Abstract
In order to solve the problem of digital radiography for printed circuit board (PCB) defect inspection, a new inspection system for PCB defect inspection with high resolution X-ray is proposed and implemented in this paper. The influence of the focus size of X-ray source on imaging formation is analyzed to get the best geometrical magnification. Moreover, the relationship between the resolution of intensifier and geometrical magnification is presented by analyzing the performance of MCP-X intensifier, which results in calculating the comprehensive resolution of this system. The experiment result indicates that the measurements on defect character is achieved by inspection software, and the defect analysis accuracy on ball grid array (BGA) solder joint of circuit board achieves minimum resolution of 0.03mm. As a result, this system succeeds in implementing invisible solder joint defect inspection on BGA.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Optik - International Journal for Light and Electron Optics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
