Sn-Zn Alloys Research Articles

Zinc-tin binary alloy interphase for zinc metal batteries

Aqueous zinc ion batteries are rapidly developing as the most propitious energy storage system due to their high security, high specific capacity and low cost, etc. However, zinc anodes suffered from dendrite growth and hydrogen evolution reactions during cycling, so it is of utmost importance to upgrade zinc anode properties. In this study, the homogeneous layer of ZnSn alloy interphase was formed by introducing metallic tin to the anode surface using an ion sputtering technique. ZnSn alloy can reduce the hydrogen evolution over-potential of anode and the corrosion current, inhibiting the occurrence of hydrogen evolution and corrosion reaction. Moreover, the ZnSn alloy anode can provide uniform nucleation sites and uniformize the electric field on the anode surface, promote the uniform deposition of Zn2+, thus inhibiting the formation of zinc dendrites. Notably, compared to the Zn foil//Zn foil cell (400 h), the ZnSn alloy symmetric cell showed excellent cycling performance by cycling for 1000 h at 0.5 mA cm−2. Furthermore, even at current density of 1 A/g, the capacity retention of the ZnSn alloy//MnO2 full cell was up to 89.5 % compared to only 32.3 % for Zn foil//MnO2 cell. The preparation of this ZnSn alloy anode may provide new ideas for future alloying strategies.

Effect of combined addition of Zr and Mg on the microstructure and properties of a Cu–Cr–Sn–Zn alloy for etching lead frame

The effects on microstructure and properties of Cu–Cr–Sn–Zn with combined addition of Zr and Mg elements and their evolutions in the process of solid solution and thermomechanical treatment for etching high pin lead frames were studied. The microstructure was analyzed by OM, SEM, TEM, and EBSD. The results show that Cu–Cr–Sn–Zn and Cu–Cr–Sn–Zn–Zr–Mg alloys have the best performance after primary aging at 440 °C for 4 h and secondary aging at 400 °C for 4 h. The hardness and conductivity of the two alloys are 154 HV&78.3%IACS and 171 HV&77.8%IACS, respectively. Cu–Cr–Sn–Zn–Zr–Mg alloy final products shown better comprehensive performance, with conductivity, tensile strength, and hardness of 81.4%IACS, 580 MPa, and 175 HV respectively. The addition of Zr and Mg elements slows down the precipitation process of Cu–Cr–Sn–Zn alloy, refines the Cr phases, and inhibits the coarsening of Cr phases. Nano Cr clusters and coherent fcc Cr phases were observed during the aging process at 440 °C for 4 h and 400 °C for 4 h, which is difficult to observe in Cu–Cr–Sn–Zn alloy due to the precipitation and coarsening of Cr phases in a rapidly way. The surface roughness of Cu–Cr–Sn–Zn–Zr–Mg alloy without coarsened Cr phases is lower with Sa = 0.2681 μm.

Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering

Purpose This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied in consumer electronics due to their low melting point, high strength, and low cost. In the electronic assembly industry, Sn–Zn eutectic alloys have great potential for use. Design/methodology/approach This paper explored developing and implementing process parameters for low-temperature wave soldering of Sn–Zn alloys (SN-9ZN-2.5BI-1.5 In). A two-factor, three-level design of the experiments experiment was designed to simulate various conditions parameters encountered in Sn–Zn soldering, developed the nitrogen protection device of waving soldering and proposed the optimal process parameters to realize mass production of low-temperature wave soldering on Sn–Zn alloys. Findings The Sn-9Zn-2.5 Bi-1.5In alloy can overcome the Zn oxidation problem, achieve low-temperature wave soldering and meet IPC standards, but requires the development of nitrogen protection devices and the optimization of a series of process parameters. The design experiment reveals that preheating temperature, soldering temperature and flux affect failure phenomena. Finally, combined with the process test results, an effective method to support mass production. Research limitations/implications In term of overcome Zn’s oxidation characteristics, anti-oxidation wave welding device needs to be studied. Various process parameters need to be developed to achieve a welding process with lower temperature than that of lead solder(Sn–Pb) and lead-free SAC(Sn-0.3Ag-0.7Cu). The process window of Sn–Zn series alloy (Sn-9Zn-2.5 Bi-1.5In alloy) is narrow. A more stringent quality control chart is required to make mass production. Practical implications In this research, the soldering temperature of Sn-9Zn-2.5 Bi-1.5In is 5 °C and 25 °C lower than Sn–Pb and Sn-0.3Ag-0.7Cu(SAC0307). To the best of the authors’ knowledge, this work was the first time to apply Sn–Zn solder alloy under actual production conditions on wave soldering, which was of great significance for the study of wave soldering of the same kind of solder alloy. Social implications Low-temperature wave soldering can supported green manufacturing widely, offering a new path to achieve carbon emissions for many factories and also combat to international climate change. Originality/value There are many research papers on Sn–Zn alloys, but methods of achieving low-temperature wave soldering to meet IPC standards are infrequent. Especially the process control method that can be mass-produced is more challenging. In addition, the metal storage is very high and the cost is relatively low, which is of great help to provide enterprise competitiveness and can also support the development of green manufacturing, which has a good role in promoting the broader development of the Sn–Zn series.

