Chip Manufacturing Research Articles

Performance Evaluation of a Power Rotary Slicing Machine

This paper presents the performance evaluation of a power operated rotary slicer capable of slicing plantain, cocoyam, cassava among others. The machine is designed and fabricated to aid production of chips in plantain, cassava, cocoyam and other related farm products for frying and as well drying for immediate consumption and storage purposes. The machine is made up of two blades cutter and operated at speed of 1440rpm to overcome drawbacks of existing hands or power operated slicer and to meet the demand of small scale processing industries. Samples was taken for plantain, cocoyam and cassava to evaluate the efficiency and capacity of the machine. The machine has 83% efficiency and capable of producing 22.9kg/h.

Chip Appearance Inspection Using Machine Learning Techniques

In recent years, the increasing demand for chips has put forward higher requirements for chip production quality and production efficiency. After the chip manufacturing is completed before leaving the factory, it needs to be detected after packaging, which makes the development of chip detection and localization system difficult due to the small size and large number of chips and the high precision requirements for them. Therefore, this paper aims to design a fast, highprecision chip detection and positioning system for the positioning and detection needs of the chip packaging process, the chip detection and positioning system for in-depth research, to achieve the accurate positioning of the chip as well as the deformation produced by the detection of the main work is as follows: the first chapter is mainly about why this paper is mainly aimed at discovering the problems in the chip packaging process. The second chapter is about how to take pictures of the chip. Chapter 3 focuses on the pre-processing of the pictures. Chapter 4 focuses on determining whether the chip is deformed through different machine learning and deep learning techniques. Finally, the conclusion section summarizes the whole paper.

Modification of New Semiconductor Materials by Doping

In the era of information, people’s lives are inseparable from electronic equipments. Semiconductors are key materials for manufacturing electronic equipment, which can be applied in multiple fields such as integrated circuits, solar cells, and so on. However, pure semiconductors have a single property, which are difficult to meet the design and usage requirements of different electronic devices. To solve the problem, introducing heteroatoms for modification to make them have more suitable performance will be a good way. Good semiconductor performance generally relies on precise control of the doping process. Different types of semiconductor materials typically require specific doping techniques to improve its performance. Adding small amounts of heteroatoms to pure semiconductors can significantly improve their conductivity by forming p/n junctions or achieving specific functions. Doping technology has been widely used in the semiconductor manufacturing industry. It is of great significance for the manufacturing of chips, photovoltaics and other devices. At present, there are still many shortcomings in doping technology. It may come across the semiconductor structure failure caused by doping, or difficulty in meeting performance requirements for use. Thereofore, continuous research and improvement are still needed. This paper reviewed the applications and the doping techniques of various semiconductor materials including two-dimensional semiconductors and organic semiconductors. In addition, it also provides prospects for their related applications and development.

AI-Augmented Fault Detection and Diagnosis in VLSI Circuits: A Step toward Intelligent Chip Design

Fault detection and diagnosis are critical challenges in Very Large Scale Integration (VLSI) circuits, where even minor defects can cause significant performance degradation or system failure. Traditional fault detection methods often struggle with scalability and real-time analysis as circuits grow increasingly complex. This paper proposes an AI-augmented framework that leverages machine learning algorithms and neural networks to enhance the fault detection process in VLSI circuits. The proposed model not only identifies and classifies faults with high accuracy but also provides root-cause diagnostics, significantly reducing testing time and maintenance costs. Simulation results demonstrate the effectiveness of the AI-based approach in comparison with conventional techniques, showcasing improved fault coverage, faster detection, and scalability for modern chip designs. This study serves as a step toward the integration of intelligent diagnostics into chip manufacturing, paving the way for more robust and self-healing electronic systems.

Investigation of machining performance in SS904L alloy under hybrid cooling conditions

ABSTRACT Hard turns in machining present substantial obstacles to chip removal. An effective heat management system is needed to avoid tool overheating and reduce cutting capacity. Therefore, the present investigates the effectiveness of a comparative study of four cooling methods, such as dry turning, minimum quantity lubrication (MQL), cryogenic (LN2), and the hybrid Cryo-nMQL approach, on machining performance during the machining of SS904L alloy. Machining conditions included 75 and 150 m/min cutting velocities and feed rates of 0.1 and 0.2 mm/rev, respectively. Results indicate that cryo-nMQL exhibited superior performance matched to the other cooling methods, with a maximum improvement of surface roughness by 57.73% and nose wear by 13.87%, flank wear by 67.48%, crater wear by 8.42%. In addition, chip production indicates a fine lamella structure with less serration under cryo-nMQL. In addition, the combination of cryo-nMQL resulted in enhanced tool life and a notable decrease in tool wear with a research gap, indicating future work to assess the benefits of hybrid cooling methods in SS904L machining, thereby showcasing the potential of these innovative technologies in mechanical engineering applications.

