Through Holes Research Articles

Optimizing solar power efficiency in smart grids using hybrid machine learning models for accurate energy generation prediction

The fourth energy revolution is characterized by the incorporation of renewable energy supplies into intelligent networks. As the world is shifting towards cleaner energy sources, there is a need for efficient and reliable methods to predict the output of renewable energy plants. Hybrid machine learning modified models are emerging as a promising solution for energy generation prediction. Renewable energy generation plants, such as solar, biogas, hydropower plants, wind farms, etc. are becoming increasingly popular due to their environmental benefits. However, their output can be highly variable and dependent on weather conditions, making integrating them into the existing energy grid challenging. Smart grids with artificial intelligent systems have the potential to solve this challenge by using real-time data to optimize energy production and distribution. Although by incorporating sensors, analytics, and automation, these grids can manage energy demand and supply more efficiently, reducing carbon emissions, increase energy security, and improve access to electricity in remote areas. However, this research aims to enhance the efficiency of solar power generation systems in a smart grid context using machine learning hybrid models such as Hybrid Convolutional-Recurrence Net (HCRN), Hybrid Convolutional-LSTM Net (HCLN), and Hybrid Convolutional-GRU Net (HCGRN). For this purpose, this study considers various parameters of a solar plant such as power production (MWh), irradiance or plane of array (POA), and performance ratio (PR). The HCLN model demonstrates superior accuracy with the RMSE values of 0.012027 for MWh, 0.013734 for POA and 0.003055 for PR, along with the lowest MAE values of 0.069523 for MWh, 0.082813 for POA, and 0.042815 for PR. The obtained results suggest that the proposed machine learning models can effectively enhance the efficiency of solar power generation systems by accurately predicting the required measurements.

Scalable Fabrication of Large-Scale, 3D, and Stretchable Circuits.

Stretchable electronics have demonstrated excellent potential in wearable healthcare and conformal integration. Achieving the scalable fabrication of stretchable devices with high functional density is the cornerstone to enable the practical applications of stretchable electronics. Here, a comprehensive methodology for realizing large-scale, 3D, and stretchable circuits (3D-LSC) is reported. The soft copper-clad laminate (S-CCL) based on the "cast and cure" process facilitates patterning the planar interconnects with the scale beyond 1 m. With the ability to form through, buried and blind VIAs in the multilayer stack of S-CCLs, high functional density can be achieved by further creating vertical interconnects in stacked S-CCLs. The application of temporary bonding substrate effectively minimizes the misalignments caused by residual strain and thermal strain. 3D-LSC enables the batch production of stretchable skin patches based on five-layer stretchablecircuits, which can serve as a miniaturized system for physiological signals monitoring with wireless power delivery. The fabrications of conformal antenna and stretchable light-emitting diode display further illustrate the potential of 3D-LSC in realizing large-scale stretchable devices.

Characterization of wood fiber insulation for the development of wood fiber-insulated panels (WIPs) for use in building envelope

Wood fiber insulation (WFI) was studied as an eco-friendly alternative for fossil-based building insulation, focusing on its use in new wood fiber-insulated panels (WIPs). Rigid WFI boards with densities of 110, 140, and 180 kg/m³, including a 140 kg/m³ variant without paraffin wax, were evaluated. Key properties investigated included porosity, water vapor transmission, liquid water adsorption, and thermal conductivity. The porosity ranged between 85 and 92%, primarily influenced by density. Water vapor permeability ranged from 65 to 90 ng·s-1m-1Pa-1, while liquid water absorption was between 2.5 and 20% by volume, influenced by both wax and density. The thermal conductivity coefficient ranged from 0.038 to 0.055 W/(m·K). Bond strength tests with WFI (140 kg/m³ with wax) laminated to various materials using structural adhesives showed tensile perpendicular-to-grain strengths of 10 to 16 kPa and shear strengths of 60 to 90 kPa, with failure only occurring within the WFI. It was concluded that WFI is a promising material for novel WIPs, offering competitive hygrothermal properties and compatibility with structural adhesives. However, its bio-based nature suggests variability and complexity, necessitating further rigorous testing in various climates and in more complex assemblies.

