Properties Of Solder Research Articles

Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder

Purpose This paper aims to investigate the improvement of Sn58Bi solder properties by Ni nanoparticle to provide theoretical support in the field of electronic packaging. Design/methodology/approach In this study, nickel nanoparticles (Ni NPs) were doped into Sn58Bi solder as a reinforcing agent to prepare a composite solder. The wettability of composite solder, melting characteristics of solder alloy, microstructure of joints, mechanical properties and intermetallics growth at the interface were investigated. Findings Test results show that Ni had little substantial effect on the solders alloy melting temperature yet decreased the alloy undercooling. Notably, Ni enhanced solders wettability on Cu substrates. The spreading area increased by 14% at 0.6 wt.% Ni. The Ni refined the microstructure of Sn58Bi solder joints and inhibited the coarsening of the Bi-rich phase in the solder. At the same time, it also led to the production of free intermetallic compounds, increasing growth of the intermetallic compound (IMC) layer. However, upon surpassing 0.6 wt.% Ni, (Cu, Ni)6Sn5 accumulated and formed irregular clumps in the matrix. The grain size of the IMC layer gradually decreased as Ni was added. In shear tests, the fracture of joints occurred mainly inside the solder matrix. Sn58Bi-0.6Ni joints displayed a 40% rise in shear strength and a 25% rise in Vickers hardness. In addition, the appearance of dimples at the fracture indicated the improved flexibility of joints. Originality/value In this paper, Ni nanoparticle with different contents were added to Sn58Bi solder to prepare a composite solder, and the properties of the composite solder were investigated from different perspectives.

Effects of Minor Zn Dopants in Sn-10Bi Solder on Interfacial Reaction and Shear Properties of Solder on Ni/Au Surface Finish.

Sn-10Bi low-bismuth-content solder alloy provides a potential alternative to the currently used Sn-Ag-Cu series due to its lower cost, excellent ductility, and strengthening resulting from the Bi solid solution and precipitation. This study primarily investigates the interfacial evolution and shear strength characteristics of Sn-10Bi joints on a Ni/Au surface finish during the as-soldered and subsequent isothermal aging processes. To improve the joint performance, a 0.2 or 0.5 wt.% dopant of Zn was incorporated into Sn-10Bi solder. The findings demonstrated that a 0.2 or 0.5 wt.% Zn dopant altered the composition of the intermetallic compound (IMC) formed at the interface between the solder and Ni/Au surface finish from Ni3Sn4 to Ni3(Sn, Zn)4. The occurrence of this transformation is attributed to the diffusion of Zn atoms into the Ni3Sn4 lattice, resulting in the substitution of a portion of the Sn atoms by Zn atoms, thereby forming the Ni3(Sn, Zn)4 IMC during the soldering process, which was also verified by calculations based on first principles. Furthermore, a 0.2 or 0.5 wt.% Zn dopant in Sn-10Bi significantly inhibited the Ni3(Sn, Zn)4 growth after both the soldering and thermal aging processes. Zn addition can enhance the shear strength of solder joints irrespective of the as-soldered or aging condition. The fracture mode was determined by the aging durations-with the brittle mode occurring for as-soldered joints, the ductile mode occurring for aged joints after 10 days, and again the brittle mode for joints after 40 days of aging.

Investigation on the Thermal and Wettability Properties Aided with Mechanical Test Simulation of Tin (Sn) - Bismuth (Bi) Solder Alloy at Low Reflow Temperatures

The current study proposes to investigate the thermal, wettability and mechanical properties of a low temperature SnBi solder. The main aim is to investigate the performance of the SnBi solder alloy with different Bi composition. The study also establishes the relationship between melting temperature, spreading area and tensile stress of the SnBi with different Bi composition at different low reflow temperatures. The thermal and wettability tests are conducted experimentally, while the mechanical test will be analysed via finite element analyses (FEA). The single shear lap test method was adopted for the simulation. The thermal properties of the SnBi solder are investigated using the differential scanning calorimeter (DSC). The reflow temperature selected ranges from 160 °C to 220 °C to accommodate the purpose of low temperature soldering. Wetting test results showed that spreading area of Sn48Bi solder alloy increased to 28.1 and 42.88 at 180 °C and 210 °C respectively. The increase in the Bi composition reduced the tensile strength regardless of the increase of the reflow temperature. The preliminary results commend the characteristics of the SnBi solder as a possible alternative to the Pb solder.

Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

Based on the principles of micro-alloying and composite, the graphene reinforced Sn2.5Ag0.7Cu0.1Ce composite solder was designed. Ni nanoparticle-modified reduced graphene oxide (Ni-rGO) was prepared by thermal decomposition method, and the powder-melting method was proposed for the first time to prepare Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder. The microstructure, wettability, electrical resistivity, and mechanical properties of the composite solder were systematically studied. Results indicated that the Ni nanoparticles uniformly adhered to the rGO with a size of 26.3 nm. The effective incorporation of Ni-rGO into the solder matrix was achieved. The result broke the technical difficulty that graphene cannot be effectively added to low melting point metals. With the addition of Ni-rGO, the grain size gradually decreased, and the eutectic structures increased. Deep etching results revealed that columnar β-Sn was stacked from layered β-Sn, the addition of 0.05 wt% Ni-rGO led to an increase in sheet-like Ag3Sn within the eutectics. Additionally, Ni-rGO was found at the grain boundaries of composite solder, serving as nucleation sites for Ag3Sn and Cu6Sn5. At an addition of 0.05 wt%, the tensile strength reaches a maximum of 58.1 MPa, with elongation of 33.8%, surpassing the strength of commercial Sn3.0Ag0.5Cu solder. Therefore, the high-strength and tough composite solder was obtained. This study offered a new approach for the development of low-melting-point composite materials.

Finite-element stress and strain analysis of tin–silver–copper solders exposed to isothermal ageing at 100°C

This research aims to investigate the influence of pre-isothermal aging on the mechanical behaviour of 98.5Sn–1.0Ag-0.5Cu (SAC105) and 96.5Sn–3.0Ag–0.5Cu (SAC305) interconnects using non-linear finite-element simulations. To accomplish this, reliable literature sources are used to gather the material properties (both elastic and inelastic) of the aged SAC solders, which are then appropriately incorporated into the simulation process. Various aging durations, ranging from 1 to 6 months, are analysed. The results of the numerical computations demonstrate that the mechanical response of pre-aged SAC solders, subjected to thermal cycling, is significantly influenced by the ageing process. Specifically, the non-aged SAC305 configuration exhibits lower inelastic deformations and strain energies compared to the SAC105 system, indicating potentially better thermal fatigue performance. However, SAC105 solders generally exhibit greater resistance to aging, leading to lower levels of inelastic strains and strain energies, particularly for shorter aging durations. In general, it is expected that pre-aged SAC105 solders will demonstrate improved thermal fatigue performance compared to aged SAC305 interconnects.

Correlation between microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders

The correlation between Vickers microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders was investigated. The β-Sn grains were refined with increasing Bi content, as well as the additions of Ag and Sb. Fine β-Sn grains in general should strengthen the mechanical properties of solders, however, the Vickers microhardness of Sn-xBi-M(Ag, Sb) solders decreased with increasing Bi content (i.e., fine β-Sn grains). It was shown that the microhardness of Sn-xBi-M(Ag, Sb) solders depended on the amount of Bi/β-Sn interfaces rather than the fine-grain strengthening effect. The smaller the amount of Bi/β-Sn interfaces was, the higher the Vickers microhardness of Sn-xBi-M(Ag, Sb) solders.

Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging

Purpose This paper aims to focus on the reliability of Sn15Bi–xAg and Sn15Bi–xCu solder joints during isothermal aging. Design/methodology/approach The effects of Ag or Cu additions on the microstructure, interfacial metallic compound layer and shear strength of Sn–15Bi (Sn15Bi) based solder joints during were investigated. The effects of Ag or Cu additions on the microstructure and tensile properties of Sn15Bi-based bulk solders were also investigated to provide a comprehensive analysis. The interfacial morphology and microstructure were observed by scanning electron microscopy and the composition in the structure was examined by energy dispersive spectrometer. The shear tests were carried out on the as-soldered and as-aged joints using a ball shear tester. Findings The results revealed that by adding Ag or Cu, the microstructure of Sn15Bi solder can be refined. Ag addition increased the tensile strength of Sn15Bi solder but had little effect on elongation. However, Cu addition decreased the tensile strength and elongation of Sn15Bi solder. For solder joints, Ag addition increased the shear strength and toughness of Sn15Bi/Cu joints but Cu addition decreased the shear strength and toughness of Sn15Bi/Cu joints. Originality/value The authors can potentially provide a replacement for Sn40Pb traditional solder with Sn15Bi solder by alloying Ag or Cu due to its lower cost and similar melting point as Sn–Pb solder.

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder.

SnPb solder was widely used in electronic packaging for aerospace devices due to its high reliability. However, its creep resistance is poor and can be improved by adding alloying elements. The effects of Sb content on the microstructure, tensile, and creep properties of eutectic SnPb solder were investigated. Sb addition effectively improved the mechanical properties of the SnPb solder. When Sb content exceeds 1.7 wt.%, SbSn intermetallic compounds (IMCs) occurred. And increasing the Sb content increased the tensile strength. Furthermore, Sb addition decreased the steady-state creep rate and increased the stress exponent n, suggesting that the creep resistance had been enhanced, which may be attributed to the hindrance of dislocation movement by SbSn IMCs, as well as the reduction in phase boundaries, which consequently reduced grain boundary sliding.

Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package

Sn-3.0Ag-0.5Cu (SAC305) is one of the most commonly used Pb-free solder composition nowadays. A minor alloying element addition can improve mechanical properties and thermal reliability of the solder joint. Minor amount of Bithmuth (Bi) or Nickel (Ni) addition can improve mechanical properties of solder by solid solution strengthening, or ensure the structural stability of the intermetalllic compounds. Also, low melting temperature solder with Bithmuth can reduce the cost of soldering process and keep components from deterioration. In this study, reliability of heterogeneous and homogeneous solder joint in the ball-grid-array (BGA) package solder joint were investigated. Using Sn-3.0Ag-0.5Cu (SAC305) solder paste and two kinds of solder balls, we have investigated which combination of solder joint improves the thermo-mechanical reliability. SAC305 and SCN (Sn-0.75Cu-Ni,Bi) balls were used for homogeneous and hetrogeneous joints. Solder balls were attached in BGA package. To examine the solder joint reliability, thermal cycling test was conducted after reflow soldering. Shear strength measurement and cross-sectional analysis of the BGA package solder joints were carried out before and after 2000 cycles of the test. The shear strength of homogeneous solder joint decreased to 68.2% and heterogeneous decreased to 43.5%. The cross-sectional analysis using scanning electorn microscopy (SEM) and electorn back-scattered diffraction (EBSD) showed the (Ni,Cu)<sub>6</sub>Sn<sub>5</sub> and Cu<sub>6</sub>Sn<sub>5</sub> IMCs which were generated in the solder joint, and the crack propagated longer in the homogeneous solder joint of SAC305 after the thermal cycling test. IPFM showed the grain refinement effect of the SCN solder joint after thermal cycling. The minor addition of Bi had played a role as dislocation pinning site and became to equiaxied grain, so that the lifetime of heterogeneous SCN solder joint was superior than that of the SAC305.

Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to Solder

The aims of the research are to improve the reliability and lifetimes of solder joints to contribute to the green economy, by reducing waste and extending recycling times. The objectives of the work are; to improve the materials properties of various solders used for attaching die/flip chip packages to PCBs by adding nanoparticles to the mix, to fabricate industrial test samples using flip chips soldered to PCBs, to test the reliability of the solder through accelerated testing, to examine failure modes and lifetime extensions.

Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate

Purpose This study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry. Design/methodology/approach In this paper, Sn58Bi-xSi3N4 (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied. Findings The experiment results demonstrate that including Si3N4 nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm2, raised by 19.41% relative to those without Si3N4, and the wetting angle was the smallest at 0.6 Wt.% of Si3N4, with a minimum value of 8.35°. When the Si3N4 nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si3N4 nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si3N4 reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si3N4 nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting. Originality/value In this paper, Si3N4 nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si3N4 nanoparticles on Sn58Bi solder were investigated from various aspects.

Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications

Purpose The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications. Design/methodology/approach Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element. Findings The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations. Originality/value It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

Flexible light-induced self-written optical waveguide with 50 μm core size

We demonstrate a NIR light-induced self-written (LISW) optical waveguide between graded-index (GI) glass optical fibers with a 50 μm core size (50GIFs) using gel material. We describe the optical properties of the LISW optical solder in terms of its flexibility, adhesiveness, and loss. The results demonstrate that the two 50GIFs were self-coupled through the LISW optical waveguide, and the connection maintained adhesiveness against displacement. A low loss and relaxation of alignment tolerance were demonstrated for the optical interconnection between two 50GIFs using flexible LISW optical soldering. This technology is applicable to future autonomous driving systems using high-speed optical data transmission.

Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

This investigation aimed to examine the development mechanism of Cu–Ni–Sn compounds and analyze the mechanical properties of mixed solder (MS) joints. Results show that an intermetallic compound (IMC) layer was formed in an SAC305 solder joint prepared herein comprising (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 phases following the reflow process. The morphology of the (Cu, Ni)6Sn5 grains was identified to be dodecahedral. Meanwhile, the IMC layer of the prepared MS joints contained only the (Cu, Ni)6Sn5 phase, which exhibited a hexagonal prism morphology. The lattice characteristics of Cu6Sn5 changed after Ni dissolution, forming (Cu, Ni)6Sn5 crystals with an X-shaped morphology in the MS joints that exhibited a high Cu content during the aging process. After reflow, the MS joints exhibited slightly higher shear strength than the SAC305 solder joint. After aging at 165 °C for 1000 h, the shear strength of the SAC305 solder joint reduced by 21.72% compared to its value after reflow owing to the annexation of Sn grains. However, the number of Sn grains in the MS joints did not considerably decrease after aging. Further, the grain boundaries of β-Sn and (Cu, Ni)6Sn5 particles contributed to the strengthening of the MS joints. The shear strength of the MS joints decreased by 11.06%–18.35% after aging.

Effect of Sn Plating Thickness on Wettability, Solderability, and Electrical Connections of Electronic Lead Connectors for Surface Mount Technology Applications

The wettability of solder is important to achieve good solderability between the electronic component and printed circuit board (PCB). Tin (Sn) plating is widely used to promote the wettability of the solder on the substrates. However, an adequate amount of Sn plating thickness must be taken into consideration to acquire good wettability and solderability. Thus, this study investigates the Sn plating thickness of the electronic lead connector and their effect on the wettability and electrical connection. Two types of Sn plating thicknesses, ~3 μm, and 5 μm were applied on the electronic lead connector surface. It was found that the thin Sn plating thickness of ~3 μm has shown failure in electrical connections and lack of solder joint wettability and solderability properties. A thicker Sn plating thickness of 5 μm, has shown better wettability and solderability properties. In addition, the electrical connections also passed which implies that the thicker Sn plating thickness provides good solder joint establishment leading to good electrical connections. It is also observed that the better wettability of solder has been achieved for thicker Sn plating thickness. The finding from the field emission scanning electron microscope (FESEM) shows that the intermetallic compound (IMC) layer growth in the lead connector surface is regarded as abnormal for thin Sn plating thickness (~3 μm), in which the IMC layer was consumed and penetrating up to the surface of Sn-coating. This has led to poor solderability of the thin Sn plating with the solder to establish solder joint. The findings from this study have shed some light upon a better understanding of the importance of considering the adequate amount of Sn coating thickness to avoid IMC consumption at the Sn plating, better wettability properties, solderability, and solder joint quality for surface mount technology (SMT) especially for electronic lead connector applications.

