Sn-Ag-Cu Research Articles

High performance Cu/SAC305 solder low temperature bonding using Ti3C2 MXene interlayer

Ti3C2 MXene (MX) was introduced as the interlayer between the Cu film and Sn-3.0Ag-0.5Cu (SAC) solder to inhibit the overgrowth of intermetallic compounds (IMCs) at the bonding interface of Cu and SAC solder. The Cu-MX-SAC bonding was fabricated at 160 °C for 6 mins under a load of 10 MPa. Compared with Cu-SAC bonding, after 72 h aging, the average thickness of the IMCs layer in the Cu-MX-SAC structure is about 47 % thinner. As aging time increases, the diffusion rate of Cu atoms is limited due to the introduction of MXene interlayer, and the growth of IMCs in the Cu-MX-SAC structure is controlled by volume diffusion. For the Cu-MX-SAC solder bonding, after prolonged aging, the shear strength increases, and contact resistance at the bonding interface is almost no change compared with Cu-SAC solder bonding.

Accelerated discovery of lead-free solder alloys with enhanced creep resistance via complementary machine learning strategy

Minor alloying is an effective method to improve the performance of lead-free solder alloys. In this study, we propose a complementary Machine Learning (ML) strategy for minor alloying to design solder alloys with enhanced creep resistance. Two ML models, leveraging compositional and knowledge-aware features, respectively, were constructed to predict the creep stress exponent of Sn–Ag–Cu (SAC)-based solder alloys. Five new solder alloys were designed and experimentally evaluated by screening the virtual sample space consisting of the critical elements, including Bi, In, and Ni, affecting the creep resistance of SAC solder alloys with the ML model. The creep resistance of the designed alloys was characterized using nanoindentation tests. Notably, the creep stress exponent of SAC387-3 wt % Bi-0.4 wt% Ni was determined to be 12.82 at room temperature, indicating a significant 33.9% decrease in creep strain rate compared to the SAC387 alloy. This study demonstrates the potential of the ML approach to design solder alloys with enhanced creep resistance.

Reliability Risk Mitigation in Advanced Packages by Aging-Induced Precipitation of Bi in Water-Quenched Sn-Ag-Cu-Bi Solder.

Bi-doped Sn-Ag-Cu (SAC) microelectronic solder is gaining attention for its utility as a material for solder joints that connect substrates to printed circuit boards (PCB) in future advanced packages, as Bi-doped SAC is reported to have a lower melting temperature, higher strength, higher wettability on conducting pads, and lower intermetallic compound (IMC) formation at the solder-pad interface. As solder joints are subjected to aging during their service life, an investigation of aging-induced changes in the microstructure and mechanical properties of the solder alloy is needed before its wider acceptance in advanced packages. This study focuses on the effects of 1 to 3 wt.% Bi doping in an Sn-3.0Ag-0.5Cu (SAC305) solder alloy on aging-induced changes in hardness and creep resistance for samples prepared by high cooling rates (>5 °C/s). The specimens were aged at ambient and elevated temperatures for up to 90 days and subjected to quasistatic nanoindentation to determine hardness and nanoscale dynamic nanoindentation to determine creep behavior. The microstructural evolution was investigated with a scanning electron microscope in tandem with energy-dispersive spectroscopy to correlate with aging-induced property changes. The hardness and creep strength of the samples were found to increase as the Bi content increased. Moreover, the hardness and creep strength of the 0-1 wt.% Bi-doped SAC305 was significantly reduced with aging, while that of the 2-3 wt.% Bi-doped SAC305 increased with aging. The changes in these properties with aging were correlated to the interplay of multiple hardening and softening mechanisms. In particular, for 2-3 wt.% Bi, the enhanced performance was attributed to the potential formation of additional Ag3Sn IMCs with aging due to non-equilibrium solidification and the more uniform distribution of Bi precipitates. The observations that 2-3 wt.% Bi enhances the hardness and creep strength of the SAC305 alloy with isothermal aging to mitigate reliability risks is relevant for solder samples prepared using high cooling rates.

Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques

Due to the development of advanced packaging technology such as Package on Package (POP), traditional Sn-Ag-Cu (SAC) solder can no longer meet the demand. Utilizing the differences in temperature and performance of various solder materials to create composite structures for soldering is an effective method to achieve PoP interconnection. In this research, the microstructure of the interface between SAC305 and liquid in the incomplete dissolved solider ball was observed, and the grain orientation after solidification was analyzed. In addition, the effect of SnBi ratios on the microstructure and mechanical properties of SAC305-SnBi composite solder balls, and the fracture mechanism was analyzed according to the fracture morphology. The results show that according to Electron Backscatter Diffraction (EBSD) analysis, the grain size of Sn-Ag-Cu-Bi is small, and the orientation tends to be the same. With the rise in SnBi content, the eutectic structure in the solder ball exhibited a progressive increase and the IMC at the interface gradually changed from uneven rod-like structure to more uniform scallop-like structure. When the weight fraction of SnBi is 66.7%, the shear strength researches a maximum value of 62.2 MPa. As the SnBi content increases, there is an observable shift in the fracture location from the IMC to the solder.

A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography

This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray radiation tomography. Synchrotron X-ray tomography is increasingly utilized for characterizing the internal microstructure of materials in 3D images. A 3D model is reconstructed from a set of 2D projection images taken from different angles and angular position during the sample rotation, thus it could provide a more comprehensive description of the microstructure of an alloy compared to 2D images. In this paper, it is successfully observed and evaluated the internal microstructure of a 900 μm solder joint sample. The key principles and methods of synchrotron X-ray tomography are briefly described. Examples of quantitative and qualitative assessments on the grain refinement effect of Mg addition to SAC35 solder joint are also presented in this paper.

Influence of trace Mn doping on the high-speed shear performance of lead-free alloy/copper solder joints: Experimental and first principles investigation

This study aims to investigate the mechanical properties changes and the underlying reasons caused by Mn addition to the Cu6Sn5 intermetallic compounds (IMC). For this purpose, 0.07 wt.% Mn doped SnAgCu (SAC)305/Cu joint were prepared to observe its shear performance at a high speed of 1000 mm/s after aging at 170 °C for 750 h. The mechanical properties of Mn-doped samples exhibited a smaller decline after aging, in comparison to the undoped samples. Notably, the fracture location transitioned from the interior of the SAC joint to joint interface after doping. Nanoindentation experiments demonstrated a significant increase in the modulus and hardness of the Mn doped Cu3Sn and Cu6Sn5 phases. To gain a deeper understanding of the underlying mechanisms driving the changes in IMC properties, first principles calculations were employed. The introduction of Mn resulted in a strengthened bonding due to the hybridization of Mn and Sn atoms in the high-energy regions, leading to the formation of charge-enriched areas and improved mechanical properties of the IMC. The results obtained from both computational and experimental approaches exhibit similar trends in these changes. Moreover, the integration of computational and experimental methods provides a guidance for advancing IMC research and enhancing our understanding of their behavior.

Influence of bismuth addition on the physical and mechanical properties of low silver/lead-free Sn-Ag-Cu solder

The Sn–Ag–Cu (SAC) solders with low Ag content have been identified as promising candidates to replace the traditional Sn–Pb solder for flip-chip interconnects. This study examines the impact of incorporating Bi element on the microstructure, thermal behavior, and mechanical performance of low-silver-content Sn-1.5Ag-0.7Cu (SAC157) solder alloy. Besides using the conventional cross-sectioned microstructure image, X-ray diffraction (XRD), differential scanning calorimetry (DSC) and tensile stress- strain techniques were used to investigate the microstructure, thermal and mechanical properties after the addition of Bi, respectively. The results demonstrate that adding of Bi could refine the microstructure, optimize the thermal properties, and improve the tensile strength. Meanwhile, the ductility of the solder alloys reduced evidently in comparison to the Sn-1.5Ag-0.7Cu solder. From the microstructural analysis, 0.5 wt % Bi addition to SAC157 significantly enhanced the solid solution effect of Bi and refined β-Sn dendrite, as well as extended the eutectic area. Moreover, as the Bi addition increases to 5 wt %, finely dispersed bismuth precipitates within the β-Sn matrix, along with an enlarged eutectic area, lead to a remarkable enhancement in both ultimate tensile strength and yield strength. The electrical resistivity was characterized by the four-point probe technique. The results show that the electrical resistivity of Bi-modified SAC157 solder alloy decrease from 13.9 to 9.8 μΩ cm with the addition of 5 wt % Bi. These improvements can be attributed to the solid-solution and precipitation strengthening effects induced by the presence of bismuth. The results confirmed that the developed material is applicable as a potential high strength solder material in the context of advanced interconnecting applications.