Reusable multifunctional interlayer for dendrite-free and ultrastable zinc anodes via regulating zinc-ion transport and inhibiting hydrogen evolution

The practical application of zinc anodes in aqueous zinc-ion batteries (ZIBs) is hindered due to uncontrollable dendritic Zn deposition and side reactions. Herein, a reusable interlayer constructed from Sn nanoparticles-modified polyhydroxy semi-carbonized bacterial cellulose (Sn@PHCBC) with three-dimensional interconnected network structure is proposed to achieve sustainable and smooth regulation of zinc anode. The suppression of dendrites is primarily attributed to the uniform Zn ions flux constructed by reversible Sn-Zn alloy nanoparticles channel, as well as the targeted transport and rapid desolvation of hydrated zinc ions through hydroxyl groups of PHCBC. Additionally, the abundant high overpotential Sn nanoparticles anchored in Sn@PHCBC interlayer effectively inhibit the hydrogen evolution reaction and minimize the formation of byproducts. As a result, the Zn||Zn symmetrical cell assembled with Sn@PHCBC interlayer demonstrates highly reversible electroplating/stripping behavior with an extended lifespan of 800 h at high current densities of 10 mA cm−2 and 10 mAh cm−2. Besides, after 1000 cycles of MnO2||Sn@PHCBC//Zn full cell, the Sn@PHCBC interlayer can still be reused with nearly 100 % coulombic efficiency after simple treatment. The rational design in this work provides a feasible solution for high-performance ZIBs and promote the development of advanced energy storage devices reutilization.

Constructing zinc-tin alloy interface for highly stable alkaline zinc anode

Aqueous alkaline zinc batteries have received widespread attention owing to its higher electrode potential and faster reaction kinetics compared to in mild aqueous electrolyte. However, Zn metal anode in alkaline electrolyte usually suffers more severe corrosion, passivation, and hydrogen evolution reaction. Herein, an interface chemical regulation strategy employs to in-situ construct a Zn-Sn alloy layer during cycling. The K2[Sn(OH)6] has been introduced into the electrolyte as the deposition overpotential of Zn and Sn in alkaline electrolyte is approximate leading to their simultaneously plating. The Zn-Sn alloy layer not only prevents Zn anode corrosion and suppresses the dendrite growth but also promotes the reaction kinetics. Therefore, the Zn||Zn cell exhibits a long life of 400 h in alkaline electrolyte about 20 times of that in without K2[Sn(OH)6] electrolyte. Moreover, the N-NCP@PQx||Zn full cell displays a superior cycle performance of 4000 cycles with 93% capacity retention at 2 A/g.

