SMD Assembly Research Articles

Trusted Data Acquisition in Microelectronics Manufacturing as a Basis for ML-Optimized Processing

In the digitization of manufacturing processes, one of the major goals is the connection of production facilities and the use of data to digitize business processes. In order to optimize manufacturing processes and maximize the quality of the resulting product, further process information and data directly from the work piece and from the manufacturing environment are required to achieve a holistic system view in addition to the selected data that the manufacturing systems already provide. Within the SiEvEI 4.0 project, a research consortium from industry and academia works on process digitization for a manufacturing scenario where high value electronic goods are built in a distributed manufacturing environment. The key research topics addressed are the implementation of a Chain of Trust [CoT] for trustworthy distributed manufacturing and the application of artificial intelligence/machine learning to analyze and eventually optimize manufacturing processes. The basic concepts of this approach have been presented at IMAPS 2021. As an update, this paper reports on the actual experimental evaluation of these concepts in two different assembly lines, including data acquisition, data handling and AI processing with the goal to optimize processing targeting higher production yield and product quality. Specific for this work is the focus on high mix/low volume SMD assembly using fully automated equipment and Solder Ball Application. As a result, the paper presents the experimental validation of the manufacturing process digitization and the use this digital description of a process combination to make a distributed manufacturing flow safe and increase product/process quality.

Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments

Abstract Digitization is one of the hot topics in all Industry 4.0 efforts that are currently discussed. Often the focus is on digitization of business processes with a financial/organizational perspective on manufacturing, so the tools are adapting to enterprise resource planning [ERP] and manufacturing execution system [MES] rather than on actual manufacturing issues on the shop floor. Within the SiEvEI 4.0 project, a research consortium from the area of electronics manufacturing is working on digitization for a manufacturing scenario where high value electronic goods are built in a distributed manufacturing environment. The key research topics addressed are the implementation of a Chain of Trust [CoT] for such a distributed manufacturing, i.e. and the application of artificial intelligence/machine learning to analyze and eventually optimize manufacturing processes. The paper will introduce the concept of both COT and AI-based process analysis that will later on transferred into a microelectronics production environment. Two reference processes are targeted, SMD assembly using fully automated manufacturing equipment and Solder Ball Application using a high-mix/low volume concept. As a result, the paper presents a concept of how to digitize manufacturing processes and use this digital description of a process combination to make a distributed manufacturing flow safe and increase product/process quality.

Label-/tag-free traceability of electronic PCB in SMD assembly based on individual inherent surface patterns

Individual traceability of components enables efficient quality control, improving operational efficiency, or smart manufacturing approaches like big data analysis as well as customized mass production. Conventional track and trace solutions however, require a tag or label which is often not attachable due to e.g., spatial or economic reasons. A promising alternative is the identification of components based on individual, inherent surface patterns. For a set of 115 printed circuit boards, it is shown that fiducial markers, which are commonly used for alignment of components, can possess such individual surface patterns and hence serve as unique identifier. As the investigations are based on industrial conditions, the paper transfers the approach of label-/tag-free traceability from laboratory to an application in an industrial environment. Furthermore, faultless traceability of all samples within a SMD assembly line is achieved demonstrating the robustness of the identification against changes of the surface.

Improved Design of a High Density 3D Multichip Module for Class I Medical Devices

Today's powerful DSP based hearing instruments demand both high density and low cost microelectronic packaging solutions. In turn, this demand drives innovation and substantial collaboration among design and manufacturing personnel and suppliers. Conventional design and process envelopes are challenged and new problems arise. Rapid failure analysis and root cause identification are essential in this global, fast-paced development arena. Here we introduce a novel high density multichip module designed for placement onto a flexible, folded hearing aid SMD assembly and discuss the challenges faced by the design team. Delamination, electrochemical migration, and thermal stress failure mechanisms identified during design verification testing are examined, along with the techniques and tools of failure analysis and problem solutions.

자동부품검사를 위한 웨이블렛 변환 기반 영상정합

We propose a template matching method for component inspection of SMD assembly system. To discriminate wrong assembled components, the input image of component is matched with its standard image by template matching algorithm. For a fast inspection system, the calculation time of matching algorithm should be reduced. Since the standard images of all components located in a PCB are stored in computer, it is desirable to reduce the memory size of standard image. We apply the discrete wavelet transformation to reduce the image size as well as the calculation time. Only 7% memory of the BMP image is used to discriminate goodness or badness of components assembly. Comparative results are presented to verify the usefulness of the proposed method.

SMD Assembly on to Moulded Interconnection Devices ‐ Available Systems and Developments*

The assembly of surface mounted component parts into 3‐dimensional moulded circuit boards enables the integration of electronic and mechanical functions. However, this requires the assembly processes to be adapted to the MID’s 3‐dimensional geometry. This paper describes research on the development of assembly systems for MIDs at the FAPS Institute. Limits on the application of solder paste on inclined process planes are discussed, as well as possibilities of assembling with conventional assembly systems. A possibility for adapting existing assembly systems to new requirements is demonstrated and a concept for an optimised MID assembly system will be given.

SMD technology changes PC-board technology and assembly : F.-D. Maier. Feinwerktech. Messtech.94(8), 503 (1986). (In German.)

SMD technology changes PC-board technology and assembly : F.-D. Maier. Feinwerktech. Messtech.94(8), 503 (1986). (In German.)