An Investigation of the Effect of Wide Range Gamma Radiation from Nanoindentation of the SAC305 Solder Alloy

This study utilises nanoindentation testing to investigate the impact of varying gamma radiation doses on the micromechanical properties of Sn-Ag-Cu (SAC) alloy. Specifically, the focus is on evaluating changes in hardness, reduced modulus, and creep behaviour. The stencil-printed method and reflow soldering process were employed to apply the SAC solder paste and create solder joints on the surface of the printed circuit board. The soldered samples underwent exposure to gamma radiation at different doses, specifically 5, 50, 500, 5000, and 50000 Gy. The solder received in its original state was used as the control sample. Subsequently, the samples were subjected to a nanoindentation test in order to ascertain the correlation between load and depth, depth and dwell time, when exposed to radiation. The load-depth curve results indicate that there is a transition in the behaviour of solder joint materials from elastic to plastic deformation as the radiation dose increases. A finding has been made indicating that exposure to gamma radiation has the potential to induce a transition in the behaviour of SAC from an elastic state to a plastic state. The exposure to radiation doses has been found to induce changes in the atomic arrangement and structural properties of materials, leading to an increase in their hardness values. Nevertheless, it was observed that with increasing radiation doses up to 500 Gy, there was a noticeable decrease in the hardness value, which can be attributed to the occurrence of softening behaviour. Exposure to a high dose exceeding 5000 Gy leads to atomic displacement and transmutation products, subsequently resulting in plastic deformation. The stress exponent value signifies the occurrence of the deformation mechanism in solder material when exposed to gamma radiation. The study revealed that there was a shift in the deformation mechanism from grain boundary sliding to dislocation climb as the radiation dose increased from low to high levels.

Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method

Abstract Electronics will experience high and low working temperatures during operations, handling, and storage in severe environments applications such as download drilling, aircraft, and transportation. Temperatures in the vehicle underhood applications can range from −65 °C to +200 °C. Lead-free solder materials continue to evolve under varying thermal workloads. Material characteristics may deteriorate if operating conditions are harsh or heavy. Nonetheless, lead-free solders are susceptible to high strains, which can lead to electronic device failure. A better understanding of solder alloys is needed to ensure reliable operation in harsh environments. New doped solder alloys have recently been created by adding Ni, Co, Au, P, Ga, Cu, and Sb to SnAgCu (SAC) solder alloys to improve mechanical, thermal, and other qualities. SAC-Q has recently been made using Sn–Ag–Cu and the addition of Bi (SAC+Bi). It was discovered that adding dopants to SAC alloys may enhance mechanical characteristics and reduce aging damage. There is no published data on SAC solder alloys after prolonged storage at high strain rates and low functioning temperatures. The materials characterization of SAC (SAC105 and SAC-Q) solder after extended storage at low working temperatures (−65 °C–0 °C) and high strain rates (10–75 per sec) is investigated in this article. To characterize the material constitutive behavior, the Anand viscoplastic model was utilized to derive nine Anand parameters from recorded Tensile data. The generated nine Anand parameters were used to validate the Anand model's reliability. A strong correlation was established between experimental data and Anand's predicted data. The Anand parameters were used in a finite element framework to simulate drop events for a ball-grid array package on printed circuit board assembly to calculate hysteresis loop and plastic work density. The plastic work per shock event measures the damage progression of the solder interconnects. Thermal aging effects have been studied in terms of the hysteresis loop and the evolution of PWD.

