SoC Test Research Articles

Core-unified soc test data compression and application

The pattern run-length coding test data compression approach is extended by introducing don’t care bit (x) propagation strategy into it. More than one core test sets for testing core-based System-on-Chip (SoC) are unified into a single one, which is compressed by the extended coding technique. A reconfigurable scan test application mechanism is presented, in which test data for multiple cores are scanned and captured jointly to make SoC test application more efficient with low hardware overhead added. The proposed union test technique is applied to an academic SoC embedded by six large ISCAS’89 benchmarks, and to an ITC’ 02 benchmark circuit. Experiment results show that compared with the existing schemes in which a core test set is compressed and applied independently of other cores, the proposed scheme can not only improve test data compression/decompression, but also reduce the redundant shift and capture cycles during scan testing, decreasing SoC test application time effectively.

An Infrastructural IP for Interactive MPEG-4 SoC Functional Verification

This paper introduces a specific architecture including an infrastructural IP for functional verification and diagnostics, which is suitable for functional core-based testing of an MPEG4 SoC. Our advanced MPEG4 SoC results in a high complexity SoC with limited physical access to many different functional cores. The proposed test method provides direct monitoring and control for each core, which enables core verification at actual speed. It significantly decreases the verification time due to the large number of required test vectors in typical MPEG4 verification. Furthermore, it also makes the system scalable for functional core expansion due to upgrading of standards. The proposed infrastructural IP is also linked to PC-based interactive tools to simplify the verification of individual and integrated cores. It also provides detailed diagnostic data that enables simple system debugging. The debugging tools also feature test-pattern generation and simulation of expected values. Actual system implementation has shown full functionality of our proposed method.

Test Data Volume Comparison: Monolithic vs. Modular SoC Testing

Containing production cost is a major concern for today's complex SoCs. One of the key contributors to production cost is test time and test data volume, for which numerous compression techniques were proposed. This article introduces a different approach to test data volume reduction, namely the use of modular test based on IEEE Std 1500 architecture, and it provides modeling, analysis, and quantification to support the proposed approach.

Testing of SoCs with Hierarchical Cores: Common Fallacies, Test Access Optimization, and Test Scheduling

Many system-on-chip (SOC) integrated circuits today contain hierarchical (parent) cores that have multiple levels of design hierarchy involving Hierarchy imposes a number of constraints on the manner in which tests must be applied to parent cores and their child cores. However, most prior work on wrapper design, test access mechanism (TAM) optimization, and test scheduling are hierarchy-oblivious, i.e., these techniques treat all cores in an SOC at the same level of hierarchy. We first show that wrappers, TAMs and test schedules designed for non-hierarchical SOCs are not valid for SOCs with hierarchical cores. We next present two approaches for the efficient testing of SOC with hierarchical cores. In the first approach, an existing wrapper design is modified such that that all constraints imposed by the hierarchy are satisfied and full flexibility is provided for TAM optimization and test scheduling. The second approach is based on a hierarchy-aware wrapper architecture for parent cores that operates in two disjoint modes for the testing of parent and child cores. We show how an existing test-architecture design algorithm can be adapted for use with these two methods. Results for the ITC'02 SOC Test Benchmarks show that the first approach offers lower test application times while the second approach requires less area overhead.

Test-Length and TAM Optimization for Wafer-Level Reduced Pin-Count Testing of Core-Based SoCs

Wafer-level testing (wafer sort) is used in the semiconductor industry to reduce packaging and test cost. However, a large number of wafer-probe contacts lead to higher yield loss. Therefore, it is desirable that the number of chip pins contacted by tester channels during wafer sort be kept small to reduce the yield loss resulting from improper contacts. Since test time and the number of contacted chip pins are major practical constraints for wafer sort, not all scan-based digital tests can be applied to the die under test. We propose an optimization framework based on mathematical programming (integer linear programming, nonlinear programming, and geometric programming) and fast heuristic methods. This framework addresses test-access mechanism (TAM) optimization and test-length selection for wafer-level testing of core-based digital system-on-chips (SoCs). The objective here is to design a TAM architecture and determine test lengths for the embedded cores such that the overall SoC defect-screening probability at wafer sort is maximized. Defect probabilities for the embedded cores, obtained using statistical yield modeling, are incorporated in the optimization framework. Simulation results are presented for five of the ITC'02 SoC Test benchmarks.

