Silicon Diaphragm Research Articles

Differential MEMS capacitance diaphragm vacuum gauge with high sensitivity and wide range

MEMS vacuum gauges have received a great deal of attention in recent years. In this paper, a MEMS capacitance diaphragm vacuum gauge with high sensitivity and wide range is designed for differential pressure measurement. A novel circular silicon diaphragm is used as the pressure-sensing diaphragm of the gauge. The diaphragm has a large radius-to-thickness ratio of 283 and works in touch mode. The design principle of the gauge is introduced in detail, and the finite element software is used for simulation analysis. Based on the techniques of microfabrication, a prototype of the gauge was fabricated, and its performances were investigated using a differential vacuum system. The results show that the MEMS capacitance diaphragm vacuum gauge, having good stability and repeatability, is capable to measure differential pressure from 0 Pa to atmospheric pressure. The capacitance-pressure curve is piecewise linear, with the maximum sensitivity of 26 fF/Pa in the low range and the minimum sensitivity of 0.8 fF/Pa in the high range.

Performance Investigation of Carbon Nanotube Based Temperature Compensated Piezoresistive Pressure Sensor

In silicon-based piezoresistive pressure sensor, the accuracy of the sensor is affected mainly by thermal drift and the sensitivity of the sensor varies with the rise in temperature. Here, the temperature effects on the desired representation of the sensor are analysed. Use of smart material Carbon nanotubes (CNT) and a few effective temperature compensation techniques are presented in this study to reduce the temperature effect on the accuracy of the sensor. Resistive compensation employed extra piezoresistors with Negative Temperature Coefficient of Resistivity (TCR) for temperature compensation. The attainment of the desired compensation techniques is highly compatible with the MEMS device fabrication. The compensated pressure sensor is supremacy for pressure measurement with temperature variations. Though various techniques have been suggested and put into actuality with successful attainment, the techniques featuring easy implementation and perfect compatibility with existing schemes are still blooming demanded to design a piezoresistive pressure sensor with perfect comprehensive performance. In this paper, CNT piezoresistive material has been employed as sensing elements for pressure sensor and compared with silicon in terms of output voltage and sensor performance degradation at higher temperature. Pressure sensors using CNT and silicon piezo resistive sensing materials were simulated on silicon (100) diaphragm by ANYSIS. Based on simulation results, silicon and CNT both pressure sensor also shows better results at near room temperature. With the increasing temperature it is observed that silicon pressure output underestimated by 23%.

An innovative MEMs peizo speaker

MEMs micro-speaker development has trailed behind MEMs microphone development by over two decades due to fabrication and acoustical challenges. While MEMs microphones only need to respond to minuscule displacement, generating sound energy requires both motor force and far higher volume velocity of the transducer mechanism. Recent development of a full bandwidth piezo-MEMs micro-speaker with a silicon diaphragm creates a rigid, light, fast responding transducer with high resistance to humidity and low thermal expansion. Fabricated using a monolithic MEMS semiconductor process eliminates calibration and driver matching. 20 Hz to 20kHz frequency response is delivered in occluded earbud, IEM, and hearing aid applications. The 20 kHz resonance peak provides a smoothly increasing response in the upper octaves. This extra amplitude allows for a significant increase in hearing aid gain and bandwidth over balanced armature transducers. The device is packaged in both top- and side-fire port configurations with earbud EVKs currently shipping. Integration of the amp, on the package substrate or SiP module, opens possibilities for more compact devices, longer battery life, lower cost, and more robust construction. The combination of audio fidelity, size, and speaker to speaker uniformity is not possible with traditional voice coil or hybrid MEMS approaches.

The design and simulation of a MOSFET-based MEMS pressure sensor using an integrated simulation approach

A novel integrated design and simulation approach is applied to analyze the performance of a metal–oxide–semiconductor field-effect transistor (MOSFET)-based microelectromechanical systems (MEMS) pressure sensor circuit while varying circuit and CMOS parameters, viz. the supply voltage and threshold voltage (Vt), respectively. For effective mechanical pressure sensing, a sensor MOSFET is integrated near the fixed edge of a deformable silicon diaphragm for maximum stress exposure. The stress value where the sensor MOSFET is located on the diaphragm surface is calculated using the finite-element method (FEM). Additionally, the threshold voltage required to activate the sensor MOSFET is also extracted using the FEM. The extracted value of Vt along with the corresponding gate oxide thickness are used to design and simulate the sensor circuit in the SPICE tool. The FEM-based multiphysics simulation is linked to a standard direct-current (DC) model SPICE simulation using our proposed carrier mobility model for a MOSFET under mechanical stress. All the FEM computations are performed using COMSOL Multiphysics, all the electrical simulations are performed using LT-SPICE, and the full sensor circuit is designed and simulated by integrating COMSOL Multiphysics and LT-SPICE via a MATLAB script. The validity of the design is confirmed by comparing these results with analytical computations. The results obtained using the integrated simulation approach confirm that the design is reliable and enable the sensor performance to be examined in terms of its sensitivity, yielding a value of 30 mV/MPa.