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Abstract This paper focuses on anisotropic elastic-plastic constitutive modeling of SAC (SnAgCu) solder grains because of their importance in modeling the behavior of oligocrystalline (few-grained) micron-scale solder joints that are increasingly common in heterogeneous integration. Such grain-scale anisotropic modeling approach provides more accurate assessment of the mechanical response of solder interconnects in terms of predicting different failure modes, failure sites, and variability in time-to-failure. Anisotropic plasticity is represented using Hill–Ramberg–Osgood (RO) continuum plasticity model, which utilizes Hill's anisotropic plastic potential along with a RO power-law plastic hardening flow rule. Mechanistically motivated empirical scaling factors are proposed to extrapolate the stress–strain response for different grain sizes/shapes and for different coarseness of microstructures within each grain (generated with different cooling rates). This scaling factor can therefore also capture the effects of microstructural coarsening due to isothermal aging. This goal is achieved by first conducting monotonic tensile and shear tests on monocrystalline and oligocrystalline SAC305 solder joints containing grains of various geometries and also intragranular microscale (dendritic and eutectic) structures of various coarseness. The grain structures are characterized for each tested specimen using electron backscattered diffraction (EBSD). The Hill–RO model constants and the empirical scaling factors are then estimated by matching grain-scale anisotropic elastic-plastic finite element models of each tested specimen to the measured stress–strain behavior, using an inverse-iteration process. Grain shape is seen to influence the sensitivity of the effective stress–strain curves to the applied stress state (i.e., to the orientation of the principal stress directions) relative to (i) the material principal directions and (ii) the geometric principal directions of grains with high aspect ratio. Limitations of the current results and opportunities for future improvements are discussed.

Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

Magnesium and aluminum alloys are widely used in various industries because of their excellent properties, and their reliable connection may increase application of materials. Intermetallic compounds (IMCs) affect the joint performance of Mg/Al. In this study, AZ31 Mg alloy with/without a nickel (Ni) coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu (SAC) filler. The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated. The Ni coating layer had a significant effect on formation of the Mg2Sn IMC and the mechanical properties of Mg/Al joints. The blocky Mg2Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer. The content of the Mg2Sn IMC increased with increasing soldering temperature, but the joint strength decreased. The joint without a Ni coating layer fractured at the blocky Mg2Sn IMC in the solder, and the maximum shear strength was 32.2 MPa. By pre-plating Ni on the Mg substrate, formation of the blocky Mg2Sn IMC was inhibited in the soldering temperature range 240–280 °C and the joint strength increased. However, when the soldering temperature increased to 310 °C, the blocky Mg2Sn IMC precipitated again in the solder. Transmission electron microscopy showed that some nano-sized Mg2Sn IMC and the (Cu, Ni)6Sn5 phase formed in the Mg(Ni)/SAC/Al joint soldered at 280 °C, indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280 °C. The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280 °C, which was 80.7% higher than that of the Mg/SAC/Al joint, and the joint was broken at the Mg(Ni)/SAC interface. Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.

Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints

SnAgCu (SAC) solder joints are widely used in electronic industry as alternative to lead free solder. The microstructure of the solder joint plays an important role in enhancing the mechanical properties of the solder joint, thus the electronic devices will have a longer lifetime. This paper studies the effects of silver (Ag) percentage on the microstructure and intermetallic compound (IMC) in Sn-Ag-Cu solder, and how the addition of Ag impacts the mechanical concepts of SAC solder joints. SAC solder joints were examined as a function of Ag3Sn precipitates (in terms of the number and size of the precipitates) and intermetallic compounds (IMCs). The microstructure morphology of the SAC samples was analyzed by using a scanning electron microscope (SEM) with back scattering mode.A quantitative analysis of number of Ag3Sn was performed for all SAC samples. The results showed that when the amount of the Ag content increased, that led to an increase in the number of Ag3Sn precipitates with an increase the eutectic area but does not affect the growth of IMC. The mechanical properties of SAC samples were enhanced significantly by increasing the Ag content.

Tribological properties of AISI 4140 steel reinforced by bioinspired topological texture and multi-solid lubricants under starved lubrication

Improving the tribological properties of AISI 4140 steel (AS) by texture combined with SnAgCu (SAC) will cause the loss of lubricants too fast. Herein, problem was solved by adding MXene-Ti3C2/nano-TiC (MNT) into SAC to prepare multi-solid lubricants. Friction tests with contact pressures of 219.07, 347.76 and 471.98 MPa were respectively carried out to study effect of lubricant components and contents (0–10 wt%) on tribological properties of AS under starved lubrication. Compared with those of AS-SAC, COF and wear depth of AS-SAC-MNT containing 4 wt% MNT were decreased by 24.29% and 41.59%, respectively. The excellent tribological properties of AS-SAC-MNT were attributed to the formation of a stable solid lubricating film and improved adsorption ability of material to oil.