Analisis Potensi Usaha Rumah Tangga (Home Industri) Emping Melinjo Di Kecamatan Kampung Melayu Kota Bengkulu

This study aims to determine the potential of emping melinjo home industry in Kampung Melayu District, Bengkulu City. This study was conducted in Kampung Melayu District, Bengkulu City using a qualitative research approach and type. Data sources from emping melinjo business owners. Data collection techniques used observation, interviews and documentation. The data analysis used in this study includes reviewing all data, data reduction, presenting data and drawing conclusions. Checking the validity of the data includes extension of participation, observer persistence, and source triangulation. The results of the study showed the potential for home industry of melinjo chips in Kampung Melayu District, Bengkulu City, there are several potentials, namely determining the capital spent to produce melinjo chips, the availability of raw materials purchased from the same area, namely Enggano, human resources, namely one business owner who has employees and 2 business owners only produce it themselves without the help of human labor, Then to support the production of melinjo chips in the form of marketing carried out by business owners, income from melinjo chips and also getting profit from the home industry of melinjo chips. By improving product quality and marketing, this business has the potential to grow, provide benefits to the community and become a source of sustainable income.

Standardization of vacuum frying techniques for the development of low-fat beetroot finger chips

Beetroot (Beta vulgaris L. ssp), is a popular root crop grown for its fleshy roots and is a nutritious and mostly consumed fresh vegetable. It is a perishable product of just two to three days after the mature stage. The beetroot can be used for the preparation of value-added products like juice, dehydrated powder, soup mix, chips, etc. The chips out-turn of beetroot finger chips under vacuum frying was about 20 %. The vacuum-fried beetroot finger chips with corn powder coating absorbed relatively less frying oil (16.79 %) when compared to those without corn powder coating chips (18.25 %). The tristimulus color of vacuum-fried beetroot finger chips with corn powder coating chips were improved. Among the vacuum-fried chips prepared under various combinations of vacuum (constant 640 mm Hg), frying temperature (3 levels), and frying duration (3 levels), it was found that the beetroot finger chips prepared with corn coating at 110 °C frying temperature for 15 minutes frying time were the best in terms of all quality parameters. The beetroot finger chip manufacturing cost was determined to be Rs. 235 per kg, and the benefit-cost ratio of production was found to be 1:1.70.

Advancing high-volume GaN manufacturing: precision simulation of electrical and geometrical deviations through current spreading

Abstract Manufacturing process deviations pose significant challenges in GaN manufacturing especially when modern technologies demand extreme chip densities. More than a thousand of each of three distinct GaN-based flip-chips were manufactured where the standard deviations of the measured voltages ranged from 13 to 23 mV. By integrating Monte Carlo and finite element methods in the simulations which relies on the theoretical models, the results were validated by comparing the voltage measurements of the three thousand manufactured chips. Validation was even successful considering the voltage deviations of the three distinct designs equivalently, i.e., affected the geometrical and electrical properties in each wafer. In addition, comparing the three designs, Chip A emerged as the optimal choice for low current resistivity. Looking ahead, our theoretical modeling and simulation hold promise for high-accuracy predictions in high-volume GaN-based chip manufacturing, enhancing reliability and performance.

PENINGKATAN PRODUKTIVITAS USAHA KERIPIK IKAN KUNIR UD FARAH DENGAN PENERAPAN TEKNOLOGI MESIN VACUUM FRYING SERTA MANAJEMEN KESELAMATAN DAN KESEHATAN KERJA (K3) PADA KARYAWAN

Panarukan District, Situbondo Regency, has marine potential that supports marine fish-based processing industries, including UD FARAH in Paowan Village, a producer of turmeric fish chips. However, UD FARAH's production capacity is still low because it uses traditional equipment such as wood stoves. Technological development is needed to increase production efficiency and quality, which is expected to increase profits and meet growing market demand. The aim of this activity is to improve employee skills in operating Vacuum Frying Machines for the production of turmeric fish chips and strengthen their understanding of occupational safety and health (K3). UD FARAH faces traditional production problems which result in less than optimal product quality and quantity, as well as working conditions that do not meet K3 standards. Solutions include the application of Vacuum Frying Machine technology and K3 training to increase production efficiency and work safety. The program also includes mentoring and evaluation to ensure long-term success. After the service activities, UD FARAH experienced a significant increase in productivity and product quality with the implementation of the Vacuum Frying Machine. Employees' knowledge of technology and K3 also increases, which contributes to work safety and efficiency. In addition, the sustainability program includes marketing strategies and product diversification, such as the development of mango chips, which utilize local resources and open up new market opportunities. It is also hoped that the sustainability of this program will reduce UD FARAH's dependence on one type of product, increase competitiveness and create added value for the local community. This activity succeeded in improving the skills of UD FARAH employees in operating vacuum frying machines and implementing K3, as well as encouraging product diversification and improving marketing strategies to increase productivity and sales.