A mechanics and electromagnetic scaling law for highly stretchable radio frequency electronics

Many classes of flexible and stretchable bio-integrated electronic systems rely on mechanically sensitive electromagnetic components, such as various forms of antennas for wireless communication and for harvesting energy through coupling with external power sources. This efficient wireless functionality can be important for body area network technologies and can enable operation without the weight and bulky size of batteries for power supply. Recently, antenna designs have received increased attention because their mechanical and electromagnetic properties significantly influence the wireless performance of bio-integrated electronics, particularly under excessive mechanical loads. These mechanical factors are critical for skin-integrated electronics during human motion, as complex skin deformations can damage the conductive traces of antennas, such as those used for near-field communication (NFC), leading to yield or fracture and affecting their electromagnetic stability. Serpentine interconnects have been proposed as a geometric alternative to in-plane circular or rectangular spiral antenna designs to improve the elastic stretchability of the metallic traces in NFC antennas and prevent mechanical fractures. Despite the use of serpentine interconnects within the physiologically relevant strain range for skin (<20 %), the electromagnetic stability of the antennas decreases. This instability, reflected by shifts in resonance frequency and scattering parameters due to inductance changes, reduces the antennas' wireless power transfer efficiency and readout range. Therefore, maintaining the electromagnetic stability of antennas, specifically NFC antennas, under various mechanical deformations has become a critical challenge in practical wireless skin-integrated applications, such as sensing and physiological monitoring. Here, we establish a new mechanics and electromagnetic scaling law that quantifies the inductance changes under strain in a rectangular-loop serpentine structure typically used for NFC wireless communication in stretchable electronics. We present a systematic analysis of the antenna's geometric parameters, material properties of the antenna and substrate, and the applied strain on the inductance change. Our findings demonstrate that the relative change of inductance is solely influenced by the serpentine structure's width-radius ratio, arc angle, aspect ratio of the NFC antennas, and the applied strain. Additionally, under physiological strain conditions for the skin, the relative change of inductance can be minimized to preserve the NFC antenna's performance and prevent mechanical fracture and electromagnetic stability loss.

Laser Welding of ARMOX 500T Steel.

The article describes the results of the study on laser welding of armor plates with a nominal thickness of 3.0 mm. The plates were made of Armox 500T steel characterized by a hardness of up to 540 HB, a minimum yield strength of 1250 MPa, an ultimate strength of up to 1750 MPa, and an elongation A5 minimum of 8%. The laser used for the welding tests was a solid state Yb:YAG laser. The influence of basic parameters such as laser output power, welding speed, and focal plane position on the weld geometry was determined during bead-on-plate welding tests. The optimal conditions for butt joint welding were determined, and the test joints were subjected to mechanical and impact tests, metallographic analysis, and hardness measurements. It has been shown that it is possible to laser weld Armox 500T armor plates, and at the same time it is possible to provide high quality butt joints, but this requires precise selection of welding parameters. A decrease in HAZ hardness of about 22-35% in relation to the hardness of the base material, ranging from 470 to 510 HV0.2, was found. The ultimate tensile strength of the test joints was approx. 20% lower than the Armox 500T steel. The bending tests revealed the low plasticity of the tested joints because the bending angle was just 25-35°. The results of Charpy V-notch test revealed that the impact toughness of the weld metal at -20 °C was approx. 30% lower than at room temperature.

