Selective Electroless Plating Research Articles

Literature abstracts

ZAKEL, E., SIMON, J. and SCHULER, S., Verbindungstechnik in der Elektronik, Vol. 2, No. 2, pp. 53–57, June (1990) TAB is an attractive microconnecting technology for chips with a high number of I/Os. The principles of TAB technology and some new developments are presented. These are concerned with the problems of reducing pressure during gang bonding and the absence of the possibility of bumping single chips. The solutions presented are bonding with a liquid gold‐tin cushion for stress compensation and the application of selective electroless plating solutions for the bumping process. The possibilities of making TAB technology available for small and medium‐size companies are pointed out.

Photochemically Generated Gold Catalyst for Selective Electroless Plating of Copper

The creation of surface‐selective copper patterns was explored via the photochemical decomposition of dimethyl (1,3‐diphenyl‐1,3‐propanedionato) gold. UV irradiation of a substrate treated with the gold complex results in the formation of elemental gold, which in turn catalyzes copper metal plating from an electroless bath. Thus, a selective copper pattern can be formed in a simplified process as defined by patterned UV irradiation. The variables which are important to the process are discussed including the UV dose, wavelength, and the surface concentration of gold complex.