200 mm Wafer Level Characterization at 2 K of Si/SiGe Field-Effect Transistors

Si/SiGe has proven to be an excellent spin qubit platform, but industrial production of large-scale spin-qubit chips is missing. We use field effect transistors (FETs) to monitor and develop the quality of the fabrication process on 200 mm wafers at 2 K using a cryogenic wafer prober (CWP). This mass-characterization technique provides statistics on device performance. We observe variations in drain off current and gate threshold voltage of 213 FETs. These variations are related to bias voltage conditions during CWP cooldown, which differ from qubit chip cooldown. To address this, a new FET structure with an additional top gate is introduced, effectively suppressing unintentional charge accumulations. This eliminates drain off currents and improves homogeneity of FET characteristics at 2 K. Our results highlight significant impact of bias conditions during qubit chip cooldown, which, if not accounted for in the qubit chip design, can lead to incorrect conclusions when using CWP.

Pelatihan dan Pengembangan E-commerce UMKM Produksi Keripik Desa Gunting Dalam Masa Pandemi Covid-19

Gunting Village has good potential in the UMKM sector that is developed, one example is the UMKM production of chips. However, the COVID-19 pandemic has resulted in a decrease in market demand for chip products. This is caused by the decline in people's purchasing power, limited access to marketing, and the lack of innovative types of marketing that are carried out. E-commerce is considered capable of being an alternative marketing method. The purpose of this service program is to provide assistance and training to chips UMKM owners in Gunting Village regarding online product marketing in the midst of a pandemic. The method used is the Action Research method which involves the target community group, namely the owners of UMKM chips in Gunting Village. Through the results of the Focus Group Discussion and identification of problems carried out, the agreed solution was socialization, training and mentoring activities. The service team offers efforts to expand people's knowledge about how to modify their marketing in e-commerce. It is hoped that these UMKM actors will be able to expand the range of the products they market with e-commerce features during this pandemic. Activities carried out by the service team include socialization, training and assistance regarding how important and multifunctional the market place is, and social media. The result of this activity is that the UMKM community in Gunting Village has started marketing UMKM products with e-commerce, and the virtual promotion they are doing has also been formed.

Scheduling of memory chips for final testing on parallel machines considering power constraints and deteriorating effects

This paper delves into the intricate scheduling strategies crucial for the final testing phase of memory chip manufacturing within the semiconductor industry and other related sectors. It specifically addresses the complex serial-batching scheduling problem, where memory chips are tested on parallel machines under power constraints and chip deterioration effects. The processing time for each chip is significantly influenced by both the cumulative processing time of preceding chips and the power requirements for testing. We formulate this real-world optimization problem using a mixed integer nonlinear programming model. Exact solutions for small instances are obtained using a commercial solver. However, due to the model's complexity, we also develop heuristic solutions to efficiently handle larger instances. Based on the derivation of structural properties, we develop two tailored heuristic algorithms to determine the schedule for the final testing of memory chips. Additionally, we propose a refined Variable Neighborhood Search algorithm (VNS-H) that seamlessly integrates five local search strategies with two supplementary heuristic algorithms, dynamically alternating between them to ensure a balance between computational efficiency and the quality of the solutions obtained. Additionally, we establish a lower bound to validate the effectiveness of these solutions, particularly for large-scale instances. To validate the efficacy and robustness of our proposed metaheuristic algorithm, we conduct a rigorous comparison of the VNS-H algorithm with five other metaheuristic algorithms that have promising performance in various optimization problems. The results highlight the superior performance of the VNS-H algorithm. In small-scale instances, our VNS-H algorithm achieves an average makespan that is 5.52% lower compared to the original VNS. For large-scale instances, the VNS-H algorithm reduces the average makespan by 13.46% compared to VNS. Finally, we discuss the managerial implications of our findings, providing insights specifically tailored to semiconductor manufacturing enterprises based on the outcomes of this study.

