Diamond thin films are promising for diverse applications because of their exceptional properties. Understanding the interface between diamond films and substrates is crucial for optimizing the film quality and functionality. In this study, a diamond thin film was grown on a Si(100) substrate using a microwave-based surface-wave plasma system and subjected to transmission electron microscopy (TEM) and electron energy-loss spectroscopy (EELS). The formation of a SiC interlayer was identified at the interface between the diamond thin film and Si substrate through cross-sectional TEM and EELS. Analysis of the atomic structure and crystalline properties indicated that the interlayer was β-SiC and that the orientation relationships [110]β-SiC//[110]Si and (111)β-SiC//(111)Si existed at the β-SiC/Si interface. The β-SiC interlayer exhibited the {111} extra half-planes, because they were more easily formed by the {111} planes than the {110} extra half-planes generated on {001} planes through 60° misfit dislocations. Many stacking faults and microtwins were observed in the diamond grains; such planar defects were likely attributed to strain behavior and complex contrasts at the nanoscale.
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