A novel technique of selective SiO2 formation called the interfacial oxidation method is proposed and proved feasible by experiment. By this technique, a poly-Si/MoO2/Mo structure (poly-Si on MoO2 on Mo) can be converted to a poly-Si/SiO2/Mo structure by annealing in an H2 atmosphere so that SiO2 is selectively formed on only Mo electrodes. The SiO2 film formed by this method is shown to have almost the same properties as thermally grown SiO2 film; the Si(2p) binding energy peak, etching rate for diluted HF(H2O:HF=100:3), and average breakdown strength were 102.9 eV, 102 Å/min, and 3.6×106 V/cm, respectively. In addition, most diodes of 500×500 μm2 area showed a leakage current of less than 10−12 A.
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