An Infrastructural IP for Interactive MPEG-4 SoC Functional Verification

This paper introduces a specific architecture including an infrastructural IP for functional verification and diagnostics, which is suitable for functional core-based testing of an MPEG4 SoC. Our advanced MPEG4 SoC results in a high complexity SoC with limited physical access to many different functional cores. The proposed test method provides direct monitoring and control for each core, which enables core verification at actual speed. It significantly decreases the verification time due to the large number of required test vectors in typical MPEG4 verification. Furthermore, it also makes the system scalable for functional core expansion due to upgrading of standards. The proposed infrastructural IP is also linked to PC-based interactive tools to simplify the verification of individual and integrated cores. It also provides detailed diagnostic data that enables simple system debugging. The debugging tools also feature test-pattern generation and simulation of expected values. Actual system implementation has shown full functionality of our proposed method.

IEEE Std 1500 enables core-based SoC test development

IEEE Std 1500 enables core-based SoC test development

IEEE Std 1500 Enables Modular SoC Testing

IEEE Std 1500 enables modular SoC testing, not only for core-based testing, but also for divide-and-conquer test generation and test reuse. This article provides a brief tutorial on the standard and illustrates its usage through two application case studies.

An Effective Power Reduction Methodology for Deterministic BIST Using Auxiliary LFSR

Power consumption for test vectors is a major problem in SOC testing using BIST. A new low power testing methodology to reduce the peak power and average power associated with scan-based designs in the deterministic BIST is proposed. This new method utilizes an auxiliary LFSR to reduce the amount of the switching activity in the deterministic BIST. Excessive transition detector (ETD) monitors the number of transitions in the test pattern generated by LFSR and the low transition pattern is generated for excessive transition region using an auxiliary LFSR. Experimental results for the larger ISCAS 89 benchmarks show that reduced peak power and average power can indeed be achieved with little hardware overhead compared to previous schemes.

MTNet: Design of a Wireless Test Framework for Heterogeneous Nanometer Systems-on-Chip

The rapid migration to nanometer design processes has brought an unprecedented level of integration by allowing system designers to pack a wide variety of functionalities on-chip, namely, systems-on-a-chip (SoCs). In the meantime, electronic testing becomes an enabling technology for this SoC paradigm, since the integration of various core tests is a big challenge, and has revealed a widening gap between design and manufacturing. In particular, the increasing complexity and density of nanometer SoCs have led to the problem of visibility and accessibility in testing. In this paper, we propose an integrated wireless test framework to resolve the acerbated core accessibility problem and to eliminate the incompatibility between the existing SoC test strategies and the next generation billion-transistor SoC specification. Under such a test strategy, the intra-chip wireless links form the wireless test access mechanism (TAM) to transport test data chip-wide. We present a self-configurable multi-hop wireless test micronetwork, dubbed MTNet, with simple and efficient data transmission protocols, and develop a system level design-for-testability structure. Consequently, we propose a geographic routing algorithm to find the test access paths for the deeply embedded cores and a path driven test scheduling algorithm to design and integrate the MTNet-based SoC test access architecture. Extensive simulation study show the feasibility and applicability of MTNet.

Cycle-Accurate Test Power Modeling and Its Application to SoC Test Architecture Design and Scheduling

Concurrent testing of the cores in a core-based system- on-chip reduces the test application time but increases the test power consumption. Power models, test architecture design, and scheduling algorithms have been proposed to schedule the tests as concurrently as possible while respecting the power budget. The commonly used global peak power model, with a single value capturing the power dissipated by a core when tested, is simple for a scheduling algorithm to handle but is pessimistic. In this paper, we propose a cycle-accurate power model with a power value per clock cycle and a corresponding test architecture design and scheduling algorithm. The power model takes into account the switching activity in the scan chains caused by both the test stimuli and the expected test responses during scan-in, launch-and-capture, and scan-out. Furthermore, we allow a unique power model per wrapper-chain configuration as the activity in a core will be different depending on the number of wrapper chains at a core. Through circuit simulations on ISCAS'89 benchmarks, we demonstrate a high correlation between the real test power dissipation and our cycle-accurate test power model. Extensive experiments on ITC'02 benchmarks and an industrial design show that the testing time can be reduced substantially by using the proposed cycle-accurate test power model.