Use of the salicornia plant as a substitute for salt in the recipe for manufacturing meat chips

In Kazakhstan, the meat processing industry is represented mainly by traditional assortments, such as steaks, meat tenderloins, and sausages. However, meat industry enterprises understand the need to expand the range of meat products towards new products that appear on world food markets. One of them is food products for instant preparation and consumption, the so-called snacks, which appeared in connection with the need of part of the population to reduce the time for preparing food, and for the younger generation, products that are modern in their consumer characteristics. In turn, research in the development of new food products must solve pressing issues related to increasing their biological and nutritional value based on the use of natural raw materials and the minimal use of various additives and substances that subsequently have a negative impact on health. For example, a product such as meat chips has appeared on foreign markets, which are thin, round-shaped plates with a crispy texture and crust, and a salty taste. The presence of animal protein in it makes it a source of amino acids necessary for the body, on the one hand, but on the other hand, the use of table salt in the recipe in the amount necessary to impart a salty taste is not entirely beneficial for people suffering from high blood pressure, having kidney problems, etc. The goal of our research is to reduce the amount of table salt in meat chips using Salicornia plant raw materials containing natural sodium chloride, as well as various biological substances and mineral elements. As a research methodology, experimental methods were used, including selection and preparation of the Salicornia plant, selection of the ratio of table salt and Salicornia in the recipe for the production of meat chips, expert methods for determining the taste, smell, color of the finished product. It has been established that the species Salicornia E. grows in large quantities on the territory of Kazakhstan, in which the content of 32.89% Na and 33.51% Cl, as well as elements such as Mg -1.8%, K -1.94%, is confirmed by X-ray spectral method. Ca -0.74%, silicon -1.32%. To preserve the biologically active substances of the Salicornia plant during its preparation, drying is carried out at a temperature not exceeding 500C, and in the recipe for the manufacture of semi-finished minced meat, use only in powder form. It has been established that to preserve the salty taste without a pronounced herbal taste, as well as the color inherent in meat products, the ratio of table salt and powdered Salicornia should be 1:1.

The design and fabrication of thermoplastic microfluidic chips with integrated micropillars for particle separation

Microfluidic technology utilizing the deterministic lateral displacement (DLD) method holds significant promise for efficiently separating micro-particles and biological cells. Despite the notable high throughput advantages associated with DLD chips, their widespread application is impeded by the substantial manufacturing costs of tens of thousands of micropillars. This study aims to explore the feasibility of employing the injection molding method for the mass production of DLD microfluidic chips. A multistage DLD chip with varied critical diameters was designed to isolate white blood cells from the human whole blood. The separation effectiveness was verified with the polydimethylsiloxane chip fabricated by standard soft lithography. Subsequently, nickel mold inserts were electroformed to fabricate thermoplastic DLD chips via the injection molding. The replication quality of micropillars under different molding parameters was studied. The capability of injection-molded chips to effectively achieve particle separation was validated. Results showed that thermoplastic chips with good replication quality were obtained, providing a scale-up production strategy for fabricating polymer-based microfluidic chips for disposable separation applications.

Training on Processing Pear Fruit Skin with the Application of Zero Waste to Become a Fruit Skin Chips Product as an Effort to Realize an Ecotourism Village

Training on Processing Pear Fruit Skin with the Application of Zero Waste to Become a Fruit Skin Chips Product as an Effort to Realize an Ecotourism Village

Reverse Logistics Analysis of Chips Products Towards Green Supply Chain Management in MSMEs

The food industry has the nature of perishable goods, so there is always the possibility of products being returned to the manufacturer, namely reverse logistics. Reverse logistics include collection, sorting, recycling, redistribution, and disposal. One of the main challenges MSMEs face is accumulating unsold or damaged products. Chip products not sold out in the stores where they are kept often have to be recalled, resulting in a buildup of products in the warehouse. This study aims to analyze the practice of reverse logistics of banana chip products in one MSME called A3 and evaluate the extent to which they are based on Green Supply Chain Management (GSCM). The research method used is descriptive qualitative; data collection is done through interviews, direct observation, and analysis of related documents. The results showed that A3 had implemented reverse logistics practices by considering environmental aspects such as production waste management. However, some areas can still be improved further to maximize the contribution to Green Supply Chain Management. The implication of this study is to provide a deeper understanding of reverse logistics practices in the context of MSMEs and provide recommendations for other MSMEs to improve the conformity of their practices with the concept of Green Supply Chain Management.

A Novel End-to-End Deep Learning Framework for Chip Packaging Defect Detection.