Design and simulation of a novel dual current mirror based CMOS‐MEMS integrated pressure sensor

This paper presents a novel dual current mirror based CMOS circuit for design and development of highly sensitive CMOS-MEMS integrated pressure sensors. The proposed pressure sensing structure has been designed using piezoresistive effect in MOSFETs and 5 μm standard CMOS technology parameters. The proposed structure includes six p- and n-channel MOSFETs and two square silicon diaphragms. MOSFETs MP1 and MN1 are the reference transistors and are placed on the substrate. The pressure sensing MOSFETs MP2 and MP3 are integrated at the mid of fixed edge and at the centre of the diaphragm-1 to sense the maximum tensile and compressive stress developed due to applied pressure. Similarly, the pressure sensing MOSFETs MN2 and MN3 are embedded at the mid of fixed edge and at the centre of the diaphragm-2. COMSOL Multiphysics and LTspice softwares are used for the design and simulation of proposed sensor. The sensitivity of proposed sensor is found to be approximately 7.7 mV/kPa for an input pressure ranging from 0–200 kPa. The output voltage of the sensor has a temperature sensitivity of approximately −0.2 mV/°C for an operating temperature ranging from −50 to 100 °C at 200 kPa. This CMOS circuit may be an alternative to traditional Wheatstone bridge circuits in future.

Miniaturized, Field-Deployable, Continuous Soil Water Potential Sensor

Soil water potential is a significant factor in determining the dynamics of water in the soil. However, few soil water potential sensors are available to conduct long-term, continuous measurements with full automation, due to cavitation formation inside the sensors while interacting with the soil. This paper presents a miniature, field-deployable soil water potential sensor capable of real-time measurement with a wide dynamic range from 0 to −800 kPa, a minimum detectable change of water potential of ~40 Pa, and a high sensitivity of $\sim 0.248~\mu \text{A}$ /kPa. The sensor consists of a shallow water reservoir sandwiched between a nanoporous ceramic plate and a thin silicon diaphragm with thermal oxide. The nanoscale pores of the ceramic plate allow for the increase of air entry tension, while the smooth and hydrophilic interior surfaces of the water reservoir help to minimize the trapping of air bubbles in the reservoir. When the sensor is embedded in unsaturated soils, the pre-filled water in the reservoir tends to leave the reservoir through the nanopores of the ceramic plate, until an equilibrium in water potential is achieved between the reservoir and the soil. The loss of water leads to bending of the silicon-based diaphragm toward the reservoir. The displacement of the diaphragm is quantified by a miniature optical displacement detector assembled with the sensor, which corresponds to the soil water potential. The presented soil sensor has been validated through both greenhouse and field experiments to monitor dynamic changes in soil water potential in real-time over multiple days.

MEMS-on-fiber sensor combining silicon diaphragm and supporting beams for on-line partial discharges monitoring.

Fiber optic extrinsic Fabry-Perot interferometric (EFPI) sensors are ideal candidates for on-line partial discharges (PDs) monitoring due to their inherent advantages, such as immunity to electromagnetic interference (EMI), highly compact sensing probes, and remote signal transmission. However, up to date, the design and fabrication of high-performance sensing diaphragms still remain challenging, and most of the reported diaphragms utilize circular structures with the peripheral sidewalls completely fixed. Herein, a novel EFPI ultrasonic sensor for on-line PDs monitoring is demonstrated. The proposed sensing diaphragm combines a silicon beam-supported diaphragm and a fixed boundary ring with a thickness of 5 µm, which was optimized through the multi-objective genetic algorithm (MOGA) revealing its high design flexibility and manufactured by using the microelectromechanical systems (MEMS) processing technology on a silicon-on-insulator (SOI) wafer. Compared with the circular and beam-supported diaphragm, the developed structure exhibits a higher sensitivity. The testing results show that the developed sensor owns the sensitivity and noise-limited minimum detectable ultrasonic pressure (MDUP) of -10 dB re. 1V/Pa and 63 µPa/sqrt(Hz) at its designed resonant frequency, respectively. Finally, the sensor's ability to detect PDs is validated in a temporary built PDs experimental environment, further proving its great potential to perform the on-line PDs monitoring.