Effective Domain Partitioning for Multi-Clock Domain IP Core Wrapper Design under Power Constraints

The rapid advancement of VLSI technology has made it possible for chip designers and manufacturers to embed the components of a whole system onto a single chip, called System-on-Chip or SoC. SoCs make use of pre-designed modules, called IP-cores, which provide faster design time and quicker time-to-market. Furthermore, SoCs that operate at multiple clock domains and very low power requirements are being utilized in the latest communications, networking and signal processing devices. As a result, the testing of SoCs and multi-clock domain embedded cores under power constraints has been rapidly gaining importance. In this research, a novel method for designing power-aware test wrappers for embedded cores with multiple clock domains is presented. By effectively partitioning the various clock domains, we are able to increase the solution space of possible test schedules for the core. Since previous methods were limited to concurrently testing all the clock domains, we effectively remove this limitation by making use of bandwidth conversion, multiple shift frequencies and properly gating the clock signals to control the shift activity of various core logic elements. The combination of the above techniques gains us greater flexibility when determining an optimal test schedule under very tight power constraints. Furthermore, since it is computationally intensive to search the entire expanded solution space for the possible test schedules, we propose a heuristic 3-D bin packing algorithm to determine the optimal wrapper architecture and test schedule while minimizing the test time under power and bandwidth constraints.

An Architecture of Embedded Decompressor with Reconfigurability for Test Compression

Test compression / decompression scheme for reducing the test application time and memory requirement of an LSI tester has been proposed. In the scheme, the employed coding algorithms are tailored to a given test data, so that the tailored coding algorithm can highly compress the test data. However, these methods have some drawbacks, e.g., the coding algorithm is ineffective in extra test data except for the given test data. In this paper, we introduce an embedded decompressor that is reconfigurable according to coding algorithms and given test data. Its reconfigurability can overcome the drawbacks of conventional decompressors with keeping high compression ratio. Moreover, we propose an architecture of reconfigurable decompressors for four variable-length codings. In the proposed architecture, the common functions for four codings are implemented as fixed (or non-reconfigurable) components so as to reduce the configuration data, which is stored on an ATE and sent to a CUT. Experimental results show that (1) the configuration data size becomes reasonably small by reducing the configuration part of the decompressor, (2) the reconfigurable decompressor is effective for SoC testing in respect of the test data size, and (3) it can achieve an optimal compression of test data by Huffman coding.

NoC-Based SoC Test Scheduling Using Ant Colony Optimization

In this paper, we propose a novel ant colony optimization (ACO)-based test scheduling method for testing network-on-chip (NoC)-based systems-on-chip (SoCs), on the assumption that the test platform, including specific methods and configurations such as test packet routing, generation, and absorption, is installed. The ACO metaheuristic model, inspired by the ant’s foraging behavior, can autonomously find better results by exploring more solution space. The proposed method efficiently combines the rectangle packing method with ACO and improves the scheduling results by dynamically choosing the test-access-mechanism widths for cores and changing the testing orders. The power dissipation and variable test clock mode are also considered. Experimental results using ITC’02 benchmark circuits show that the proposed algorithm can efficiently reduce overall test time. Moreover, the computation time of the algorithm is less than a few seconds in most cases.

Thermal-Aware SoC Test Scheduling with Test Set Partitioning and Interleaving

High temperature has become a major problem for system-on-chip testing. In order to reduce the test application time while keeping the temperatures of the cores under test within safe ranges, a thermal-aware test scheduling technique is required. This paper presents an approach to minimize the test application time and, at the same time, prevent the temperatures of cores under test going beyond given limits. We employ test set partitioning to divide test sets into shorter test sequences, and add cooling periods between test sequences so that overheating can be avoided. Moreover, test sequences from different test sets are interleaved, such that the cooling periods and the bandwidth of the test bus can be utilized for test data transportation, and hence the test application time can be reduced. The test scheduling problem is formulated as a combinatorial optimization problem, and we use the constraint logic programming (CLP) to build the optimization model and find the optimal solution. As the optimization time of the CLP-based approach increases exponentially with the problem size, we also propose a heuristic which generates longer test schedules but requires substantially shorter optimization time. Experimental results have shown the efficiency of the proposed approach.

