Unlike traditional hydrogels, solvent-free ionic gels eliminate leakage and solvent volatilization, making them suitable for applications in electronic skin, sensing, and other fields due to their excellent conductivity and flexibility. However, designing solvent-free ionic gels with exceptional fatigue resistance, high ionic conductivity, and toughness remains a significant challenge. We address this challenge by employing small molecule/polymer heating self-assembly to regulate the synergistic effects of various components on the hierarchical superstructure. A multi-stage network was formed through the free radical polymerization of 3-Ethyl-1-vinyl-1H-imidazol-3-ium bromide ([C2VIm]Br), lipoic acid (LA), acrylic acid (AA), and hydroxypropyl cellulose (HPC), stabilized by dense hydrogen bonding and polymer chain entanglement. The resulting HPC/LA/AA/iLs (HLAI) ionic gel exhibits exceptional properties: excellent flexibility (with an elongation at break of 4222 %), toughness (1.03 MJ/m3), high ionic conductivity (3.29 × 10−2 S/m), and outstanding fatigue resistance (with a resilience of 91.9 % after 1000 load-unloading cycles at 50 % strain). Additionally, it shows low sensitivity to crack propagation (50 % notched sample can be stretched to 9 times without breaking) and good environmental stability, demonstrating excellent sensing sensitivity and stability (GF=3.23). The conductive ionic gel features a sophisticated hierarchical superstructure that synergistically enhances its properties at the molecular level. The integration of dynamic disulfide bonds, achieved through the polymerization of Lipoic acid, imparts remarkable self-healing capabilities and superior fatigue resistance. Additionally, the incorporation of a rigid HPC structure with dense cross-linking points bolsters elasticity, fracture resistance, and resilience. The gel’s ionic conductivity and sensing sensitivity are significantly enhanced by the inclusion of ionic liquids with polymerizable double bonds, making it an ideal material for applications requiring both flexibility and conductivity. This work presents a novel strategy for designing high-performance multi-stage network solvent-free ionic gels, opening up exciting possibilities for biomimetic electronic skin applications.
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