Adaptive dynamic‐surface repetitive control for uncertain nonlinear systems with mismatched disturbances and input delay

AbstractBased on additive state decomposition technique, this article presents an adaptive dynamic‐surface repetitive control method for a class of uncertain nonlinear systems with mismatched disturbances and input delay. First, the original uncertain nonlinear system is decomposed into a linear time invariant (LTI) primary system responsible for the periodic signal tracing and rejection task, and a nonlinear secondary system with input time delay responsible for the robust stabilization task. A modified repetitive controller with a small correction to the delay constant is then independently designed for the LTI primary system, while an adaptive dynamic surface controller is designed for the nonlinear secondary system. Stability analysis is performed for each subsystem and the design procedure of the whole system is presented in detail. Finally, comparative simulations with other repetitive control and dynamic surface control methods show that the presented method not only relaxes the constraints on the reference inputs and exogenous disturbances, but also ensures that the system has better disturbance rejection and periodic‐signal tracking performance in both transient and steady states. As a result, this method broadens the application of both repetitive control and dynamic surface control.

Development of generalized photovoltaic model using ISIS-PROTEUS

Photovoltaic (PV) energy is a form of renewable energy that generates electricity from sunlight. PV systems consist of solar cells, which convert sunlight into electricity using a process known as the photovoltaic effect. Modeling and simulating PV systems involves using mathematical and computational models to predict the behavior and performance of PV systems under various conditions. This can include modeling the electrical characteristics of solar cells, as well as the interactions between multiple cells in a PV module or system. Following this sense, we present in this work a novel implementation of a generalized PV model using ISIS Proteus software. Proteus is layout software for electronic circuit simulation, schematic capture and PCB design. Some studies have indeed taken this context to model the PV modules either by using a Proteus Spice model of the photovoltaic panel without including the effect of climatic conditions variation, or by using pure mathematical relations that describe all physical and environmental parameters which will lead to a static behavior. The developed model in this paper as it is generalized, can be typically used as a PV cell, module even a generator for a complete simulation of a PV system. PV cell, which is the elementary component of PV system, is modeled using the single diode equivalent circuit (SDM) also known as five-parameter model and its behavior is simulated in details. The most advantage in our study is the fact that the PV output can be obtained wherever what solar radiation and ambient temperature where PV module is operating. Our model gives also the possibility to simulate a dynamic behavior under any climatic conditions. The accuracy between obtained results of simulation and the experimental data confirm the reliability and the high performance of the developed model.

Interlayer design for strong adhesion in the double-layer flexible copper clad laminate via HiPIMS deposition

By designing different interlayers (Al, Si/SixNy and Cr interlayer) and oxygen plasma pretreatment of the substrate, strong adhesion was realized for the double-layer flexible copper clad laminate on polyimide (PI) substrate via high power impulse magnetron sputtering (HiPIMS) technology. The microstructures and properties of Cu films on PI substrate were characterized by an X-ray powder diffractometer (XRD), X-ray photoelectron spectroscope (XPS), atom force microscopy (AFM), scanning electron microscope (SEM), nano-scratch test, scotch tape test and four-probe detector. With the introduction of interlayer and oxygen plasma pretreatment, the critical load of Cu film (300 nm thick) peaked at 43.5 mN and the sheet resistance ranged from 124 to 227 mΩ/sq. The oxygen plasma pretreatment resulted in the drastic oxidation to generate functional groups on the PI substrate surface, which contributed to the improvement of adhesion strength by chemical interaction in terms of the film with Si/SixNy or Cr interlayer. Besides, for the Cu film with Si/SixNy interlayer, the resistance against copper diffusion by the SixNy layer can also promote the enhancement of adhesion strength.

