Printed Circuit Board Inspection System Research Articles

Quality Analysis of Printed Circuit Board Track and Soldering

Bare Printed Circuit Board (PCB) is a circuit composed with non-placement of electronic components. Quality checking plays an important role in the manufacturing industry. In order to help the small scale industry, students and researchers to identify the defects, this paper presents an efficient algorithm for an automated visual PCB inspection system that will automatically detect any defect on PCBs. The defects are been detected by image subtraction algorithm. This algorithm utilizes a template and a defective image of a bare PCB with same size variations and orientations. There are several defects presented in a PCB. Defects like missing hole, open circuit, short circuit is been identified using the automated PCB inspection system.

PCB Fault Detection Using Image Processing

The importance of the Printed Circuit Board inspection process has been magnified by requirements of the modern manufacturing environment where delivery of 100% defect free PCBs is the expectation. To meet such expectations, identifying various defects and their types becomes the first step. In this PCB inspection system the inspection algorithm mainly focuses on the defect detection using the natural images. Many practical issues like tilt of the images, bad light conditions, height at which images are taken etc. are to be considered to ensure good quality of the image which can then be used for defect detection. Printed circuit board (PCB) fabrication is a multidisciplinary process, and etching is the most critical part in the PCB manufacturing process. The main objective of Etching process is to remove the exposed unwanted copper other than the required circuit pattern. In order to minimize scrap caused by the wrongly etched PCB panel, inspection has to be done in early stage. However, all of the inspections are done after the etching process where any defective PCB found is no longer useful and is simply thrown away. Since etching process costs 0% of the entire PCB fabrication, it is uneconomical to simply discard the defective PCBs. In this paper a method to identify the defects in natural PCB images and associated practical issues are addressed using Software tools and some of the major types of single layer PCB defects are Pattern Cut, Pin hole, Pattern Short, Nick etc., Therefore the defects should be identified before the etching process so that the PCB would be reprocessed. In the present approach expected to improve the efficiency of the system in detecting the defects even in low quality images

Microfocus X-ray printed circuit board inspection system

In order to solve the problem of digital radiography for printed circuit board (PCB) defect inspection, a new inspection system for PCB defect inspection with high resolution X-ray is proposed and implemented in this paper. The influence of the focus size of X-ray source on imaging formation is analyzed to get the best geometrical magnification. Moreover, the relationship between the resolution of intensifier and geometrical magnification is presented by analyzing the performance of MCP-X intensifier, which results in calculating the comprehensive resolution of this system. The experiment result indicates that the measurements on defect character is achieved by inspection software, and the defect analysis accuracy on ball grid array (BGA) solder joint of circuit board achieves minimum resolution of 0.03mm. As a result, this system succeeds in implementing invisible solder joint defect inspection on BGA.

Study of Printed Circuit Board Inspection System

Presently, the inspection of printed wiring boards includes the conductivity, the capacitance, the appearance inspections, and so forth. There are problems of the conduction defects, the effect of the stray capacitance and the mistaken image in these inspections. In order to resolve these problems, in our research a pin probe with a dielectric substance is produced.

Bare PCB Inspection System With SV-GMR Sensor Eddy-Current Testing Probe

This paper describes bare printed circuit board (PCB) inspection based on eddy-current testing (ECT) technique with high scanning speed. A high-frequency ECT probe composed of a meander coil as an exciting coil and the spin-valve giant magnetoresistance (SV-GMR) sensor was fabricated and is proposed. The ECT probe was designed based on crack inspection over flat surface, especially suitable for microdefect detection on high-density bare PCB. The ECT signal detected by the SV-GMR sensor was acquired by high-speed A/D converter for applying the signal processing based on digital technique. Harmonic analysis based on Fourier transform was used to analyze the ECT signal at fundamental frequency in order to increase inspection speed and this technique allowed the ECT probe to scan bare PCB, with high sampling frequency and with high-spatial resolution inspection. Experimental results verified the possibility and the performance of the proposed PCB inspection system based on ECT technique