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

The Sn-Ag-Cu (SAC) alloy family is commonly used in lead-free solders employed in the electronics industry, for instance, SAC305, SAC387, SAC405, etc. However, the trend in manufacturing small electronic products and device miniaturization faces some disadvantages in terms of mechanical properties and their higher melting temperatures compared to Pb-Sn solders, prompting new research relating to the reinforcement of existing SAC solders. The current study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu)100−x(nanoNi)x solders with 0.5 wt.%, 1.0 wt.%, and 2.0 wt.% Ni. Structural analysis of the investigated samples were performed by means of X-ray diffraction in a liquid state and scanning electron microscopy (SEM). SEM showed the mutual substitution of Ni and Cu atoms in the Cu6Sn5 and Ni3Sn4 phases, respectively. The performed structural studies in liquid and solid states provided essential information concerning the structural transformations of liquid Sn-3.0Ag-0.5Cu alloys caused by minor additions of nanosized Ni powder. The melting point and degree of undercooling of the samples were investigated by DTA analysis.

Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions.

Low Ag lead-free Sn-Ag-Cu (SAC) solders have attracted great interest due to their good drop resistance, high welding reliability, and low melting point. However, low Ag may lead to the degradation of the mechanical properties. Micro-alloying is an effective approach to improving the properties of SAC alloys. In this paper, the effects of minor additions of Sb, In, Ni, and Bi on microstructure, thermal and mechanical properties of Sn-1 wt.%Ag-0.5 wt.%Cu (SAC105) were systematically investigated. It is found that the microstructure can be refined with intermetallic compounds (IMCs) distributed more evenly in the Sn matrix with additions of Sb, In, and Ni, which brings a combined strengthening mechanism, i.e., solid solution strengthening and precipitation strengthening, leading to the tensile strength improved of SAC105. When Ni is substituted by Bi, the tensile strength is further enhanced with a considerable tensile ductility higher than 25%, which still meets the practical demands. At the same time, the melting point is reduced, the wettability is improved, and the creep resistance is enhanced. Among all the investigated solders, SAC105-2Sb-4.4In-0.3Bi alloy possesses the optimized properties, i.e., the lowest melting point, the best wettability, and the highest creep resistance at room temperature, implying that element alloying plays a vital role in improving the performance of SAC105 solders.

Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging

Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital in enhancing application reliability. This investigation qualifies the random vibration response of five essential solder compositions in ball grid array (BGA) solder joints used in safety-critical applications. The solder compositions are eutectic Sn63Pb37 and SnAgCu (SAC) 305, 387, 396, and 405. Computer-aided engineering (CAE) employing ANSYS finite element analysis and SolidWorks software is implemented in this investigation. The solder Sn63Pb37 deformed least at 0.43 µm, followed by SAC396 at 0.58 µm, while SAC405 deformed highest at 0.88 µm. Further analysis demonstrates that the possession of a higher elastic modulus and mass density culminates in lower solder joint deformation. Stress is concentrated at the periphery of the solder joints in contact with a printed circuit board (PCB). The SAC396 solder accumulates the lowest stress of 14.1 MPa, followed by SAC405 at 17.9 MPa, while eutectic Sn63Pb37 accrues the highest at 34.6 MPa. Similarly, strain concentration is found at the interface between the solder joint and copper pad on a PCB. SAC405 acquires the lowest elastic strain magnitude of 0.0011 mm/mm, while SAC305 records the highest strain of 0.002 mm/mm. These results demonstrate that SAC405 solder has maximum and SAC387 solder has minimum fatigue lives.