High-temperature growth of ZnSnN2 layer via radiofrequency magnetron sputter epitaxy

ZnSnN2 layers were grown directly on Al2O3 (0001) substrates via RF magnetron sputter epitaxy at various substrate temperatures using N2 gas and a ZnSn alloy target. The crystalline quality and surface morphology of the ZnSnN2 layers were examined. X-ray diffraction patterns indicated that ZnSnN2 layers grown at substrate temperatures of 600 °C and 700 °C had wurtzite-type structures. The gross full width at half maximum (FWHM) value of the X-ray rocking curve (XRC) for the (0002) plane of the ZnSnN2 layer grown at 700 °C was 324 arcsec. The XRC for the (0002) plane contained two components, and the FWHM values of these components were 206 and 1520 arcsec for the highly c-axis-oriented columnar domains and disordered structure inside the ZnSnN2 layer, respectively. Metallic Sn was detected in a ZnSnN2 layer grown at 800 °C.

Potential controlled electrochemical coating and characterization of nanocrystalline Sn-Zn based thin films

Sn-Zn thin films are commonly used in many areas of the industry, and the facile production of these layers is vital. This study aims to produce Sn-Zn layers via potentially controlled electrochemically deposited coatings. The potentially controlled mode was used to eliminate the extensive hydrogen evolution reaction during the electrochemical processes. The electrochemical reduction and oxidation reactions were first investigated with cyclic voltammetry to determine the applied potential sets. Later, cathodic pulse potential electrodeposition of the layers was performed. The characterization of the coated Sn-Zn thin films was performed with an X-ray diffraction device (XRD), scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), four-point probe, potentiodynamic polarization measurements, and electrochemical impedance spectrometry. As the cathodic pulse potential value increased, the ratio of Zn in the Sn-Zn alloy increased, and the microstructure of the layers was also affected. Electrochemical studies showed that the corrosion resistance of the Sn-Zn thin films increased with the increasing Zn amount in the coating.

Soft nanocomposites of lead bromide perovskite and polyurethane prepared via coordination chemistry for highly flexible, stable, and quaternary metal alloy-printed light emitting diodes

Highly flexible and luminescent MAPbBr3/PU nanocomposites are synthesized via metal-amide coordination. In–Ga–Zn–Sn alloy cathode-printed PeLEDs incorporating the nanocomposites exhibit an impressive maximum luminance of 1458.6 Cd m−2 at r = 7 mm.

Enhancing the electrochemical performance of Sn-Zn alloy anode foil for lithium-ion batteries through microstructure design via accumulative roll bonding technique

In this study, we introduce a novel method for designing microstructures of Sn-45Zn alloy foils utilizing the accumulative roll bonding (ARB) technique, which is one of severe plastic deformation techniques that have been used for refining the microstructures of bulk metals. The electrochemical properties of Sn-Zn foil anodes with various microstructures achieved through the ARB method followed by annealing are investigated in lithium-ion batteries. The degree and characteristics of microstructural damage during electrochemical cyclic tests are also examined in detail to provide insights into the microstructural parameters that critically influence the capacity and cyclic behavior of the Sn-Zn alloy foil anode. Our findings suggest that the ARB-processed Sn-Zn alloy foil, characterized by nearly ultrafine grains composed of Sn and Zn phases with the Zn phase forming a continuous network, exhibits superior battery capacity and cycle life compared to the sample processed using the conventional rolling method. This superiority can be attributed to its unique microstructure obtained through ARB, which reduces pore density, suppresses pore interlinkage, decreases charge transport resistance and nucleation overpotential, and enhances Li-ion diffusivity in the electrode.

Experimental determination and high-throughput calculation of the interdiffusion coefficient matrix and atomic mobility in Ag-rich fcc Ag–Sn–Zn alloys

In this paper, 10 groups of ternary Ag–Sn–Zn diffusion couples were prepared under 873, 973 and 1073 K within the fcc single-phase region. The element distribution across the diffusional interface was measured by EPMA, and a high-throughput determination of atomic mobilities in Ag-rich fcc Ag–Sn–Zn alloys was performed by using HitDIC (High-Throughput Determination of Interdiffusion Coefficients, https://hitdic.com/) software in the framework of the numerical inverse method. A self-consistent set of atomic mobility parameters was obtained. Reliability of the evaluated atomic mobility parameters were further verified by reasonably reproducing the experimental composition profiles. Insight into the composition- and temperature-dependence of various diffusion properties in fcc Ag–Sn–Zn alloy were subsequently retrieved and discussed. Furthermore, through the related Arrhenius information, the diffusion frequency factors and diffusion activity energies within the corresponding temperature and the composition range were obtained.

Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder

The effects of Ag addition on the microstructure of Sn–9Zn alloy and its corrosion behaviour in neutral and static 3.5 wt% NaCl solutions were investigated using surface characterization techniques and electrochemical techniques. The results show that in Sn–9Zn-xAg alloys, Ag reacts with Zn to form AgZn3 intermetallic compounds (IMCs), which refined the microstructure of the alloys and changed the corrosion mode of the alloy surfaces from pitting corrosion to surface corrosion. The addition of Ag effectively improved the corrosion passivation film structure and electron transfer characteristics of the alloy, increased the self-corrosion potential (Ecorr) and reduced the self-corrosion current (Icorr), thus improving the corrosion resistance of the alloy. The study explained and verified the corrosion mechanism of the alloy from both experimental and theoretical perspectives. It is concluded that Sn–9Zn-0.4Ag alloy shows relatively the best corrosion resistance.

Thermal boundary resistance and thermal rectification in VACNT arrays integrated with SnZn alloys

Thermal rectification (TR) phenomena in carbon nanotubes (CNTs) have been previously foreseen through theoretical predictions; however, its experimental realization in bulk CNT arrays remains relatively unexplored. Herein, we have synthesized vertically aligned carbon nanotube (VACNT) arrays of ∼ 4.5 mm in length on a 4-inch silicon wafer by a combined bubble-assisted chemical vapor deposition method. By integrating these VACNT arrays with SnZn alloys, we have successfully developed devices capable of functioning across a wide temperature range spanning from 200 °C to 400 °C. Notably, the thermal boundary resistances (TBR) between the VACNTs and SnZn alloy exhibit pronounced dependence on the alloy's composition, exhibiting variations ranging from 0.12 cm2KW−1 to 1.12 cm2KW−1. Of particular significance, the TBRs of Sn50Zn50/VACNT compounds in the forward direction were found to fall within the range of 0.63–0.98 cm2KW−1 in the temperature range from120 °C to 180 °C, while in the backward direction, they exhibited values in the range of 0.13–0.34 cm2KW−1. These contrasting TBR values highlight a marked thermal rectification performance with a substantial TR coefficient between 0.49 and 0.66. Our comprehensive investigation sheds valuable insights into the TR effects within VACNTs and metal/alloy interfaces, presenting a promising avenue for the development of future thermal logic circuits and thermal transistors.

Effect of Al and Bi addition on the corrosion behaviour, hardness, and melting temperature of lead-free solder alloys

Herein, the influence of alloying bismuth (Bi) and aluminum (Al) on the corrosion performance of Sn9Zn in a 3.5 % NaCl solution was examined. Electrochemical techniques were used to examine the corrosion behaviour of Sn9Zn, Sn-9Zn-0.5Bi, and Sn-9Zn-0.5Bi-0.5Al. After corrosion measurements, the alloy surfaces were studied by scanning electron microscopy (SEM) and energy dispersive X-ray diffraction (EDX). The results demonstrated that the presence of Bi increased the corrosion resistance because it formed an anodic barrier on the Sn-9Zn-0.5Bi alloy surface. The study extended to measure the Vickers hardness number of these alloys, and the results indicated a significant improvement in the hardness number of the Sn9Zn alloy by approximately 11 % with Bi and 54 % with Bi and Al. More investigations of the melting temperature behaviour of solder alloys using differential scanning calorimetry (DSC) were also carried out before corrosion measurements. The DSC results demonstrated that Sn-9Zn-0.5Bi-0.5Al had a lower melting temperature than Sn9Zn and Sn-9Zn-0.5Bi. Therefore, Al and Bi addition improved the melting temperature characteristics of the Sn9Zn solder alloy. This confirmed that the presence of Bi only enhanced the corrosion resistance, and the presence of both Bi and Al played a crucial role in the properties enhancement of the Sn9Zn alloy. Consequently, these improved characteristics and properties make the suggested compositions a significant alternative choice to SnPb alloys.

