WS2 films exhibit excellent tribological properties in a vacuum, but they are prone to failure due to oxidation in air, which severely limits their application. Cu has great potential to improve the tribological properties of WS2, similar to that of Au and Ag. Thus, to clarify the contribution of Cu to the tribological properties of WS2 films and provide new insight for the development of new multi-environmentally adaptable films, this study deposited WS2-Cu composite films under different sputtering powers of the Cu target by magnetron sputtering systems, and the Cu target was supplied by DC power. Then, the structure of films was analyzed by FESEM, EDS and XPS. The results show that Cu is difficult to uniformly dope on the WS2 film at a high sputtering power of Cu target, showing possibly low solubility of Cu in WS2 film. However, a uniform and dense WS2-Cu composite film was deposited under the lower sputtering power of Cu target. Furthermore, the results of the nanoindentation test demonstrated that the WS2-Cu composite films exhibited high hardness (6.6 GPa). Finally, the tribological properties of the WS2-Cu films were examined, and their friction interface was characterized by SEM, EDS and TEM. The WS2-Cu film demonstrated superior tribological behavior in air (the average friction coefficient is 0.09), based on a special sliding interface, low oxidation levels of WS2 and Cu-rich transfer film. This study provides a new insight and a new method for improving the environmental adaptation ability of WS2 film.
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