Due to a typographical error incorporated during the editing process, the following is a correction of that error.Tensile creep behavior of precipitation-strengthened tin-based eutectic Sn-0.7Cu alloy was investigated at three temperatures ranging from 303 to 393 K. The steady-state creep rates cover six orders of magnitude (10−3 s−1 to 10−8 s−1) under the stress range of σ/E=10−4 to 10−3. The initial microstructure reveals that intermetallic compound Cu6Sn5 is finely dispersed in the matrix of β-Sn. By incorporating a threshold stress, σth, into the analysis, the creep data of eutectic Sn-Cu at all temperatures can be fitted by a single straight line with a slope of 7 after normalizing the steady-state creep rate and the effective stress, indicating that the creep rates are controlled by the dislocation pipe diffusion in tin matrix. So the steady-state creep rate, \(\dot \varepsilon \), can be expressed as \(\varepsilon = A\frac{{Gb}}{{RT}}\left( {\frac{{\sigma - \sigma _{th} }}{G}} \right)\exp \left( {\frac{{ - Q_C }}{{RT}}} \right)\), where QC is the active energy for creep, G is the temperature-dependent shear modulus, b is the Burgers vector, R is the universal gas constant, T is the temperature, σ is the applied stress, A is a material-dependent constant, and σth=σOB√1−k 2R , in which σoB is the Orowan bowing stress and kR is the relaxation factor.
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