Calligraphic interdigitated capacitive sensors for green electronics

This study presents a novel approach to fabricating interdigitated capacitive (IDC) touch sensors using graphite-based pencils on a wood substrate. The sensors were designed to detect touches and pressure variations, offering a cost-effective and environmentally friendly solution for sensor fabrication. The fabrication process involved abrasion of graphite pencils on a wooden substrate to create conductive traces, followed by the integration of interdigitated electrode structures. Capacitance variations resulting from touch interactions were investigated to calibrate sensor responses for tailored tasks. The sensitivity of the sensor was found to be 1.2 pF/kPa, highlighting its responsiveness to pressure variations. Additionally, the sensors were interfaced with an Arduino Uno microcontroller board to demonstrate practical applications, such as replicating arrow key functionality. Additionally, the sensors exhibit sensitivity to environmental factors, with the relative change in capacitance increasing from 0.1 to 0.65 as relative humidity ranges from 30 to 90%. Furthermore, variations in temperature from 30 to 60ºC result in a relative change in capacitance increasing to approximately 0.5. The results indicate the feasibility and versatility of using wood-based substrates and graphite-based pencils for fabricating IDC touch sensors, offering promising prospects for sustainable and accessible sensor technology.

Assessment of heavy metal contamination in leafy vegetables: implications for public health and regulatory measures.

Heavy metal contamination in leafy vegetables poses significant health risks, highlighting the urgent need for stringent monitoring and intervention measures to ensure food safety and mitigate potential adverse effects on public health. This study investigates the levels of heavy metals, including cadmium (Cd), chromium (Cr), nickel (Ni), lead (Pb), zinc (Zn), and copper (Cu), in locally grown and commercially available leafy vegetables, comparing them to the safety limits established by WHO/FAO. The results revealed that levels of Cd, Cr, Ni, and Pb in the vegetables exceeded WHO/FAO limits, while Zn and Cu remained within permissible bounds. Marketed vegetables exhibited higher metal concentrations than those from nearby farms. For Cu (0.114-0.289 mg/kg) and Zn (0.005-0.574 mg/kg), the daily intake of metals (DIM) was below the dietary intake (DI) and upper limit (UL). Cd's DIM (0.031-0.062 mg/kg) remained below the UL but exceeded the DI. Marketed kale and mint surpassed both DI and UL limits for Ni, while local produce only exceeded the DI. All vegetables had DIM below the DI, except for mint and kale. For Pb, every vegetable exceeded DI limits, with market samples contributing significantly. Cr's DIM ranged from 0.028 to 1.335 mg/kg, for which no set maximum daily intake exists. The health risk index (HRI) values for Zn, Cd, Cu, Ni, and Pb suggested potential health risks associated with leafy greens, while Cr's HRI was below 1. The study underscores the need for stringent monitoring and intervention measures to mitigate the health risks posed by heavy metal contamination in leafy vegetables. These findings suggest that consuming these leafy greens may put consumers at considerable risk for health problems related to Cd, Cu, Ni, Pb, and Zn exposure.

Towards void-free copper filling of low-aspect-ratio heat dissipation through holes in packaging substrate with high H2SO4 concentration electroplating system

The void-free filling of high-density low aspect ratio (AR≤5) through holes (THs) in the packaging substrate is beneficial for promoting the integration, reliability, and heat dissipation efficiency of high-power electronic devices. It is a challenge to fill the low ARs THs compactly in direct current (DC) electroplating. The copper filling process relies heavily on the additives’ complex interactions and multiple process parameters. Herein, an ideal convection-sensitive electroplating solution formula — 2.34 M H2SO4, 0.24 M Cu2SO4·5H2O, 30 mg/L Cl−, 9 mg/L SH110, 5 mg/L NTBC, and 200 mg/L PEG — that was appropriate for low ARs THs filling was provided by investigate the electrochemical characteristics of additives. The critical electroplating parameters were optimized by thoroughly examining their influence on filling process, including current density 1.5 ASD, solution flow rate 2.2 L/min, and temperature 25 °C. The process window was enlarged apparently by the combination of optimal parameters for simultaneous void-free filling of THs with a large AR range of 0.95–5, dense crystal structure, and high layer quality could be achieved. Subsequently, the low ARs THs array filled by the optimized technology was implemented in the packaging substrate as the heat dissipation channel, which significantly promoted the heat dissipation efficiency.

Crosslinking Vinyl-Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric-Constant and Low Dielectric-Loss Thermosets.

