Small Size Packaging Research Articles

CO2 흡수제 함유 김치포장에서 CO2 농도와 제품 숙성도의 상호관련성

CO2 concentration in kimchi package has emerged recently as a potential index of product ripening to be monitored or sensed in intelligent packaging. Considering that addition of CO2 absorber into the flexible kimchi package changes behavior of its CO2 concentration, ripening of kimchi in total acidity, package CO2 concentration in partial pressure (PCO2) and package volume at 10oC were estimated by mathematical model for two size packages included with different CO2 absorbers. In small size package containing 0.5 kg of kimchi, relatively less gas permeable low density polyethylene (LDPE) sachet of the absorber was found to give rise of PCO2 linearly correlated with acidity at acceptable conditions of absorber amount and size. The levels of PCO2 at optimum ripening were different with absorber amount. However, highly gas permeable microporous spunbonded film (Tyvek) sachet did not show the linear relationship except a condition of 1.5 g of CO2 absorbent. In large size package containing 2.0 kg, absorber sachets of LDPE and Tyvek could give the linear relationship between product acidity and package PCO2 but at different levels (PCO2 of package with LDPE sachet: 0.46~0.79 bar, PCO2 of package with Tyvek sachet: 0.00~0.75 bar). The PCO2 at optimal ripening was found to be less variable with LDPE sachets than with Tyvek ones. Use of package CO2 concentration as an indicator of kimchi ripening was shown to be possible on the limited conditions where the linear relationship between them is established or confirmed.

Market analytics of the rice wine market in Japan: an exploratory study

Purpose The purpose of this paper is to analyse consumer buying behaviour in the Japanese rice wine, also known as sake market. Design/methodology/approach The study applies a novel qualitative and quantitative analytical methodology to an off-license channel in Japan. The methodology involves the use of anchoring-and-adjustment theory and simulation to a large set of point of sale data. The selection of the brands used for the study are more than 230 brands and more than 150 sake breweries. Findings Age and gender are important factors determining recurrent patterns of purchasing behaviour. Small size packaging, e.g. one cup, has the highest volume in sales, for example, convenience shopping, but it depends on exogenous factors, e.g. summer season or festive events. Research limitations/implications Limitations are related with the lack of specific personal data from consumers that impedes to test behavioural attitudes driving loyalty to brands. Anchoring-and-adjustment theory can be a valid approach to evaluate large longitudinal data sets of purchasing behaviour. Practical implications Results indicate that fragmented markets tend to over-expand the assortment affecting volume stability. However, this dynamics is difficult to avoid when all participants are engaged in this behaviour and the market is strongly segmented by age and gender. Originality/value The paper contributes to the body of knowledge of buyer behaviour in relation to purchasing and consumption for other types of wine. It is the first application in alcoholic beverages of anchor-and-adjustment theory.

Research on life evaluation method of solder joint based on eddy current pulse thermography.

With the wide usage of electronic packaging technologies such as Ball Grid Array in electronic industry, it is necessary to maintain its quality in order to meet the demand of electronic products for function, integration, and size reduction. However, as the size of solder joints in such technology decreases, the solder joints are more and more prone to defects. To solve the life prediction problem of small-size packages having interconnections in the high-density chip, a method based on the eddy current pulsed thermography (ECPT) is put forward to study the remaining life prediction of solder joints. A 3D induction heating finite element model is established, by which the crack length of defect solder joints can be distinguished using temperature field. At the same time, the remaining life of defect solder joints can be characterized by the length of the crack. Furthermore, the experiments are carried out on solder joints whose diameter is 0.4 mm. Both simulation and experiment results verify that it is reliable and convenient to use 3D induction heating based temperature field from ECPT to evaluate the remaining life of cracks in solder joints.

Transformer-Free, Off-the-Shelf Electrical Interface for Low-Voltage DC Energy Harvesting

Energy harvesting from various ambient energy sources keeps gaining interest to deal with the challenges arising from more and more widespread Internet of Things applications in consumer electronics and industrial applications such as remote sensing. However, available energy is scarce and designers must comply with small size package and thermal dissipation that inevitably lead to compromises. This paper presents a transformer-free and self-powered oscillator that can be directly powered from a very low dc voltage source such as a thermoelectric module and able to deliver dc bias output. Using off-the-shelves parts, such a design is less cumbersome and gives more freedom to designers while tailoring their circuits with respect to their applications. The oscillator consists of a modified Hartley oscillator including a supplementary capacitor that provides a bias voltage in its output. Theoretical analysis is validated through experimental measurements showing that the proposed solution could be deployed in buildings and/or wearable devices as small and cheap complete microgenerators using for example thermoelectric elements or microbial fuel cells.

Development of Methanol Fueled Micro-SOFC System for Mobile Electronic Devices

Feasible study of whole micro-SOFC system using methanol fuel for small power sources in mobile electronic devices was performed. These new power sources are required to achieve heat-self-sustainability and thermal consistency due to its high operating temperature. To satisfy the requirements, energy flow in the system consists of insulation packages stored micro-SOFC was calculated based on thermodynamics, and achievement was evaluated by changing the thickness of insulator. Calculation results confirmed that the requirements were satisfied with small size packages, could be stored in mobile electronic devices. In addition, volumetric energy density of the system was higher than that of Li-ion batteries. Therefore, it was confirmed that the application of micro-SOFC as a new power sources for mobile electronic devices had advantage compared to Li-ion batteries.