Optical Fiber-Facet Multiplexed Monolithic Silicon Pressure Sensors

This paper describes the design, fabrication, and characterization of the smallest pressure sensors with the required sensitivity, bandwidth, and robustness for turbulent airflow measurements. These fiber-facet monolithic silicon optical pressure sensors consist of a silicon diaphragm above a sealed cavity contained within a $125~\mu \text{m}$ wide by $5~\mu \text{m}$ thick silicon disk mounted directly onto a single-mode optical fiber facet. The fiber-mounted sensors form pressure-sensitive interferometric cavities with 1.6 MHz bandwidth, 4 nm/kPa deflection, and up to 0.07 V/kPa sensitivity. The short length of the optical cavity makes the sensors optically efficient and optically broadband, allowing multiplexing using standard optical communications equipment. This is demonstrated experimentally by optically-multiplexing three fiber-facet sensors with up to 161 kPa dynamic ranges and 2 Pa noise floors. These balanced-detection pressure-sensing arrays provide a small-footprint, high-resolution alternative to traditional turbulence measurement equipment.

Ultra-sensitive pressure sensor using double stage racetrack silicon micro resonator

Three layouts of add-drop double stage racetrack microring resonators (ADSRMRR) located on the centre of the flexible silicon diaphragm were introduced as microscale optomechanical pressure sensors. The light propagation through all of the proposed ADSRMRR layouts were simulated using the signal flow graph method and the variational finite difference time domain (varFDTD) analysis. To achieve optimum transmission, a formula was derived for a critical coupling coefficient in the presence of the coupling loss factor for each coupling region. The pressure was measured from a wavelength shift in the output drop port signals considering the change in the optical length of the ADSRMRR due to the diaphragm shear stress. The pressure sensitivity of 48.5 pm/kPa, 42.4 pm/kPa and 33.2 pm/kPa with the limit of detection of 4.1 × 10−2 kPa, 4.7 × 10−2 kPa and 6.0 × 10−2 kPa were measured for the symmetric-large layout, the asymmetric and the symmetric-small layout of ADSRMRR pressure sensor, respectively. We introduced the ratio of the total optical length rather the sum of the resonant mode numbers (R-ratio) as a key factor in designing of the microscale Vernier based-pressure sensors. It is found that, using an ADSRMRR layout with a higher R-ratio provides a higher sensitivity with a lower detection limit, which are required in altitude sensors in satellites, aircraft, and weather balloons.

Optimization of piezoelectric MEMS process on Sr and La co-doped PZT thin films

Doped lead–zirconate–titanate (PZT) thin films are preferred for the development of micro–electro–mechanical systems (MEMS)-based acoustic sensors because of their inherent higher dielectric and piezoelectric coefficients. Patterning process is used to develop such MEMS devices which is highly complex even for undoped PZT thin films; therefore, the problem is further cumbersome for doped PZT thin films due to the presence of added dopant elements and their associated chemistry. This paper presents patterning of strontium (Sr) and lanthanum (La) co-doped PZT thin film (PSLZT) deposited on platinized silicon substrate using wet and dry etching processes for fabricating a diaphragm structure with thickness of 15–25[Formula: see text][Formula: see text]m and diameter of 1.4–2[Formula: see text]mm, suitable for acoustic sensing applications. The effects of various etching conditions have been studied and the results are reported. It is found that the dry etching is the most suited process for realizing the piezoelectric MEMS structure due to its higher etching resolution. An appreciable etching rate of 260–270[Formula: see text]nm/min with smooth vertical sidewalls is achieved. The silicon diaphragm with patterned PSLZT thin film is found to retain more than 80% of its dielectric and piezoelectric coefficients and has a resonance of 1.43[Formula: see text]MHz.

