Journal of Electronics ManufacturingVol. 04, No. 03, pp. 149-154 (1994) No AccessComputer simulation of solder paste flow Part II: Flow out of a stencil apertureS.H. MANNAN, N.N. EKERE, I. ISMAIL, and M.A. CURRIES.H. MANNANDepartment of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , N.N. EKEREDepartment of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , I. ISMAILDepartment of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , and M.A. CURRIEDepartment of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author https://doi.org/10.1142/S096031319400016XCited by:17 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractIn this paper we use the computer simulation of dense suspensions introduced in Part I to simulate the flow of solder paste during stencil printing for reflow soldering in surface-mount technology (SMT). In order to understand the results of the simulation better, we first simulate the flow of solder paste between two parallel plates, in an arrangement similar to that found in a parallel plate viscometer. We then proceed to examine the results for flow of paste out of a stencil aperture. The aperture width, height, angle of wall inclination, particle size and concentration of the suspension are all varied to see the effect on tensile stress in the paste, and flow patterns. The most significant effect occurs when the angle of wall inclination is changed, and it is argued that walls should be inclined to reduce paste skipping (i.e. shorts on the reflowed PCB). Insight is gained into the phenomenon of skipping in general.Keywords:Solder pasteSMTdense suspensionscomputer simulation FiguresReferencesRelatedDetailsCited By 17Particle Level Modelling of Solder Pastes Rheological Behaviour in Viscosity MeasurementTareq Al-Ma'aiteh and Oliver Krammer1 May 2019Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive Adhesive PastesR. Durairaj, Lam Wai Man, S. Ramesh and S. W. Dean1 Jan 2010 | Journal of ASTM International, Vol. 7, No. 7Rheological characterisation and printing performance of Sn/Ag/Cu solder pastesR. Durairaj, S. Ramesh, S. Mallik, A. Seman and N. Ekere1 Oct 2009 | Materials & Design, Vol. 30, No. 9Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assemblyR. Durairaj, S. Mallik, A. Seman, A. Marks and N.N. Ekere1 Apr 2009 | Journal of Materials Processing Technology, Vol. 209, No. 8Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assemblyR. Durairaj, S. Mallik, A. Seman, A. Marks and N.N. Ekere1 Nov 2008Solder paste characterisation: towards the development of quality control (QC) toolR. Durairaj, S. Mallik and N.N. Ekere27 Jun 2008 | Soldering & Surface Mount Technology, Vol. 20, No. 3Analysis of jamming networks in sheared suspensionsSimon R. Hillman and Samjid H. Mannan1 May 2006 | Journal of Rheology, Vol. 50, No. 3Understanding the process window for printing lead-free solder pastesT.A. Nguty, B. Salam, R. Durairaj and N.N. Ekere1 Oct 2001 | IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4Critical factors affecting paste flow during the stencil printing of solder pasteR. Durairaj, T.A. Nguty and N.N. Ekere1 Aug 2001 | Soldering & Surface Mount Technology, Vol. 13, No. 2Analysis of Solder Paste Release in Fine Pitch Stencil Printing ProcessesG. Rodriguez and D. F. Baldwin1 September 1999 | Journal of Electronic Packaging, Vol. 121, No. 3Effective modeling of the reflow soldering process: use of a modeling tool for product and process designF. Sarvar and P.P. Conway1 Jul 1998 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, Vol. 21, No. 3Understanding the process window for printing lead-free solder pastesT.A. Nguty, S. Budiman, D. Rajkumar, R. Solomon and N.N. Ekere et al.Simulation of the stencil printing process [solder pastes]G.P. Glinski, C. Bailey and K. PericleousSolder paste printing process modelling mapN.N. Ekere, S.H. Mannan and M.A. CurrieThe study of the response of solder pastes under sinusoidal vibrationD. He, N.N. Ekere and M.A. CurrieAn investigation into the printing characteristics and mechanical dynamics of advanced squeegee mechanismsM. Howarth, S.A. Silvester, M. Lacey and K. SivaygonathanCorrelating solder paste composition with stencil printing performanceT.A. Nguty, N.N. Ekere and A. Adebayo Recommended Vol. 04, No. 03 Metrics History Received 1 August 1994 Accepted 1 August 1994 KeywordsSolder pasteSMTdense suspensionscomputer simulationPDF download
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