Abstract
While various mechanical properties of SnAgCu (SAC) solder has been reported in the literature the corrosion resistance of solder materials has not been widely reported. This study shows regions adjacent to the Cu6Sn5 intermetallic compounds (IMCs) as the corroded region. To investigate the possible formation of a galvanic cell at the interface of SAC solder and the Cu substrate the surface potential distribution at this interface has been evaluated. Results exhibited a comparatively large surface potential difference between SAC solder and the Cu6Sn5 IMC indicating SAC solder and Cu6Sn5 IMC as the anode and cathode in this system, respectively.
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