A local contact formation process and integration scheme have been developed for the fabrication of rear passivated point contact solar cells. Conversion efficiency of 19.6% was achieved using <svg style="vertical-align:-0.1638pt;width:66.612503px;" id="M1" height="11.225" version="1.1" viewBox="0 0 66.612503 11.225" width="66.612503" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns="http://www.w3.org/2000/svg"> <g transform="matrix(.017,-0,0,-.017,.062,10.963)"><path id="x31" d="M384 0h-275v27q67 5 81.5 18.5t14.5 68.5v385q0 38 -7.5 47.5t-40.5 10.5l-48 2v24q85 15 178 52v-521q0 -55 14.5 -68.5t82.5 -18.5v-27z" /></g><g transform="matrix(.017,-0,0,-.017,8.222,10.963)"><path id="x35" d="M153 550l-26 -186q79 31 111 31q90 0 141.5 -51t51.5 -119q0 -93 -89 -166q-85 -69 -173 -71q-32 0 -61.5 11.5t-41.5 23.5q-18 17 -17 34q2 16 22 33q14 9 26 -1q61 -50 124 -50q60 0 93 43.5t33 104.5q0 69 -41.5 110t-121.5 41q-53 0 -102 -20l38 305h286l6 -8
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t96 -62.5q53 0 78 45.5t25 105.5q0 68 -35 116t-99 48z" /></g><g transform="matrix(.017,-0,0,-.017,28.314,10.963)"><path id="xD7" d="M528 54l-36 -38l-198 201l-198 -201l-36 38l197 200l-197 201l36 38l198 -202l198 202l36 -38l-197 -201z" /></g><g transform="matrix(.017,-0,0,-.017,42.066,10.963)"><use xlink:href="#x31"/></g><g transform="matrix(.017,-0,0,-.017,50.226,10.963)"><use xlink:href="#x35"/></g><g transform="matrix(.017,-0,0,-.017,58.385,10.963)"><use xlink:href="#x36"/></g> </svg> mm, pseudo square, p-type single crystalline silicon wafers. This is a significant improvement when compared to unpassivated, full area aluminum back surface field solar cells, which exhibit only 18.9% conversion efficiency on the same wafer type. The effect of rear contact formation on cell efficiency was studied as a function of contact area and contact pitch, hence the metallization fraction. Contact shape and the thickness of Al-BSF layer were found to be heavily dependent on the laser ablation pattern and contact area. Simulated cell parameters as a function of metallization showed that there is a tradeoff between open circuit voltage and fill factor gains as the metallization fraction varies. The rear surface was passivated with an Al<sub >2</sub>O<sub >3</sub> layer and a <svg style="vertical-align:-3.27605pt;width:35.3125px;" id="M2" height="15.5125" version="1.1" viewBox="0 0 35.3125 15.5125" width="35.3125" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns="http://www.w3.org/2000/svg"> <g transform="matrix(.017,-0,0,-.017,.062,11.363)"><path id="x53" d="M409 504l-29 -5q-16 60 -44.5 96t-86.5 36q-54 0 -82.5 -32t-28.5 -77q0 -51 30.5 -82.5t96.5 -65.5l35.5 -18t33 -19.5t33.5 -23.5l27 -25.5t24.5 -32t13.5 -36.5t6 -45q0 -80 -62 -134.5t-160 -54.5q-47 0 -98 15q-22 7 -50 21q-8 23 -27 155l30 7q7 -27 18 -52
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