Effects of Bi and Cu addition on mechanical properties of Sn9Zn alloy and interfacial intermetallic growth with Ni substrate

Sn9ZnxBixCu (x = 0, 1.0, 2.0, 3.0 and 4.0 wt%) solder alloys were prepared by adding different contents of Bi and Cu elements, and the effects of Bi and Cu addition on the mechanical properties, wettability, and interfacial intermetallic compound (IMC) layer were researched. The addition of Bi and Cu can significantly improve the mechanical properties and creep resistance of the alloy. When the addition of Bi and Cu reaches 2 wt%, small Bi phases are dispersed in the matrix, and moderate Cu5Zn8 phases appear, which strengthens the solder matrix. The ultimate tensile strength (UTS) of the Sn9Zn2Bi2Cu alloy reaches 51.01 MPa, which is 149.32% higher than that of the Sn9Zn alloy, and the elongation reaches 26.56%. Nanoindentation results show that the holding displacement of the Sn9Zn4Bi4Cu alloy decreased by 28.48% compared with that of the Sn9Zn alloy at a loading rate of 0.1 mN/s. In addition, proper addition of Bi and Cu can improve the wettability of the solder alloy and inhibit the growth of interfacial intermetallic compounds (IMCs) between the solder and Ni substrate. When the reflow time reaches 40 min (min), the interfacial IMC thickness of the Sn9Zn2Bi2Cu/Ni solder joint is 1.93 µm, which is 46.09% smaller than that of the Sn9Zn alloy. Moreover, the shear strength of the Sn9Zn2Bi2Cu/Ni solder joint increases by 33.3%, reaching the maximum value (38.76 MPa). When the Bi and Cu addition reaches 2 wt%, the wetting area reaches a larger value (13.525 mm2), which is 28.35% higher than that of Sn9Zn alloy.

New biodegradable Mg–Zn–Ca bulk metallic glass composite with large plasticity reinforced by SnZn alloy

Mg–Zn–Ca bulk metallic glass exhibits remarkable biocompatibility and biodegradability in human environments, making it a promising material for biodegradable implants. However, the material's brittleness at room temperature limits its applicability. To overcome this limitation, we introduced a non-toxic, highly plastic SnZn alloy as a second phase into Mg–Zn–Ca metallic glass. Our investigation focused on how varying SnZn alloy content affected the composites' microstructure and mechanical properties. The resulting composites exhibited a vein-like pattern, and the SnZn alloy contributed to their plasticity while Mg–Zn–Ca metallic glass provided strength. Our composite achieved a yield strength of 225 MPa with a 17% strain. Furthermore, when the SnZn alloy content exceeded 60%, the composites remained unbroken during compression testing. These results indicate that our Mg–Zn–Ca/SnZn bulk metallic glass composites exhibit excellent mechanical properties and hold promise as an implant material. This study provides a new direction for the development of biodegradable implant materials.

Mechanical behavior and fractography analysis of Zn-Sn alloy matrix composites reinforced with nano B4C particles

Mechanical behavior and fractography analysis of Zn-Sn alloy matrix composites reinforced with nano B4C particles

Effect of minor Ca addition on microstructure and mechanical properties of a low-alloyed Mg–Al–Zn–Sn alloy

Due to the lack of secondary phases, low-alloyed Mg–Al series alloys usually exhibit low strength. In this work, by the addition of Ca element, a microstructure consists of a large fraction of fine recrystallized grains, profuse low angle boundaries and dense nano-sized CaMgSn particles has been achieved in a low-alloyed Mg-1.1Al-1.1Zn-0.2Sn-0.3Ca (wt%) alloy via sub-solidification followed by hot rolling and annealing. The addition of Ca introduces a large number of nano-sized CaMgSn particles, which can pin boundaries to inhibit recrystallization and grain growth during rolling and annealing. The annealed dilute Mg-1.1Al-1.1Zn-0.2Sn-0.3Ca alloy exhibits a high strength-ductility synergy with a yield strength (YS) of ∼249 ± 3 MPa, an ultimate strength (UTS) of ∼308 ± 4 MPa and a total elongation of ∼14 ± 1.1%. The fine recrystallized grains and profuse low angle boundaries account mainly for the high YS, which contribute 65% to the total YS. Meanwhile, the precipitation strengthening contributes ∼57 MPa to the total YS. The moderate elongation can be attributed to the activation of <c + a> dislocations due to the fine grain sizes (∼2 μm), as well as Ca and Sn solute atoms in the α-Mg matrix. The present work provides an effective way to fabricate dilute Mg alloys with enhanced mechanical properties at room temperature by the combination of SRS, hot rolling and annealing.

