The abstract aims to investigate the comparative performance of Electrical Discharge Machining (EDM) and Selective Laser Sintering (SLS) with unconventional machining processes. Unconventional machining processes have gained significant attention due to their versatility and capability to fabricate intricate components with high precision. This study focuses on assessing the efficacy of EDM and SLS techniques in terms of data removal rate and relative wear volume. Electrical Discharge Machining (EDM) is a thermal erosion process that utilizes electrical discharges to remove material from a workpiece. In contrast, Selective Laser Sintering (SLS) is an additive manufacturing technique that employs a laser to selectively fuse powdered material, layer by layer, to build up a three-dimensional object. Both methods offer unique advantages in terms of precision, speed, and material compatibility. The performance evaluation of these techniques involves analyzing key parameters such as data removal rate, which measures the volume of material removed per unit time, and relative wear volume, which quantifies the wear on the tool or workpiece during the machining process. By comparing these metrics, insights into the efficiency and effectiveness of EDM and SLS can be gained, aiding manufacturers and researchers in selecting the most suitable method for specific applications. Through experimental investigations and data analysis, this study aims to provide valuable insights into the capabilities and limitations of EDM and SLS in unconventional machining processes. The findings will contribute to advancing the understanding of these techniques and optimizing their utilization in various industrial sectors, including aerospace, automotive, and biomedical engineering. The experimental analysis examines the impact of the Direct Metal Laser Sintering (DMLS) process parameter on sintering depth. The optimized parameters for AlSi10Mg alloy powder sintering were obtained using laser power at 162 W, scanning speed at 156 mm s−1, porosity at 20%, laser area size of 0.2 mm, and layer thickness of 1 mm.