Leakage current conduction mechanisms of Cu/porous silica damascene structures with TaSix (20 nm) barrier were investigated. Polycrystalline TaSi0.54 and nano-cluster TaSi0.42 barriers were prepared by dc sputtering with various power and pressure. The newly developed silica based slurry was employed for the metal-CMP of TaSix films. The incorporation of traditional NH4OH solution and megasonic were applied to perform post-CMP cleaning. Auger mapping revealed clearly straight Cu and Ta lines in these TaSix samples. The line-to-line leakage current density (JL) was plotted versus the electric field (E) at various temperatures. The Ln(JL)–(E)1/2 plots showed that Ln(JL) is linearly dependent on (E)1/2, corresponding to Schottky emission mechanism. The slope of straight lines were determined from the data points of the Ln(JL/T2)–(1000/T) plots. It revealed the magnitude of barrier height. The maximum height of the potential barrier of nano-cluster TaSix/porous silica is about 0.12–0.30 eV. The bias-temperature-stress induced leakage current was measured for reliability study.
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