Amorphous oxide semiconductors (AOS) are pivotal for next-generation electronics due to their high electron mobility and excellent optical properties. However, In2O3, a key material in this family, encounters significant challenges in balancing high mobility and effective switching as its thickness is scaled down to nanometer dimensions. The high electron density in ultra-thin In2O3 hinders its ability to turn off effectively, leading to a critical trade-off between mobility and the on-current (Ion)/off-current (Ioff) ratio. This study introduces a mild CF4 plasma doping technique that effectively reduces electron density in 10nm In2O3 at a low processing temperature of 70°C, achieving a high mobility of 104 cm2 V⁻¹ s⁻¹ and an Ion/Ioff ratio exceeding 10⁸. A subsequent low-temperature post-annealing further improves the critical reliability and stability of CF4-doped In2O3 without raising the thermal budget, making this technique suitable for monolithic three-dimensional (3D) integration. Additionally, its application is demonstrated in In2O3 depletion-load inverters, highlighting its potential for advanced logic circuits and broader electronic and optoelectronic applications.
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