Design and Realization of Wireless LAN in Smart Home System Based on 433MHZ Communication

Nowadays, wireless network technology in smart home is rapid gaining popularity duo to its flexible integration into everyday life. The paper introduces a method that adopts 433MHZ communication to establish the wireless network in smart home system based on Si4421 wireless modules. The paper designed the overall idea of how to establish the wireless network, it mainly talk about the wireless module, including both software and hardware. The difficulty lies in the realization of the custom wireless communication protocol. The Si4421 wireless module was tested in data communication and control in smart home system which can work efficiently and reliably, it proved that the wireless module is perfectly suitable for the wireless network construction in smart home with small size package, low consumption, low cost, and strong ability to leap obstacles.

-type lowpass filter for wideband noise suppression in small size package

The design and implementation of a moral π-type lowpass filter for wideband suppression of simultaneous switching noise in a small size, mixed signal system-in-package is reported. The filter consists of a continous conductive layer, a segmented conductive layer and a thin-film insulator having high dielectric constant between the two to replace the conventional Spower/ground planes in a package. From 0.55 to 4 GHz, the insertion loss of testing points, with a distance of only 4 mm, is measured to be greater than −40 dB for this filter. The proposed structure is suitable for low-cost, wideband noise supression in a highly integrated mixed signal system-in-package.

Low temperature wafer level packaging technology of bulk-micromachined MEMS device

New low temperature, low cost, small size packaging technology of novel bulk-micromachined MEMS sensor for mobile applications was developed. The sensor was fabricated with the bulk-micromachining process of SOI substrates and composed with a proof mass, membrane and electrodes for capacitance sensing. The sensor device was capped with very thin (130um-thickness) top and bottom silicon cap wafers which have a 80um-depth cavity. Top and bottom cap wafers were bonded with the sensor wafer with a low temperature curing polymer adhesive lower than 200°C. It is needed that the low temperature packaging technology and the passivation of top and bottom sides of the sensor for keeping the sensor performances and preventing stiction of the proof-mass during the molding processes. After bonding the three substrates, the top cap silicon was dry etched to expose bonding pads for the signal interconnection. The ASIC chip was polished to 75um-thickness, diced and bonded on a half-etched 200um-thick lead-frame with a DAF. The diced wafer-level-capped sensor was stacked on the ASIC, wire bonding was accomplished between the sensor and the ASIC, and the ASIC and the lead-frame and finally transfer molding process was done. The developed package is 24-leads QFN and the dimension is 4.0mm×4.0mm×1.1/1.2mm.

Characterization of aroma-active compounds, sensory properties, and proteolysis in Ezine cheese

Ezine cheese is a white pickled cheese ripened in tinplate containers for at least 8 mo. A mixture of milk from goat, sheep, and cow is used to make Ezine cheese. Ezine cheese has geographical indication status. The purposes of this study were to determine and compare the changes in basic composition, aroma, and sensory characteristics, and proteolytic activity of Ezine cheese stored in tinplate containers and plastic vacuum packages during storage. Aroma-active compounds were determined by thermal desorption gas chromatography olfactometry. To evaluate the proteolytic activity, casein and nitrogen fractions were determined. The results indicated that compounds identified at high intensities were dimethyl sulfide, ethyl butyrate, hexanal, ethyl pentanoate, (Z)-4-heptenal, 1-octen-3-one, acetic acid, butyric acid, and p-cresol. Characteristic descriptive terms were cooked, whey, creamy, animal-like, sour, and salty. The level of proteolysis increased in Ezine cheese during storage. Ezine cheese can be ripened in small-size packaging after 3 mo of storage. Approximately 6 mo is sufficient to produce the characteristic properties of Ezine cheese.

Drop Heights Encountered in the United Parcel Service Small Parcel Environment in the United States

Abstract Packaged goods move through varieous logistical networks each day all over the world. Packages moving through these various networks are exposed to dynamic forces such as drops, tosses, and kicks. This study investigated the effect of drops, tosses, and kicks encountered in the United Parcel Service (UPS) small parcel environment in the United States. The effect of the weight and volume of packages shipped was studied. The results of this study showed the highest drop observed in the UPS environment in 35 roundtrips from Lansing, MI to Monterey, CA was 42.1 inches for the Small-size package. The size of the package had no significant effect on the drop heights. Lighter weight packages for the smaller size experienced higher drop heights. Weight in general also did not have a significant effect on the Medium and Larger size package drop heights. 95% of the drops occurred at 30 inches for the Small/Light package, 24 inches for the Small/Medium package, 18 inches for the Medium/Light package, 24 inches for the Medium/Medium packages, 26 inches for the Medium/Heavy package, and 18 inches for the Large/Medium and Large/Heavy packages.

Bulk acoustic microwave delay lines: design, fabrication and performance

This paper presents a review of the state of the art on bulk acoustic delay lines, the main feature of which is to achieve large delays, up to 100 μs, in very small size packages. The structure uses piezoelectric thin-film transducers working at microwave frequencies (1 to 10 GHz). Basic design considerations show the range of specifications, mainly bandwidth, insertion loss and delay time, which can be reached by such devices. The fabrication process of the zinc oxide on sapphire structure is described, including thin-film deposition, impedance matching and packaging operations. We give the specifications of some typical delay lines working in transmission and reflection modes. Finally, we mention some applications of these delay lines to calibration and radar signal processing.