The structure, morphology, and distribution of crystallographic defects in silicon ribbons grown by the edge defined film-fed growth (EFG) process are found to be functions of crystal growth rate. Two distinct types of defect distributions are observed in these crystals when grown at different rates. At growth rates below about 2.5 cm/min, the structure consists of parallel arrays of dislocations, twins and stacking faults parallel to the ribbon edges and extending through the thickness of the crystal. At growth rates in excess of 2.5 cm/min, a subsurface structure composed of large angle grain boundaries and, sometimes, equiaxed grains develops. An examination of the structure of these crystals is followed by the presentation of a model to account for the particular defect structure developed. The model is based on the proposition that defect generation is a consequence of the association of native point defects in the form of silicon self-interstitials and dissolved carbon which is a major impurity in EFG silicon. The electrical consequences of the development of the particular defect structure are examined, and it is postulated that imperfections in shaped crystals can function as intrinsic gettering agents for impurities, thus causing an improvement in the electrical properties of the crystals.
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