Currently there are intense industry-wide efforts in searching for new high dielectric constant (high- k) materials for use in future generations of ultra-large scale integrated circuits (ULSI). There are number of requirements for the new high- k materials, such as high dielectric constant, thermal stability (400 °C or higher), high mechanical strength, and good adhesion to neighboring layers. Oxide spinels comprise a very large group of structurally related compounds many of which are of considerable technological significance. Spinels exhibit a wide range of electronic and magnetic properties in particular nickel, hafnium, cobalt, containing spinels. In the present investigation, crack free, dense polycrystalline monoclinic structure of pure HfO 2, and Al 2HfO 5 ultra-thin films have been prepared by a simple and cost effective sol–gel spin coating method. The formation of the monoclinic HfO 2 phase at 600 °C and complete formation of the single phase Al 2HfO 5 at 800 °C has been reported. The composition of the annealed films has been measured and found to be 70 at.% of O, 30 at.% of Hf for HfO 2 and 22 at.% of Al, 12 at.% of Hf and 66 at.% of O for Al 2HfO 5 films, which are close to the stoichiometry of the HfO 2 and Al 2HfO 5 thin films.