. It is shown that these two classes of copper solid solutions are characterized by a different magnitude of the atomic misfit between solute and solvent atoms. Such an effect is not known for the “normal” metallic alloys. The peculiarities in the deformation behavior of pure copper are discussed in this context. Nickel solid solutions are also discussed. Die Plastizitat von Kupfermischkristallen zeigt ungewohnliche Eigenschaften, die bisher noch nicht verstanden sind. Grundsatzlich kann man zwei verschiedene Verhaltensweisen unterscheiden. Die eine Art von Legierungen verhalt sich wie „normale” metallische Mischkristalle, wie z. B. AlMg, uber deren stationare Verformungseigenschaften in der Literatur mehr oder weniger Einverstandnis besteht. Legierungen der zweiten Art verhalten sich praktisch wie reine Metalle, obwohl man aufgrund ihrer Materialparameter typische Mischkristalleffekte erwarten sollte. Diese Unterschiede haben offensichtlich etwas mit der verschiedenen Grose der atomaren Fehlpassung zwischen Legierungs- und Matrixelement in den verschiedenen Kupferlegierungen zu tun. Solch ein Effekt ist bei den „normalen” Mischkristallen nicht bekannt. In diesem Zusammenhang wird das ungewohnliche Verformungsverhalten von reinem Kupfer diskutiert. Nickelmischkristalle werden auch diskutiert.

The Regularities of Selective Oxidation of Copper-Aluminium Solid Solutions.

ABSTRACTThe regularities of selective oxidation of copper solid solutions with 2–12 at.% aluminium have been studied by TEM, XPS and AES in combination with argon ion sputtering. It has been obtained that the increase of the aluminium concentrations in the solid solutions leads to the change of the oxidation mechanism. The internal oxidation of aluminium in Cu+(2–4at.%)Al results in the formation of the microincluslons of Al2O3 In the alloy. It has been demonstrated that the selective oxidation of aluminium in Cu+(12 at.%)Al results in the formation of uniform thin (<10 nm) aluminium oxide at the alloy surface. The kinetics of this alloy oxidation obeys the parabolic law.

３００４系アルミニウム合金の時効硬化に及ぼす中間焼鈍時のＣｕの析出・固溶の影響

3004 base aluminum alloys cold-rolled to sheets are known to show age-hardening in the case of Cu, Mg and Si existing in solid solution. The solid solution state is usually obtained by rapid quenching from relatively high temperatures such as by CAL annealing method. In this work, the behavior of precipitation and solid solution of copper during intermediate annealing was investigated for the 3004 alloys containing 0.14 to 0.45%Cu. Copper was found to be retained in solid solution even in the case of slow cooling of 50°C/h from annealing temperatures above 370°C. This resulted in age-hardening in the cold-rolled sheets aged at 160°C for 2 hours. The present heat-treatment condition was easily obtained by conventional box type annealing.

Structure and properties of welded aluminum-copper joints

1. Formation of a Al−Cu-joint structure made by butting contact fusion welding occurs by a soldering mechanism, i.e., welding with development in the joint of hypereutectic alloy. 2. The structure of the transition zone of joints made by friction welding consists of a solid solution of copper in aluminum with a very small amount (∼1.5%) θ-phase which provides quite high strength properties for these joints.

Preparation and characterization of copper-thorium oxide catalysts. 1. Solid solution of copper(II) in thoria: an ESR study

ADVERTISEMENT RETURN TO ISSUEPREVArticleNEXTPreparation and characterization of copper-thorium oxide catalysts. 1. Solid solution of copper(II) in thoria: an ESR studyR. Bechara, G. Wrobel, C. F. Aissi, M. Guelton, J. P. Bonnelle, and A. Abou-KaisCite this: Chem. Mater. 1990, 2, 5, 518–522Publication Date (Print):September 1, 1990Publication History Published online1 May 2002Published inissue 1 September 1990https://doi.org/10.1021/cm00011a010RIGHTS & PERMISSIONSArticle Views105Altmetric-Citations20LEARN ABOUT THESE METRICSArticle Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to reflect usage leading up to the last few days.Citations are the number of other articles citing this article, calculated by Crossref and updated daily. Find more information about Crossref citation counts.The Altmetric Attention Score is a quantitative measure of the attention that a research article has received online. Clicking on the donut icon will load a page at altmetric.com with additional details about the score and the social media presence for the given article. Find more information on the Altmetric Attention Score and how the score is calculated. Share Add toView InAdd Full Text with ReferenceAdd Description ExportRISCitationCitation and abstractCitation and referencesMore Options Share onFacebookTwitterWechatLinked InReddit PDF (595 KB) Get e-Alerts Get e-Alerts

アルミニウムの腐食に及ぼす銅含有量の効果

The corrosion behaviors of the four kinds of Al-Cu alloys with different copper contents ranging from 0.36-1.30% were investigated in terms of the corrosion weight loss, micromorphology observations and measurements of the corrosion potentials. Increasing the content of copper in aluminum results in decreasing the corrosion resistance of aluminium. It is shown that the copper in solid solution has less effect on the corrosion resistance than the copper as intermetallic phases of CuAl2.