Investigations of tribological performance of slewing bearing raceway with bionic textured composite surface under grease lubrication

To improve the insufficient lubrication of slewing bearing, this study investigates the tribological properties of 42CrMo bionic textured composite surface (BTCS) with different densities under MXenes-Ti3C2 lithium composite grease (MLCG). Inspired by the micro-texture characteristics of the clamshell, BTCS is composed of 42CrMo and Sn-Ag-Cu (SAC) alloy. The results indicate that the tribological performance of BTCS (ρ = 38%) is improved most significantly, the average friction coefficient (0.056) and wear rate (6.4 ×10−8 mm3N−1m−1) of the counterpart ball reach the minimum, and the worn surface is fine and smooth. This is mainly attributed to the synergistic self-repairing effect of MXenes-Ti3C2 and SAC on the worn surface. Furthermore, SAC particles act as submicron rolling bearings, transforming the friction form into rolling-sliding.

Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints

During operation, electronic components are exposed to high temperatures that may last for long periods, depending on the operating duration. Solder joints are one of the components most affected by thermal aging while in service. In this research, the effect of thermal aging duration and temperature on the mechanical properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) was investigated. The novelty of this work lies in the study of the important properties of a new generation of Sn-Ag-Cu (SAC) materials (i.e., Cyclomax). Cyclomax is rare in industry and immature in research. To understand the effect of thermal aging, the microstructure was investigated, and changes in it and its mechanical properties were observed. To simulate solder joints in electronic devices, samples of solder balls were prepared and attached to copper pads on electronic boards. Most samples were then treated at 150 °C or 100 °C for up to 1000 h and some samples were left untreated for comparison. A scanning electron microscope (SEM) was used to obtain images of the microstructure. The shear stress–shear strain relationships, including the ultimate shear strength (USS), the modulus of elasticity and the ultimate energy (UE), were investigated. The microstructure images indicated the presence of a layer of Cu6Sn5 on top of the copper pad before thermal aging was applied. The thickness of this layer increased with the application of thermal aging over time. The results for the shear stress–shear strain relationship indicate that all of the USS, the total energy (TE) to shear off the solder balls and the UE decreased at the beginning of the thermal aging and then reversed to increase later. In general, isothermal aging reduces the performance of Cyclomax solder joints in terms of the minimum force and energy required to separate and subsequently damage electronic components.

Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions

Sn–Ag–Cu (SAC) solder alloys are frequently used in electronic assemblies, and their fatigue resistance under various stress cycles is a significant factor that influences the reliability of electronics. Three distinct SAC-based solder joints (SAC305, SAC-Q, and SAC-R) were examined under various stress amplitude cycling and ambient temperature conditions. The stress on individual solder joints alternates between mild stress (MS) and harsh stress (HS) until complete failure. The hysteresis loop was investigated and compared under various stress amplitude cycles. In addition, the morphology and microstructure of the solder joints were analyzed. The results revealed that SAC-Q, with high Bi and Ag content, demonstrated superior fatigue resistance compared with SAC305 and SAC-R under varying stress amplitude conditions. The inelastic work increased with each change between the MS and HS cycles. SAC-Q exhibited solid solution and precipitate hardening mechanisms through the presence of bismuth (Bi) and silver (Ag) in the tin (Sn) lattice. At the same time, SAC305 showed Ag3Sn precipitates hardening, whereas SAC-R, with no Ag, demonstrated solid solution hardening exclusively. Different failure mechanisms were observed depending on the alloy composition and strain rate. SAC305 and SAC-R exhibited ductile failure. However, SAC-Q experienced an interfacial fracture. Excessive Bi may lead to the embrittlement of solder joints and a change in the failure mechanisms during mechanical testing.

Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging

Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi), Antimony (Sb), Nickel (Ni) etc. to conventional Sn-Ag-Cu (SAC) based solders have recently been investigated to improve their reliability. The additional elements can bring about the improvements through solid solution and precipitation strengthening. In this study, the effects of simultaneous additions of Bi, Sb and Ni to SAC 305 solder on the evolution of microstructure and mechanical properties of the solder under thermal aging at 125 °C for up to 1008 hours are investigated. Superior microstructural stability and improved mechanical strength of the multicomponent alloy at long aging time and its fracture behavior are discussed. • Simultaneous additions of Bi, Sb, and Ni improve the microstructural refinement for SAC solder • Bi, Sb and Ni suppress the grain growth of SAC solder during thermal aging • Bi, Sb and Ni remain strength of SAC solder during thermal aging • Toughness of multicomponent solder is higher than SAC solder • SAC305 shows more ductile fracture than multicomponent solder in tensile testing