Thermosets having low dielectric constant (Dk < 3) and low dielectric dissipation factor (Df < 0.003), high glass transition temperature (Tg > 150 °C), and good adhesion to copper are desirable for the low loss layers of the copper clad laminates (CCL) in next generation printed circuit boards. Three different difunctional diazirines are evaluated for both thermal and photochemical crosslinking of a high Tg vinyl-addition polynorbornene resin: poly(5-hexyl-1-norbornene) (poly(HNB)). The substrate polymer, crosslinked by the carbenes generated from the activated diazirines, forms thermosets with Dk < 2.3 and Df < 0.001 at 10GHz depending on the identity of the diazirine and the loading. The Dk and Df values for one composition are stable for 1600h at 125 °C in air and for 1400h at 85 °C and 85% relative humidity, suggesting good long-term reliability of this thermoset. Adhesion of poly(HNB) to copper can be enhanced by priming the copper surface with a diazirine prior to high temperature lamination; peel strength values of greater than 7.5 N cm-1 are achieved. Negative-tone photopatterning of poly(HNB) with diazirines upon exposure to 365nm light is demonstrated.

Recent Advances of Conductive Hydrogels for Flexible Electronics

Conductive hydrogels combine the properties of both hydrogels and conductors, making them soft, flexible, and biocompatible. These properties enable them to conform to irregular surfaces, stretch and bend without losing their electrical conductivity, and interface with biological systems. Conductive hydrogels can be utilized as conductive traces, electrodes, or as a matrix for flexible electronics. Exciting applications in sensors, tissue engineering, and human-machine interaction have been demonstrated worldwide. This review comprehensively covers the progress in this field, focusing on several main aspects: functional materials, performance improvement strategies, and wearable applications in human-related areas. Furthermore, the major approaches and challenges for improving their mechanical properties, conductivity, and long-term stability are systematically summarized.

SPICE Modelling-Assisted evaluation of dynamic on-resistance characterization in Schottky p-GaN HEMTs amid synchronous buck transient instabilities

This study addresses the critical gap in dynamic on-resistance characterization for GaN HEMTs within the initial unstable state in a non-isolated DC-DC converter, where the output voltage and currents fluctuate and exhibit overshoots or undershoots before stabilizing to their steady-state values, a domain within solar photovoltaic (PV) Maximum Power Point Tracking (MPPT) implementations which is crucial yet insufficiently examined. The authors present a novel multi-pulse test circuit within a synchronous buck converter configuration, complemented by SPICE simulation. This combination allows for the accurate assessment of clamping circuits' performance during transient states, significantly improving the precision of RDS(ON) measurements in unsteady phases. The approach deviates from conventional methods by merging empirical data with simulation insights to validate the efficacy of clamping circuits. The experimental results affirm the methodology's precision, with the highlighted Circuit V showcasing a marginal deviation of 2.32 % from existing benchmarks. This finding substantiates the method's dependability and practicality contributing to the GaN power electronics field. In addition, this research provides a powerful analytical tool for RDS(ON) evaluation, culminating in the design of a test PCB that synergizes with both simulated and empirical evidence, contributing future research in GaN HEMT power converter applications.

Heavy metal pollution causes mass mortality of fish in a tropical estuary in the southwestern Bay of Bengal

