Improved understanding of the reliability and failure physics of metal nanoparticle conductive inks would facilitate their large-scale deployment across a range of flexible electronics applications. We conduct room-temperature electromigration experiments on printed silver nanoparticle conductive ink test devices. We observe significant variation in failure time, location, and structure during these tests and during post-failure analysis with optical and electron microscopy. We use in situ Atomic Force Microscopy measurements to track volume changes in the sample as a function of time. These measurements provide additional data and understanding of the failure process within printed silver nanoparticle conductive inks.