Solid state reactions in the CuZn system induced by plastic deformation at room temperature

CuZn alloys have been prepared by mechanical alloying of pure copper and zinc sheets and by co-sputtering on liquid N 2 cooled substrates. In the mechanically prepared samples the initial reaction is driven by the diffusion of copper into zinc which leads to the formation of the ε and γ phases. When the overall composition is sufficiently copper rich that the 7 phase is present together with unreacted copper further reactions proceed by the diffusion of zinc into the copper solid solution. The reaction rates appear to have roughly the same value whichever reaction is considered. No amorphous phases were found in alloys prepared both by mechanical alloying and by sputter evaporation.

銀とすずを複合添加した四元りん銅ろう合金の液相面の検討

Liquidus surface of copper phosphorus brazing filler metals with silver and tin addition was investigated. Spreadability and erosion of Cu-Ag-Sn-P quaternary filler metals on copper base metal were also studied. Primary phase could be predicted by using the phosphorus equivalent. The filler metals with the phosphorus equivalent more than 8.38 crystallizes Cu3P primary phase, whereas the filler metals with the value less than 8.38 crystallizes copper solid solution. The primary phase is also predicted by the electron concentration of filler metal, and also the ratio of electron concentration of tin plus phosphorus content to that of copper plus silver content. The erosion depth of copper base metal increased almost linearly with tin, silver and phosphorus content.

Ｃｕ‐Ａｇ‐ＰおよびＣｕ‐Ｓｎ‐Ｐ系ろう合金の状態図的検討 ＩＩ 低融点りん銅ろうに関する研究

Liquidus plane and some cross sectional phase diagrams of Cu-Ag-P and Cu-Sn-P ternary alloys at copper rich corner were established using differential thermal analysis and microscopic observations. Primary phase planes of copper solid solution (Cu) and Cu3P phase were divided by a straight line which started from Cu-P system binary eutectic composition. In respect of the primary phase, the addition of tin was similar to the phosphorus addition, because the primary phase changed from Cu phase to Cu3P phase at lower phosphorus. The phosphorus equivalent of tin was determined to be 0.238 in case of mass % expression. The phosphorus equivalent' of silver was only 0.066.The spreadability of Cu-Sn-P filler metals were inferior to that of Cu-Ag-P, which is explained by the thermodynam c calculation that tin oxide is not so easily reduced by phosphorus. The activation energy of erosion of copper base metal was coincided well with that of diffusion of tin in solid copper.

The Mechanism of Dealloying of Copper Solid Solutions and Intermetallic Phases

Potentiostatic experiments in at show that the kinetics of dealloying of copper base binary alloys fall in the orderFor the solutes Al and Zn, the kinetics of dealloying may be expressed by the relationshipwhere is the excess solute dissolved and is the atom percent solute. is related qualitatively to the reversible potential of the solute element. It is shown that dealloying cannot propagate into the alloys by diffusion of solute from the bulk to the surface. Instead, dealloying is maintained by solution intrusion under conditions where continuous solute paths exist in the alloy and where solute removal results in atomic rearrangement of the depleted alloy.

Nature of the active component of copper-zinc-aluminium catalyst for methanol synthesis

Comparative studies of the catalytic properties and thermal stability of a copper-zinc-aluminium catalyst and its components have revealed that the catalytic activity is determined by a solid solution of copper and aluminium in zinc oxide containing OH− and CO32− groups in its anion skeleton. The presence of aluminium in the solid solution ensures the increase of the catalyst thermal stability in the reaction medium.