A massive fish mortality of the major species, viz., Mugil cephalus, Chanos chanos, and Oreochromis mossambicus, occurred on November 27, 2017 in the Adyar estuary. This catastrophe followed a spell of heavy rainfall and flash floods. A detailed study of water quality parameters (pH, water temperature, salinity, total suspended matter, dissolved oxygen, biochemical oxygen demand, and nutrients) and heavy metals, i.e., chromium (Cr), copper (Cu), cadmium (Cd), nickel (Ni), lead (Pb), and zinc (Zn), in the sediment and fish tissues were analyzed. Pollution indices like the enrichment factor (EF), geo-accumulation index (Igeo), contamination factor (CF), pollution load index (PLI), potential ecological risk index (PERI), and biota sediment accumulation factor (BSAF) were used to measure heavy metals. The pollution indices revealed that metals were significantly enriched in the sediments. The Igeo indicates that there was moderate contamination by Cd (2.27–3.25), whereas CF shows high contamination by Cd (7.22–9.72) and moderate contamination by Pb (2.5–3.25). The PLI (1.04–1.13) suggests that heavy metal contamination of sediments has occurred. Results showed that high concentrations of the toxic metals Pb and Cd were found in the sediment as well as in fish tissues. Length and weight of fish are significantly correlated (r2 = 0.98, p < 0.05). The study revealed that the mass fish kill was due to impulsive changes in the water quality and heavy metal pollution from untreated urban sewage discharges in this region.

An adhesion promoter layer for high-frequency printed circuit boards (PCBs) via initiated chemical vapor deposition

Establishing robust bonding between dissimilar materials, particularly metal and polymer composites is a significant challenge in electronics. This study focuses on enhancing the interfacial adhesion strength between super flat copper foil and ultra-low-loss dielectric material, crucial for optimizing the performance of high-frequency printed circuit boards (PCBs). Despite the common practice of mechanically treating the copper surface, which increases the surface roughness and significantly deteriorates signal transmission for high-frequency applications, herein, we present a novel approach involving a thin adhesion promoter layer coating onto an ultra-low-profile copper foil using the one-step, solventless technique of initiated vapor deposition (iCVD). Poly(glycidyl methacrylate) (pGMA) is utilized as the adhesion promoter and deposited on a super-flat profile copper surface via iCVD. The results demonstrate that the straightforward iCVD pGMA deposition significantly improves adhesion performance to 0.68 N/mm between the copper foil and prepreg, representing a 70 % improvement compared to 0.4 N/mm for the untreated copper surface. This research introduces a promising, scalable, and environmentally friendly adhesion promoter layer for copper-clad laminates (CCLs), particularly in the manufacturing of high-performance composite materials for the electronics industry.

Adhesion improvement of sputtered Cu films on flexible polymer substrates through the design of metal interlayers

Magnetron sputtering is an alternative approach to prepare flexible copper clad laminates because of low cost and thin copper clad laminate thickness. However, Cu film has poor adhesion when directly deposited on polymer substrates, imposing certain limits to the use of magnetron sputtering technique. This work aims to improve the adhesion between the copper film and the polymer substrate. In this work, we succeeded improved the adhesion between the polymer substrates and copper film by introducing different metal interlayers into the polymer/Cu interfaces. It was found that the the copper films with Ni interlayer have the best adhesion with polymer substrates. This study proposes a promising route to overcome the wear adhesion problem between Cu film and polymers in the preparation of magnetron sputtered flexible copper clad laminates.

A computerized tool for the systematic visual quality assessment of infant multiple-breath washout measurements.

Multiple-breath washout (MBW) is a sensitive method for assessing lung volumes and ventilation inhomogeneity in infants, but remains prone to artefacts (e.g., sighs). There is a lack of tools for systematic retrospective analysis of existing datasets, and unlike N2-MBW in older children, there are few specific quality control (QC) criteria for artefacts in infant SF6-MBW. We aimed to develop a computer-based tool for systematic evaluation of visual QC criteria of SF6-MBW measurements and to investigate interrater agreement and effects on MBW outcomes among three independent examiners. We developed a software package for visualization of raw Spiroware (Eco Medics AG, Switzerland) and signal processed WBreath (ndd Medizintechnik AG, Switzerland) SF6-MBW signal traces. Interrater agreement among three independent examiners (two experienced, one novice) who systematically reviewed 400 MBW trials for visual artefacts and the decision to accept/reject the washin and washout were assessed. Our tool visualizes MBW signals and provides the user with (i) display options (e.g., zoom), (ii) options for a systematic QC assessment [e.g., decision to accept or reject, identification of artefacts (leak, sigh, irregular breathing pattern, breath hold), and comments], and (iii) additional information (e.g., automatic identification of sighs). Reviewer agreement was good using pre-defined QC criteria (κ 0.637-0.725). Differences in the decision to accept/reject had no substantial effect on MBW outcomes. Our visual quality control tool supports a systematic retrospective analysis of existing data sets. Based on predefined QC criteria, even inexperienced users can achieve comparable MBW results.