Microstructure and Corrosion Behavior of Sn-Zn Alloys.

In the present work, the microstructure, phase constitution, and corrosion behavior of binary Sn–xZn alloys (x = 5, 9 and 15 wt.%) were investigated. The alloys were prepared by induction melting of Sn and Zn lumps in argon. After melting, the alloys were solidified to form cast cylinders. The Sn–9Zn alloy had a eutectic microstructure. The Sn–5Zn and Sn–15Zn alloys were composed of dendritic (Sn) or (Zn) and eutectic. The corrosion behavior of the Sn–Zn alloys was studied in aqueous HCl (1 wt.%) and NaCl (3.5 wt.%) solutions at room temperature. Corrosion potentials and corrosion rates in HCl were significantly higher compared to NaCl. The corrosion of the binary Sn–Zn alloys was found to take place by a galvanic mechanism. The chemical composition of the corrosion products formed on the Sn–Zn alloys changed with the Zn weight fraction. Alloys with a higher concentration of Zn (Sn–9Zn, Sn–15Zn) formed corrosion products rich in Zn. The Zn-rich corrosion products were prone to spallation. The corrosion rate in the HCl solution decreased with decreasing weight fraction of Zn. The Sn–5Zn alloy had the lowest corrosion rate. The corrosion resistance in HCl could be considerably improved by reducing the proportion of zinc in Sn–Zn alloys.

Investigation of thermal and mechanical properties of Sn-Zn and Sn-Zn- Bi near-eutectic solder alloys

In the present work, three near-eutectic lead-free solder melts of Sn-8wt.%Zn; Sn-8wt.%Zn-2wt.%Bi and Sn-8wt.%Zn-4wt.%Bi have swiftly solidified by means of the melt-spinning technique for intermediate –step soldering. The thermal and various mechanical properties of the formed melt-spun ribbons were investigated by dynamic resonance technique, Vickers micro-hardness test under annealing temperatures in the range from 348 K to 448 K. Thermal analysis using differential thermal analysis (DTA) technique revealed a decrease in melting point and solidus point with %Bi. Wettability property was determined by evaluating the contact angle on a different substrate and found to be in the range 31° to 43° on Cu or CuZn30 substrates and in the range from 110° to 115° on Al substrate. The microhardness tests as a function of temperature were performed to determine the stiffness of Sn-Zn solder alloys. Isothermal creep curves for the synthesized samples alloys were determined and plotted under constant applied stresses at a constant temperature of 463 K. Microstructure of the as-cast alloys both, at room temperature and annealed at 348 K were recorded. The creep test on the structure change and properties of Sn–Zn alloys were reported with the effect of the cold work deformation. The Sn-8wt.%Zn-4wt.%Bi is a candidate material for solder which is free of Pb and widely used for packaging of micromechanical systems as a hermetic sealing step.

Formation of Cu2ZnSnS4 thin films and optimization of the optical bandgap using the Taguchi approach

Cu2ZnSnS4 thin films were synthesized by deposition of Cu–Zn–Sn alloy films on soda-lime glass using flash evaporation PVD of pre-alloyed powders followed by sulfurization anneal. The influence of process parameters on the structure, morphology and optical response of as-deposited and annealed films was investigated by X-ray diffractometry, Raman spectroscopy, scanning electron microscopy, and UV–visible spectroscopy. Since the preparation process, which influences the structure and chemical composition of the films, determines the optical bandgap of CZTS absorber layers, the Taguchi method was utilized to better predict the effect of process variables to achieve the optimal bandgap. According to the outcomes, the significant parameters, in sequence, were sulfurization time, the composition of PVD source powder, sulfurization temperature, and sulfur content. The prepared sample according to the optimal condition suggested by the Taguchi method showed an optical bandgap of 1.56 eV.