Eccentric reflective optical fiber MEMS micro-pressure sensor

An eccentric reflective optical fiber micro-electro-mechanical system (MEMS) micro-pressure sensor is proposed in this paper. The core part of the sensor consists of a dual fiber collimator (a fiber collimator with two pigtails) in an eccentric position and a sensitive silicon diaphragm. The sensitive silicon diaphragm adopts the BM (beam-membrane) structure with small structural parameters manufactured by MEMS manufacturing technology. Simulation results show that the BM structure has good sensitivity and high natural frequency. Overall structure of the sensor with the measurement range of 0 ∼ 10 kPa is designed. The way of intensity demodulation ensures the performance and stability of the sensor and makes the sensing system easier to process signals. By building a static test platform and conducting experiments, we can conclude that the sensitivity of the sensor is −0.32 dB kPa−1. Furthermore, the repeatability of the sensor is 1.26%FS (full-scale), the hysteresis of the sensor is 0.95%FS and the zero drift of the sensor is 0.615%FS h–1. By building a dynamic experimental platform and conducting experiments, it can be seen that the response time of the sensor is 0.47 ms (<1 ms), the sensor has good dynamic response.

MEMS-on-fiber ultrasonic sensor with two resonant frequencies for partial discharges detection.

A novel fiber optic extrinsic Fabry-Perot interferometric (EFPI) ultrasonic sensor with two resonant frequencies for detecting the partial discharges (PDs) in switchgear is demonstrated. The key sensing element consists of two 5-µm-thickness and beam-supported silicon diaphragms, whose natural frequencies are designed differently to enable the sensor to achieve the resonant responses at two different frequencies, thus obtaining a broadened frequency response. The sensing element is fabricated by employing the microelectromechanical systems (MEMS) technology on a silicon-on-insulator (SOI) wafer. The experimental results show that the sensor possesses two resonant frequencies of 31 kHz and 63 kHz, and obviously, shows a highly sensitive frequency response over a broader range compared with the approach composed of a single sensing diaphragm with only one resonant frequency. The noise-limited minimum detectable ultrasonic pressure (MDUP) reaches 251 µPa/Hz1/2@ 31 kHz and 316 µPa/Hz1/2@ 63 kHz, respectively.

A high sensitive graphene piezoresistive MEMS pressure sensor by integration of rod beams in silicon diaphragm for low pressure measurement application

MEMS piezoresistive pressure sensors are most widely explored for various applications such as industrial, automotive and medical field. Each application covers a wide operating range from very low pressure to the higher pressure. In this paper a novel structure is designed by introducing the local stiffness in the diaphragm membrane for low pressure measurement. Rod beams at the diaphragm with combination of graphene piezoresistors, improves overall performance of the pressure sensor in terms of sensitivity. At higher temperature and higher pressure, a noticeable sensitivity is achieved which is compared to the previous design of graphene pressure sensor without rod beam structure. At room temperature (25 °C), sensitivity of pressure sensor with rod beam structure is 6.28 mV/psi. At 30 °C, the sensitivity is 58% higher than sensitivity of pressure sensor without rod beam structure for low-pressure specific range.

Displacement Analysis of a Piezoelectric Based Multi-layered Micropump Diaphragm

This paper presents the diaphragm displacement analysis of multi-layered circular piezoelectric actuator (MCPA) using analytical, numerical and experimental methods. The piezoelectric zirconate titanate (PZT) actuator model examined in this study consists of a structure with 3 different diameters and 7 layers. The multi-layered and multi-covered actuator model was composed of three main layers in different radii and thickness with silicon, brass and the PZT and four additional layers with silver and bonding. When creating an analytical model, the effects of all layers were taken into account on the static deflection performance of the actuator. The classical laminated plate theory based on Kirchhoff thin plate theory was used in the analytic modelling studies of the actuator. The mathematical model, which is the solution of the static displacement equation of the non-homogenous for the MCPA of the micropump, depends on the applied voltage and pressure load together with the material and physical properties. The electric-solid coupling of the piezoelectric actuator and the silicon diaphragm layer under the effect of applied voltage load, and the silicon-fluid coupling under the uniform fluid pressure were simulated by numerical modelling with finite elements. In addition, the maximum displacements of the MCPA with silicon exposed to uniform flow pressure and electric voltage load were measured at different frequencies experimentally. It was observed that the results obtained from the analytical model, finite element analysis and experimental studies were sufficiently compatible with each other. Using the verified analytical model, the effects of layer thicknesses, layer diameters and adhesive layer on actuator static displacement performance are discussed.

