Abstract The radio frequency (RF) degradation mechanism under high temperature is proposed in this paper. The saturated output power (P sat), power added efficiency (PAE) and gain of the HEMTs deteriorate significantly under high power dissipation operation conditions, which contribute to an elevation of the junction temperature (T j). The high T j causes a negative shift of the threshold voltage and a reduction of electron mobility, as well as enhancing the trapping effects of the devices. As a result, the P sat and PAE of the high-power HEMTs (P sat = 152 W) decreased by 0.76 dB and 8.3%, respectively, which is more severe compared to low-power HEMTs (P sat = 20 W), where P sat and PAE reduced by 0.16 dB and 3.1% when the operation temperature was increased from 25 °C to 150 °C. By increasing the gate-to-drain distance from 1.625 to 2.175 μm, drain current stability and high temperature reverse bias reliability are improved. The results demonstrate that the trapping effect can be suppressed by decreasing the electric field under the gate; therefore, the RF output characteristics are boosted by 1.2 W, 1 dB and 2.6% for a device with gate width of 11.52 mm.