A discussion of dc conduction mechanisms in thermally co-evaporated amorphous thin films of Al – In 2 O 3– SnO 2– Al structure is presented. Composition (in molar %), film thickness, substrate temperature, and post deposition annealing have profound effects on the electrical properties of the films. The effects of temperature on the I – V characteristics and electrical conductivity of Al – In 2 O 3– SnO 2– Al structure are also reported. The values of dielectric constants estimated by capacitance measurements suggest that high-field conduction mechanism is predominantly of Poole–Frenkel type. At low temperature and low field the electron hopping process dominates but at higher temperature the conduction takes place by transport in the extended states (free-band conduction). The transition from hopping to free band conduction is due to overlapping of localized levels and the free band. The increase in the formation of ionized donors with increase in temperature during electrical measurements indicates that electronic part of the conductivity is higher than the ionic part. The initial increase in conductivity with increase in Sn content in In 2 O 3 lattice is caused by the Sn atom substitution of In atom, giving out one extra electron. The decrease in electrical conductivity above the critical Sn content (10 mol % SnO 2) is caused by the defects formed by Sn atoms, which act as carrier traps rather than electron donors. The increase in electrical conductivity with film thickness is caused by the increase in free carriers density, which is generated by oxygen vacancy acting as two electrons donor. The increase in conductivity with substrate temperature and annealing is due either to the severe deficiency of oxygen, which deteriorates the film properties and reduces the mobility of the carriers or to the diffusion of Sn atoms from interstitial locations into the In cation sites and formation of indium species of lower valence state so that the In 3+ oxidation state may be changed to the In 2+ oxidation state.
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