3D Printed Flexible Plastic Diaphragm for Optical Pressure Sensor Application

Introduction Due to ongoing growth in automotive market, and also in order to respond the rising customers’ demands on driving the safe, comfort and green vehicle, the automotive sensor market expansion is inevitable. These components value about 20% of the total costs of the electronic systems in automobiles [1]. Among employed sensors in vehicles, pressure sensors have the significant role in providing the mentioned characteristics of the demanded automobiles. They are utilized at brake fluid, chassis, inlet manifold, etc. In 2000, a new optical pressure sensor was introduced by the by M. Fitzpatrick et al. [2] which used a silicon diaphragm to detect the applied pressure. Although the device was able to measure the in-cylinder pressure in a direct injection diesel engine, the provided results showed a slight drift in low pressure fields which reveals the opportunity to work on improvement of this type of sensor’s application [3].These days by developing the 3D printing industry, additive manufacturing is a promising technology to assist the low cost, fast and precise fabrication of macro/micro sensors either with complicated structures or specific materials. In this study prototyping of the mentioned optical pressure sensor’s diaphragm with using the SLA 3D printing technology is explained. Replacing the sensor’s silicon diaphragm with plastic material provides more mechanical flexibility and improvement in sensitivity of the sensor against low pressures. Optical pressure sensor mechanism This sensor includes two main parts (i) a sensor head (ii) an optical fiber and signal processing unit. The sensor head is a cavity with the depth of 50 to 100 μm which is capped with the diaphragm and connected to the optical fiber attachment from the other end, as shown in Figure 1. The external surface of the diaphragm exposes to the pressure field. The transmitted light from the source reflects back to the fiber end after hitting to the diaphragm’s internal surface and will be captured by the optical processing unit. The deflection of the diaphragm in presence of the external pressure reduces the internal gap between the fiber and membrane which results in the intensity alteration of the reflected light and finally determination of the pressure’s magnitude [3]. Method Five integrated plastic cavities and flexible diaphragms with thicknesses of 100, 200, 300, 500, 700 μm were 3D printed performing the Form 2 SLA 3D printer as shown in Figure 2. The process of printing took 130 minutes. The thickness of a layer at each step of SLA printing process was 50 μm. Table 1 shows the characteristics of the printing material. In order to mimic the function of the 3D printed diaphragms against the various external pressure fields, different magnitudes of deflection were applied at the center of the individual diaphragm gradually, until reaching the maximum of 100 μm. These tests were done by using FT-S100000 sensing probe which was mounted on FemtoTools FT-RS1002 Microrobatic Measurement System. The probe measured the induced forces corresponding to the applied deflections. Table 2 displays the size and performance characteristics of the probe. Figure 3 illustrates the setup used for the force measurement tests. Results and Conclusions According to the explained methodology multiple experiments have been performed to identify the linear stiffness, and the sensible average pressure of each type of sensor head diaphragms. Figure 4 displays the force-deflection diagrams of the diaphragms with respect to variation of their thicknesses. Since the imposed deflection was small enough compared to the surface of the plane, these diagrams show the bilinear relation between the generated forces and deflections. The average pressures proportional to induced force imposed by central deflection of diaphragms could be determined by using the classical plate theory [4]. Figure 5 illustrates these results. The diagram shows that at low pressures the thinner diaphragms are more sensitive to the variation of the pressure which is comparable to the work done in reference 3. This study determines the feasibility of using 3D printed flexible plastic diaphragm in optical pressure sensor for low to medium pressure measurement. In addition, performing the 3D printing technology for building the flexible plastic diaphragm results in providing the structural integrity of the built object, diaphragm-cavity, and reducing the fabrication cost and time.

Diamond turned micro machined metal diaphragm based Fabry Perot pressure sensor

Micro-machined Silicon (Si) diaphragm is extensively studied in Fabry Perot Interferometer (FPI) based pressure sensors, but its applications are limited to non-corrosive media due to poor corrosion resistance. Metal alloys such as Copper-Beryllium Alloy (CBA), Stainless Steel (SS) and Ni based alloys have comparable mechanical properties and much better corrosion resistance than Si. But their use as diaphragm for FPI based pressure sensor is much under reported. In this paper, design, analysis and fabrication of an FPI based pressure sensor with CBA diaphragm is discussed. Its sensing probe has two parts, a sensing head and a sleeve, welded together. The sensing head is a three-dimensional monolithic component which consists of pressure sensitive diaphragm and a step for FPI cavity. The sleeve guides the optical fiber to a fixed position such that the cleaved end of the fiber forms an FPI with the diaphragm. Both the sensing head and the sleeve are manufactured by Diamond Turning Machining (DTM) process and have CBA as material of construction. This manufacturing process ensures that flatness on interferometric side of the diaphragm and its parallelism with the fiber end are achieved within 2 µm; surface finish (Ra) on same side of the diaphragm is less than 10 nm. The sensor showed sensitivity of more than 1 µm/bar within the measurement range of 0–7 bar. DTM machined sensing probe with all essential FPI features (flatness, surface finish and parallelism) and welded diaphragm in FP pressure sensor are being reported for the first time to the best of our knowledge.

