Results of the in situ measurements of the recombination lifetime and of barrier capacitance variations in Si substrates and pin diodes, respectively, during 1.5 MeV protons implantation are presented. Carrier recombination lifetime has been measured by employing microwave probed photoconductivity method, while parameters of the barrier capacitance changes have been extracted by transient technique of barrier capacitance charging current measurements using linearly increasing voltage pulses. Sub-linear decrease of carrier lifetime as a function of fluence has been revealed and peculiarities of such characteristic are explained in terms of formation of two layered structure within implanted Si material. Carrier recombination processes determine the increase of dielectric relaxation time within electrically neutral region (ENR) of a diode base. Carrier capture/emission processes within space charge (SC) and transition layer (between ENR and SC) regions lead to increase of generation/recombination currents in the irradiated diode.
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