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen.

With the increasing demand for innovative electronic products, LED transparent screens are gradually entering the public eye. Polyimide (PI) materials combine high temperature resistance and high transparency, which can be used to prepare flexible copper-clad laminate substrates. The physical and chemical properties of PI materials differ from copper, such as their thermal expansion coefficients (CTEs), surface energy, etc. These differences affect the formation and stability of the interface between copper and PI films, resulting in a short life for LED transparent screens. To enhance PI-copper interfacial adhesion, aminopropyl-terminated polydimethylsiloxane (PDMS) can be used to increase the adhesive ability. Two diamine monomers with a trifluoromethyl structure and a sulfone group structure were selected in this research. Bisphenol type A diether dianhydride is a dianhydride monomer. All three of the above monomers have non-coplanar structures and flexible structural units. The adhesion and optical properties can be improved between the interface of the synthesized PI films and copper foil. PI films containing PDMS 0, 1, 3, and 5 wt% were analyzed using UV spectroscopy. The transmittance of the PI-1/3%, PI-1/5%, PI-2/3%, and PI-2/5% films were all more than 80% at 450 nm. Meanwhile, the Td 5% and Td 10% heat loss and Tg temperatures decreased gradually with the increase in PDMS. The peel adhesion of PI-copper foil was measured using a 180° peel assay. The effect of PDMS addition on peel adhesion was analyzed. PIs-3% films had the greatest peeling intensities of 0.98 N/mm and 0.85 N/mm.

Enhancing Wastewater Depollution: Sustainable Biosorption Using Chemically Modified Chitosan Derivatives for Efficient Removal of Heavy Metals and Dyes.

Driven by concerns over polluted industrial wastewater, particularly heavy metals and dyes, this study explores biosorption using chemically cross-link chitosan derivatives as a sustainable and cost-effective depollution method. Chitosan cross-linking employs either water-soluble polymers and agents like glutaraldehyde or copolymerization of hydrophilic monomers with a cross-linker. Chemical cross-linking of polymers has emerged as a promising approach to enhance the wet-strength properties of materials. The chitosan thus extracted, as powder or gel, was used to adsorb heavy metals (lead (Pb2+) and copper (Cu2+)) and dyes (methylene blue (MB) and crystal violet (CV)). Extensive analysis of the physicochemical properties of both the powder and hydrogel adsorbents was conducted using a range of analytical techniques, including Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), Brunauer-Emmett-Teller (BET), and scanning electron microscopy (SEM), as well as 1H and 13C nuclear magnetic resonance (NMR). To gain a comprehensive understanding of the sorption process, the effect of contact time, pH, concentration, and temperature was investigated. The adsorption capacity of chitosan powder for Cu(II), Pb(II), methylene blue (MB), and crystal violet (CV) was subsequently determined as follows: 99, 75, 98, and 80%, respectively. In addition, the adsorption capacity of chitosan hydrogel for Cu(II), Pb(II), MB, and CV was as follows: 85, 95, 85, and 98%, respectively. The experimental data obtained were analyzed using the Langmuir, Freundlich, and Dubinin-Radushkevich isotherm models. The isotherm study revealed that the adsorption equilibrium is well fitted to the Freundlich isotherm (R2 = 0.998), and the sorption capacity of both chitosan powder and hydrogel was found to be exceptionally high (approximately 98%) with the adsorbent favoring multilayer adsorption. Besides, Dubinin has given an indication that the sorption process was dominated by Van der Waals physical forces at all studied temperatures.