The transformation from liquid-based Li-ion batteries to solid-state Li-metal batteries is a necessary step to achieve beyond energy densities of 1000 Wh/L. However, the commercial widespread application of the solid-state Li-metal batteries has been hindered by several electrolyte constraints, among which narrow electrochemical window and low compatibility against metallic lithium as negative electrode. Among the various solid-state electrolytes, nitrogen doped lithium phosphate glass or LiPON is a well-known material with an excellent electrochemical stability above 5 V and a good compatibility against metallic lithium [1]. However, owing to its low ionic conductivity (~10-6 S/cm), application of LiPON is limited for thin-film batteries in medical implants and various sensor systems. For thin-film batteries, because the path length for Li+ ion diffusion is in the order of few 100 nm or less, low conductivity of LiPON is enough for application. LiPON has also been evaluated as solid-electrolyte coatings on electrode particles as buffer layer between active material and the bulk electrolyte. In a thin-film stack, it is an ideal model system for electrochemical study.Previously, we investigated detailed electrochemistry of RF-sputtered LiPON thin films with different thickness [2]. We demonstrated formation of an electronically insulating LiPON films down to 15 nm with a maximum conductivity of 1×10-6 S/cm. We have also formulated a breakdown mechanism for LiPON layer based on experimental measurements and thermodynamic considerations. In the present work, we investigated LiPON thin-films as artificial solid-electrolyte interphase for lithium plating and stripping on copper current collectors. The stability of 100 nm down to 10 nm LiPON thin-films was evaluated by electrochemical galvanostatic cycling test of Li plating/stripping with carbonate-based electrolyte. The LiPON thin-film with 100 nm showed reversible plating/stripping of Li with an overpotential of only ~40 mV for current density of 0.1 mA/cm2 for over 100 cycles, indicating formation of a uniform Li layer in-between substrate and LiPON without breaking of LiPON layer during the cycles. Furthermore, even with the thickness of only 10 nm, LiPON thin-film demonstrated significant improvement of coulombic efficiency of Li plating/stripping compared to without LiPON layer. In the presentation, thickness-dependence of LiPON on growth behavior of Li will be further discussed. Reference [1] X. Yu, J. B. Bates, G. E. Jellison, Jr., and F. X. Hart, J. Electrochem. Soc., 144 (1997) 524-532.[2] B. Put; P.M. Vereecken; J. Meersschaut; A. Sepúlveda; A. Stesmans, ACS Appl. Mater. Interfaces., 8 (2016) 7060-7069.