Ratchetting deformation occurring at solder joints in electronic packaging is a concern for electronic devices. Therefore, ratchetting deformation due to thermal cycling at solder joints should be simulated by structural analysis employing tools such as the finite-element method (FEM). However, simulation of ratchetting deformation is difficult, and little modeling to simulate ratchetting deformation accurately has been reported. This work experimentally examines uniaxial ratchetting deformation of Pb-free and Pb-containing solder alloys to elucidate the effect of rate on uniaxial ratchetting. An elasto-plastic-creep constitutive model is developed to simulate uniaxial ratchetting deformation. The constitutive model incorporates a method to determine the material constants simply from a small number of pure tensile tests and subsequent stress relaxation tests. Uniaxial ratchetting deformation of solder alloys was successfully simulated using this constitutive model and simple method for material constant determination.