Miniature fiber-optic tip pressure sensor assembled by hydroxide catalysis bonding technology.

A miniature fiber-optic tip Fabry-Perot (FP) pressure sensor with excellent high-temperature survivability, assembled by hydroxide catalysis bonding (HCB) technology, is proposed and experimentally demonstrated. A standard single-mode fiber is fusion spliced to a fused silica hollow tube with an outer diameter (OD) of 125 µm, and a 1-µm-thick circular silicon diaphragm with a diameter slightly larger than the OD is bonded to the other endface of the hollow tube by HCB technology. The ultrathin silicon diaphragm is prepared on a silicon-on-insulator (SOI) wafer produced by microelectromechanical systems (MEMS), providing the capability of large-scale mass production. The HCB technology enables a polymer-free bonding between diaphragm and hollow tube on fiber tip with the obvious advantages of high alignment precision, normal pressure and temperature (NPT) operation, and reliable effectiveness. The static pressure and temperature response of the proposed sensor are discussed. Results show that the sensor has a measurable pressure range of 0∼100 kPa, which is well consistent with the measurement range of biological blood pressure. The pressure sensitivity is up to 2.13 nm/kPa with a resolution of 0.32% (0.32kPa). Besides, the sensor possesses a unique high-temperature resistant capability up to 600 °C, which can easily survive even in high-temperature sterilization processes, and it has a low temperature dependence of 0.09 kPa/°C due to the induced HCB bonding technology and the silicon-based diaphragm. Thus, the proposed fiber tip pressure sensor is desirable for invasive biomedical pressure diagnostics and pressure monitoring in related harsh environments.

Finite element analysis of fiber-optic Fabry-Perot pressure sensors based on silicon diaphragms.

Fiber-optic Fabry-Perot pressure sensors based on silicon diaphragms of different thicknesses were fabricated using surface and bulk MEMS techniques in this study. The multi-beam interference resulting from multiple reflecting mirrors with the elastic deformation of the Fabry-Perot sensor was simulated by finite element analysis. The pressure sensitivities of the sensors with different diaphragm thicknesses and the relationship between the pressure and the wavelength shift were simulated. The simulation results were in good agreement with the test results. This study provides guidance for future sensor models and parameter design.

Infrasound microphones using microfabricated piezoresistive silicon diaphragms

We report on the development of a new digital infrasound measurement system with integrated digitizing electronics. The system was designed to meet an input-referred noise floor specification of 95 μPa/√Hz over the frequency range of 0.01 Hz to 100 Hz. The infrasound sensor uses a microfabricated silicon diaphragm with four integrated piezoresistors connected in a full-bridge configuration. Fabricating the sensing element on a silicon wafer using conventional micro-electromechanical systems (MEMS) processing techniques is a convenient approach for realizing sensitive diaphragms with integrated piezoresistors, and, in turn, sensing elements that intrinsically respond to DC. This approach is thought to be suitable for large infrasound arrays. Integrating a secondary transducer into the package provides self-test capabilities, along with a geophone for correlating infrasound signals with seismic vibrations. Sensor self-noise and sensitivity measurements are presented, along with a discussion of system design considerations, including design of the electronics and packaging.

Finite Element Analysis of Circular Silicon Diaphragm

Miniaturization of sensing devices not only reduces the size, but also enhances the performance and reliability in sector of automation, space, weather monitoring and forecasting. It has become important for scientist and researchers working in the field of micro-electro-mechanical system area to simulate the structure before actual fabrication. This paper reports about the performance of proper meshing required to lead the exact results of simulated circular silicon diaphragm with the help of finite element method. In this paper, we have shown that the proper meshing of the circular silicon diaphragm has shifted the vibrating frequency of the diaphragm under different pressures applied.