As semiconductor chip manufacturing technology advances, chip structures are becoming more complex, leading to an increased likelihood of void defects in the solder layer during packaging. However, identifying void defects in packaged chips remains a significant challenge due to the complex chip background, varying defect sizes and shapes, and blurred boundaries between voids and their surroundings. To address these challenges, we present a deep-learning-based framework for void defect segmentation in chip packaging. The framework consists of two main components: a solder region extraction method and a void defect segmentation network. The solder region extraction method includes a lightweight segmentation network and a rotation correction algorithm that eliminates background noise and accurately captures the solder region of the chip. The void defect segmentation network is designed for efficient and accurate defect segmentation. To cope with the variability of void defect shapes and sizes, we propose a Mamba model-based encoder that uses a visual state space module for multi-scale information extraction. In addition, we propose an interactive dual-stream decoder that uses a feature correlation cross gate module to fuse the streams' features to improve their correlation and produce more accurate void defect segmentation maps. The effectiveness of the framework is evaluated through quantitative and qualitative experiments on our custom X-ray chip dataset. Furthermore, the proposed void defect segmentation framework for chip packaging has been applied to a real factory inspection line, achieving an accuracy of 93.3% in chip qualification.

Improving the working distance for near-field lithography with supercell photonic crystal

Near-field lithography technology plays a vital role in chip manufacturing. However, near-field lithography devices with acceptable working distance (WD) have become a long-term pursuit for researchers. Here, a one-dimensional supercell photonic crystal (SPC) is proposed for near-field lithography. The simulation results show that the PCs could provide an air WD of over 100 nm in interference lithography and produce patterns with a resolution reach ∼67 nm (∼λ/6). The analyses indicate that using SPCs in interference lithography can make it more suitable for practical manufacturing. Furthermore, this type of PC can also be used in direct writing lithography. The simulation results show that the direct writing lithography could be realized with a WD of 100 nm, and the full width at half maximum of the focal spot is ∼137 nm. The principle presents a new method for controlling the evanescent waves, and the method would greatly promote the development and application of near field lithography.

Enhancing Slurry Stability and Surface Flatness of Silicon Wafers through Organic Amine-Catalyzed Synthesis Silica Sol.

The stability of slurries used for chemical mechanical polishing (CMP) is a crucial concern in industrial chip production, influencing both the quality and cost-effectiveness of polishing fluids. In silicon wafer polishing, the conventional use of commercial neutral silica sol combined with organic bases often leads to slurry instability. To address this issue, this study proposes organic amines-specifically ethanolamine (MEA), ethylenediamine (EDA), and tetramethylammonium hydroxide (TMAOH)-as catalysts for synthesizing alkaline silica sol tailored for silicon wafer polishing fluids. Sol-gel experiments and zeta potential measurements demonstrate the efficacy of this approach in enhancing the stability of silica sol. The quantitative analysis of surface hydroxyl groups reveals a direct correlation between enhanced stability and increased hydroxyl content. The application of the alkaline silica sol in silicon wafer polishing fluids improves polishing rates and enhances surface flatness according to atomic force microscopy (AFM). In addition, electrochemical experiments validate the capability of this polishing solution to mitigate corrosion on silicon wafer surfaces. These findings hold significant implications for the advancement of chemical mechanical polishing techniques in the field of integrated circuit fabrication.

Free-space direct nanoscale 3D printing of metals and alloys enabled by two-photon decomposition and ultrafast optical trapping.

Nanoscale three-dimensional (3D) printing of metals and alloys has faced challenges in speed, miniaturization and deficiency in material properties. Traditional nanomanufacturing relies on lithographic methods with material constraints, limited resolution and slow layer-by-layer processing. This work introduces polymer-free techniques using two-photon decomposition and optical force trapping for free-space direct 3D printing of metals, metal oxides and multimetallic alloys with resolutions beyond optical limits. This method involves the two-photon decomposition of metal atoms from precursors, rapid assembly into nanoclusters via optical forces and ultrafast laser sintering, yielding dense, smooth nanostructures. Enhanced near-field optical forces from laser-induced localized surface plasmon resonance facilitate nanocluster aggregation. Our approach eliminates the need for organic materials, layer-by-layer printing and complex post-processing. Printed Mo nanowires show an excellent mechanical performance, closely resembling the behaviour of single crystals, while Mo-Co-W alloy nanowires outperform Mo nanowires. This innovation promises the customizable 3D nanoprinting of high-quality metals and metal oxides, impacting nanoelectronics, nanorobotics and advanced chip manufacturing.