A New Scan Architecture for Both Low Power Testing and Test Volume Compression Under SOC Test Environment

A new scan architecture for both low power testing and test volume compression is proposed. For low power test requirements, only a subset of scan cells is loaded with test stimulus and captured with test responses by freezing the remaining scan cells according to the distribution of unspecified bits in the test cubes. In order to optimize the proposed process, a novel graph-based heuristic is proposed to partition the scan chains into several segments. For test volume reduction, a new LFSR reseeding based test compression scheme is proposed by reducing the maximum number of specified bits in the test cube set, s max, virtually. The performance of a conventional LFSR reseeding scheme highly depends on s max. In this paper, by using different clock phases between an LFSR and scan chains, and grouping the scan cells by a graph-based grouping heuristic, s max could be virtually reduced. In addition, the reduced scan rippling in the proposed test compression scheme can contribute to reduce the test power consumption, while the reuse of some test results as the subsequent test stimulus in the low power testing scheme can reduce the test volume size. Experimental results on the largest ISCAS89 benchmark circuits show that the proposed technique can significantly reduce both the average switching activity and the peak switching activity, and can aggressively reduce the volume of the test data, with little area overhead, compared to the previous methods.

Wafer-Level Modular Testing of Core-Based SoCs

Product cost is a major driver in the consumer electronics market, which is characterized by low profit margins and the use of core-based system-on-chip (SoC) designs. Packaging has been recognized as a significant contributor to the product cost for such SoCs. To reduce packaging cost and the test cost for packaged chips, wafer-level testing (wafer sort) is used in the semiconductor industry to screen defective dies. However, since test time is a major practical constraint for wafer sort, even more so than for package test, not all the scan-based digital tests can be applied to the die under test. We present an optimal test-length selection technique for wafer-level testing of core-based SoCs. This technique, which is based on a combination of statistical yield modeling and integer linear programming, allows us to determine the number of patterns to use for each embedded core during wafer sort such that the probability of screening defective dies is maximized for a given upper limit on the SoC test time. We also present a heuristic method to handle large next-generation SoC designs. Simulation results are presented for five of the ITC'02 SoC Test benchmarks, and the optimal test-length selection approach is compared with the heuristic method.

Wafer-Level Modular Testing of Core-Based SoCs

Product cost is a major driver in the consumer electronics market, which is characterized by low profit margins and the use of core-based system-on-chip (SoC) designs. Packaging has been recognized as a significant contributor to the product cost for such SoCs. To reduce packaging cost and the test cost for packaged chips, wafer-level testing (wafer sort) is used in the semiconductor industry to screen defective dies. However, since test time is a major practical constraint for wafer sort, even more so than for package test, not all the scan-based digital tests can be applied to the die under test. We present an optimal test-length selection technique for wafer-level testing of core-based SoCs. This technique, which is based on a combination of statistical yield modeling and integer linear programming, allows us to determine the number of patterns to use for each embedded core during wafer sort such that the probability of screening defective dies is maximized for a given upper limit on the SoC test time. We also present a heuristic method to handle large next-generation SoC designs. Simulation results are presented for five of the ITC'02 SoC Test benchmarks, and the optimal test-length selection approach is compared with the heuristic method.

Test access to deeply embedded analog terminals within an A/MS SoC

This paper presents a standard scalable and reconfigurable design for testability (SR DfT) in order to increase accessibility to deeply embedded A/MS cores and to limit application of costly off-chip mixed-signal testers. SR DfT is an oscillation-based wrapper compatible with digital embedded core-based SoC test methodologies. The impact of the optimized oscillation-based wrapper design on MS SoC testing is evaluated in two directions: area and test time. Experimental results are presented for several SoCs from the ITC’02 test benchmarks with inclusion of eight analog filters.

Test Generation with Unspecified Variable Assignments

ATPG for very large scale integrated circuit designs is an important problem in industry. With the advent of SOC designs, testing and verification of the core-based designs become a challenging problem. This paper presents an algebraic test generation algorithm with unspecified variable assignments. Given a stuck at fault of the circuit with unspecified signals, the proposed algorithm uses a new encoding scheme for unspecified variable assignments, and solves the Boolean satisfiability formula representing the Boolean difference to obtain a test pattern. Experimental results demonstrate the efficiency and feasibility of the proposed algorithm.