Abstract
Ti3C2 MXene (MX) was introduced as the interlayer between the Cu film and Sn-3.0Ag-0.5Cu (SAC) solder to inhibit the overgrowth of intermetallic compounds (IMCs) at the bonding interface of Cu and SAC solder. The Cu-MX-SAC bonding was fabricated at 160 °C for 6 mins under a load of 10 MPa. Compared with Cu-SAC bonding, after 72 h aging, the average thickness of the IMCs layer in the Cu-MX-SAC structure is about 47 % thinner. As aging time increases, the diffusion rate of Cu atoms is limited due to the introduction of MXene interlayer, and the growth of IMCs in the Cu-MX-SAC structure is controlled by volume diffusion. For the Cu-MX-SAC solder bonding, after prolonged aging, the shear strength increases, and contact resistance at the bonding interface is almost no change compared with Cu-SAC solder bonding.
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