Ultrafine-grained tungsten shows strong potential for ballistic applications because of its increased strength, and higher propensity for strain localization compared with coarse-grained materials. However, tungsten typically exhibits poor ductility at room temperature and fractures by a brittle intergranular mechanism. This study evaluates the effects of boron as a sintering aid and grain-boundary strengthening additive for ultrafine-grained tungsten prepared by powder metallurgical methods. While boron did not improve the sinterability of nanocrystalline tungsten in this study, low concentrations of boron delivered a notable increase in strength, accompanied with a transition from intergranular to transgranular fracture. These significant changes in fracture behavior show promise for improving the low-temperature ductility of tungsten; however, the corresponding improvements to plastic strain to failure were less significant than anticipated.