Effects of In addition on microstructure and properties of SAC305 solder

In powderswith different contents (0.5−10 wt.%)were melted into the Sn−3.0Ag−0.5Cu (SAC305) solder to change the microstructure and thus improve the properties of the solder. The results showed that β-Sn(In), Ag3(Sn,In) and Cu6(Sn,In)5 phases existed in all the In-added solders, and an additional phase of InSn4 was found in the SAC305−10In solder. With increasing In addition amount, the β-Sn nucleation sites were increased and the nucleation model was changed from {101} to {301}, which refined the β-Sn grains and transformed the β-Sn morphology from large grains to interlaced grains and finally to multiple grains. As a result, a combined effect of fine grain strengthening and solid solution strengthening was achieved to increase the microhardness of the SAC305−xIn solders with increasing In addition amount.

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

In recent years, in order to adapt to the trend of low-temperature assembly and integration, low-temperature hybrid solders with multiple elements added to the tin solder matrix have been investigated. In this regard, the morphology and size of intermetallic compounds (IMCs) are altered by adding some alloying elements, and the strength of solder joints is improved to some extent. Different pad surface treatments affect the growth of IMC, which leads to various failure modes in interconnect solder joints. Therefore, it is necessary to study the interfacial reaction, microstructure and mechanical properties of hybrid solder and different metal pads to explore the growth mechanism of IMC and the failure modes of solder joints. In this paper, mixed Sn–3Ag-0.5Cu/Sn–58Bi low-temperature solder joints on Au/Ni/Cu (ENIG) and Au/Pd/Ni/Cu (ENEPIG) substrates are investigated. The results show that the addition of palladium element can change the IMC morphology, refine the grain size of the hybrid solder joints, and affect the fracture failure mode of the solder joints under shear force. The average shear strength is significantly higher than that of solder joints with ENIG surfaces under different process parameters. Thermodynamic calculations of enthalpy change and the effect of Jackson's parameter α value on IMC morphology are also investigated in this paper. The addition of palladium elements increases the α value and is more favorable to the formation of columnar grains. This provides guidance for the grain growth of IMC in hybrid solder joints with added alloying elements.

Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO2 and Al2O3 Nanoparticles at Different Reflow Times.

This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO2) and aluminium oxide (Al2O3) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of the SAC305 nanocomposite solder are comparable with thos of an SAC305 solder with a peak temperature window within a range of 240 to 250 °C. The wetting behaviour of the non-reinforced and reinforced SAC305 nanocomposite solder was determined and measured using the contact angle and spreading area and the relationships between them were studied. There is an increment in the spreading area (5.6 to 7.32 mm) by 30.71% and a reduction in the contact angle (26.3 to 18.6°) by 14.29% with an increasing reflow time up to 60 s when reinforcing SAC305 solder with 0.50 wt.% of TiO2 and Al2O3 nanoparticles. The SAC305 nanocomposite solder has a better wetting performance compared with the SAC305 solder. As the reflow time increased, the spreading area increased and the contact angle decreased, which restricted intermetallic compound growth and thus improved wettability performance.

Experimental Investigation on Laser-Induced Electrochemical Silver Plating Technology.

The silver coating is widely used in electronic device manufacturing due to its excellent conductivity and soldering properties. Conventional preparation of local silver coating often uses the preplated silver, mask high-speed silver plating, and deplated silver processes. In this paper, the laser-induced electrodeposition technique is used to perform maskless laser-induced localized electrodeposition on a copper substrate preplated with a layer of silver. After the deplated silver process, ultrathin silver coatings with high dimensional accuracy, good corrosion resistance, and good bonding were obtained. The spatial distribution of the transient temperature field under laser irradiation is studied, the variation pattern of cathode substrate current under laser irradiation is tested, and finally, the spatial distribution of the pressure field under laser irradiation is simulated by Comsol. The effect of different laser scanning methods on the coating morphology was investigated, and the experimental study of the different single pulse energy-induced localized silver coatings was systematically carried out. The results show that the localized coating obtained by cross-line scanning with a laser single pulse energy of 93 μJ is flat with a film thickness of 0.23 μm, high dimensional accuracy, and good bonding force and corrosion resistance properties. This method provides a new approach for the preparation of a localized silver coating.

Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding

PurposeThe purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.Design/methodology/approachThis study investigates the effect of adding Si3N4 NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.FindingsThe crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si3N4 NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si3N4 NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si3N4 will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.Originality/valueThe Si3N4 NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.