Concentrational and temperature dependence of the physical yield point of fcc polycrystals of copper solid solutions

Concentrational and temperature dependence of the physical yield point of fcc polycrystals of copper solid solutions

The effect of alloying additions on collision cascades in heavy-ion irradiated copper solid solutions

Abstract Transmission electron microscopy (TEM) methods described in another paper (Stathopoulos 1981) have been employed in a comparative study of the effect of alloying with various types and amounts of solute atoms on the damage created by 30 keVCu+ and W + ions in copper. The irradiations were carried out on a series of high-purity Cu–Al and Cu–Ge and a selection of Cu–Si, Cu–Ni, Cu–Zn and Cu–Be single-crystal alloys at room temperature. The results demonstrate that the same cluster-formation mechanism operates in the alloys as in the pure metal, i.e. athermal collapse of vacancies in collision cascades to create small defect clusters, 8 → 100 Å diameter, in the form of simple and dissociated Frank loops, and stacking fault tetrahedra (s.f.t.). The type and concentration of the solute was found to influence strongly the final cluster geometry with the degree of loop dissociation increasing as the stacking fault energy of the alloy decreased. A large proportion of s.f.t. were found in the more concentrated alloys with the exception of Cu–10·1 Ni alloy where 2·5% of the loops had unfaulted to perfect loops. In all the alloy systems the efficiency with which cascades collapsed to produce visible vacancy clusters was higher than in copper depending on solute type and increased with increasing solute concentration. A correlation was found with the modulus of the solute-atom size factor suggesting the importance of dechannelling of ions and planarly channelled knockons in creating the extra defects. The effect of alloying on cluster size distributions was found to be complex in its dependence on the solute and ion species employed. The detailed variations are discussed in terms of the balance between the processes considered important in the creation and clustering of vacancies in the cascade.

High-temperature isothermal internal friction of copper and copper-aluminium solid solutions between 10−4and 10 Hz

Abstract Copper and copper-aluminium solutions have been studied by means of high-temperature isothermal internal friction experiments performed between 10−4 and 10 Hz, in the temperature range 370-680°C. An enlarged internal friction peak superimposed on an exponential low-frequency background has been observed in each case. Such damping peaks are attributed to dislocation motion inside the grains. Activation energies are deduced from the peak position shifts as a function of the temperature. Possible rate-limiting mechanisms are suggested and discussed.

Recrystallization and stored energy of dilute copper solid solutions with substitutional transition elements of the 4th period

A study of the effect of substitutional solute elements of the fourth period on recrystallization and stored energy of pure copper (99.999%) has been carried out. Specimens of copper alloys containing Mn. Fe, Ni, Zn. Ge in concentrations ranging from 10 at. × 10 −6 to 1.5%, deformed by cold rolling (85%), were submitted to heating at a constant rate in a Differential Scanning Calorimeter. The foreign elements act in different ways according to the concentration range considered: small amounts enhance recrystallization rate and stored energy content, further additions always retard recrystallization, while stored energy is increased or lowered according to the type of solute. The dependence of the effect of foreign atoms on their position in the periodic table was checked and found to fit two different patterns at very low and at higher concentrations. The effect of the first additions seems to be related to their atomic volume as displayed in solid solution, while free binding energy of the solute with boundary is to be considered the prime factor conditioning the behaviour of the alloys at higher contents.

Positron trapping in the liquid and solid copper alloys

The peak counting rates of γ− γ angular correlation curves of positron annihilation (PCAC) in the liquid state fitted well to the straight line which had the same slope of the temperature dependence of the PCAC's attributed to the free annihilation in the solid state, for the Cu-8Ge and Cu-10.5Ge alloys and other copper solid solutions. The results of the positron trapping model fitting suggest the possibility that the positron in the liquid state repels the surrounding ions.

Structure and properties of cast microconductors of binary copper alloys

1. We investigated the specific characteristics of cast microconductors from the liquid phase with use of solid solutions of copper with Ag, Si, Ga, In, Zn, Ge, Sn, Cr, Mn, Ni, Pd, and Fe. We determined the variation of CER and the resistivity with composition. At concentrations corresponding to the solid solution the value of CER is inversely proportional to the atomic number of the element dissolved in the alloy. 2. Several structural characteristics of cast microconductors of copper alloys obtained by rapid quenching from the liquid phase were investigated. It was found that the structure of microconductors 3–20 μ in diameter consists of misoriented dendrites 0.2–0.5 μ in size, with small branches. In the longitudinal direction the strand consists of oriented polycrystals with preferred orientations [100] and [111]. In microconductors of copper alloys with palladium there are sections consisting of stressed blocks of single crystals. 3. With quenching of microconductors of binary alloys of copper with gallium and indium directly from the liquid phase the region of existence of the primary solid solution in the metastable condition broadens as compared with corresponding equilibrium systems. 4. Among the copper alloys investigated, the most promising systems for the development of microconductors with low CER are Cu−Mn and Cu−Ni. Low-resistance alloys have been developed on the basis of these systems, with CER<10·10−6 C−1 and linear resistance 2.5–60 kΩ/m. These alloys have been introduced in industry for the production of cast microconductors and resistance elements based on them.