Plating Deposition Research Articles

Mechanical properties and corrosion-electrochemical behavior of multilayer coatings of Ni—P and W—C systems, obtained by methods of electoless plating and chemical vapor deposition. Part 2. Corrosion and electrochemical behavior of coatings

Новые технологии, Химическая промышленность, Химическая технология, Научные журналы, Защита от коррозии, Технология металлов, Свойства материалов, Технические журналы, Наука и технологии, Справочная литература, Научные разработки

Discharge characterization and technological application of an arc ion plating with a hollow cathode vacuum arc

In an effort to reduce macroparticle defects in arc ion plating, a hollow cathode vacuum arc was added to an arc ion plating deposition chamber, so that the discharge from the hollow cathode vacuum arc was between the target and the substrate. AlTiN coatings were deposited using this technique (hollow cathode vacuum arc enhanced arc ion plating or HCVA-AIP) on high-speed steel substrates, and analyzed using scanning electron microscopy and X-ray diffraction. The hollow cathode vacuum arc was found to reduce the number and size of macroparticles in the deposited coatings and to increase the deposition rate. The hollow cathode vacuum arc also reduces the arc ion plating target voltage, by up to 29% (to 12 V) under the conditions studied here. Using this technique, the rate of Al ionization in the target is enhanced, resulting in the formation of AlN in the coating. This effect is strengthened at a higher hollow cathode vacuum arc discharge current.

Improvement in the working life of a micro journal bearings with an electroless Ni–P coating

The improvement of working life is the main purpose of this paper to evaluate the mechanical properties of the electroless Ni–P coatings of radial micro journal bearings. The study was carried out using different plating parameter combinations, namely, pH values of the plating solution (6, 7, and 8), deposition time (10, 20, and 30 min), and bath temperature (60, 80, and 95 °C). The structure, surface morphology, hardness, and wear resistance of the electroless Ni–P coatings were measured and analyzed. The optimum combination of plating parameters for minimum wear is a pH value of 8, deposition time of 30 min, and bath temperature of 95 °C. When the Ni–P film is annealed at 400 °C, the hardness, wear and surface roughness can get the best values of 960 HV, 0.1 mg, and 0.177 μm, respectively, and this is because the Ni–P coating has changed from an amorphous phase to a crystalline composite phase (Ni + Ni3P) structure. However, as the annealing temperature continues to increase; the hardness, wear, and surface roughness begin to deteriorate. The coherent relationship of the crystalline composite phase is broken, the grains of the Ni–P coating will grow, and the tensile stress of the Ni–P coating will increase.

Influence of the Nickel Plating Electrolyte Composition and Deposition Mode on the Functional Properties of Nickel-Boron Coatings

Influence of the Nickel Plating Electrolyte Composition and Deposition Mode on the Functional Properties of Nickel-Boron Coatings

Mechanical properties and corrosion-electrochemical behavior of multilayer coatings of Ni—P and W—C system, obtained by methods of electoless plating and chemical vapor deposition. Part 1. Structure and mechanical properties of coatings

Новые технологии, Химическая промышленность, Химическая технология, Научные журналы, Защита от коррозии, Технология металлов, Свойства материалов, Технические журналы, Наука и технологии, Справочная литература, Научные разработки

Hybrids of glass fibers coated with carbon nanotubes and nickel for high‐performance electromagnetic wave absorption composites

AbstractTo expand the application of insulating glass fiber (GF) in the field of microwave absorption, one type of GF hybrids with carbon nanotubes (CNTs) and nickel (Ni) was successfully synthesized by chemical vapor deposition and electroless plating methods. By changing the reaction conditions, the morphology of GF hybrids including CNT's length, CNT's growth density, and Ni′s thickness could be adjusted. The as‐produced hybrids were used as multifunctional reinforcement to fabricate epoxy composites. The dielectric properties of composites were particularly measured from 1 to 18 GHz. It was found that the variation of GF hybrids structure significantly changed the dielectric properties of the composites in the tested frequency range. Furthermore, the analytical simulation work based on the experimental results was conducted for optimizing the structural parameters of multilayered composites. The results showed that the best reflection loss of −60 dB with a −10 dB range of 5.6 GHz could be obtained in an absorber with a triple‐layered structure composed by GF‐CNTs/epoxy with different CNT contents and GF‐CNTs@Ni/epoxy. Thus, the proposed hybrid method might be quite efficient for developing composites that can achieve high‐performance electromagnetic absorbing.

Charactarization of Formaldehyde-Free Electro-Less Copper Plating for Semi-Additive Process

Abstract Typically, industrial electroless copper plating solutions use formaldehyde as a reducing agent. However, since formaldehyde has a strong odor and is a carcinogenic substance, it has an adverse effect on the working environment and the human body. Therefore, an electro-less copper plating solution containing no formaldehyde is desired. We have researched and developed a formaldehyde-free electro-less copper plating solution and evaluated its properties for applications such as panel level package (PLP). Price is the main reason for selecting agents with reducing power to copper for use in the plating market. We promoted to develop the plating solution using sodium hypophosphite as a reducing agent, which is the next least expensive after formalin solution. The reducing agent used in this plating solution has low catalytic activity for copper. As a result, when the palladium catalyst on the resin is covered with copper plating, the plating deposition rate is reduced. In order to prevent the deposition reaction from stopping during plating, a metal salt with high catalytic activity for this reducing agent is plated. The method of adding to the liquid was carried out. As a result, the bath stability of the development bath is excellent because no Cannizzaro reaction or disproportionate reaction of the first copper ion occurs, unlike ordinary electro-less copper plating solutions. This is a major advantage in terms of running costs and requirements for ancillary the plating equipment. When the characteristics of the plating film by development bath were examined, the internal stress was found to be as low as 150 MPa on the tensile side. The adhesion to the ABF resin was high, ranging from 500 to 700 gf/cm. Also it exhibits excellent plating deposition inside blind via hole (BVH) which is equivalent to that of general electro-less copper plating solution, it can be applied to semi-additive process package boards where electro-less copper plating film is etched.

Preparation, Characterization, and Activity of Pd/PSS-Modified Membranes in the Low Temperature Dry Reforming of Methane with and without Addition of Extra Steam.

The external surface of a commercial porous stainless steel (PSS) was modified by either oxidation in air at varying temperatures (600, 700, and 800 °C) or coating with different oxides (SiO2, Al2O3, and ZrO2). Among them, PSS-ZrO2 appears as the most suitable carrier for the synthesis of the Pd membrane. A composite Pd membrane supported on the PSS-ZrO2 substrate was prepared by the electroless plating deposition method. Supported Ru catalysts were first evaluated for the low-temperature methane dry reforming (DRM) reaction in a continuous flow reactor (CR). Ru/ZrO2-La2O3 catalyst was found to be active and stable, so it was used in a membrane reactor (MR), which enhances the methane conversions above the equilibrium values. The influence of adding H2O to the feed of DRM was investigated over a Ru/ZrO2-La2O3 catalyst in the MR. Activity results are compared with those measured in a CR. The addition of H2O into the feed favors other reactions such as Water-Gas Shift (RWGS) and Steam Reforming (SR), which occur together with DRM, resulting in a dramatic decrease of CO2 conversion and CO production, but a marked increase of H2 yield.

Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)

Lithography is the most commonly used method for the selective metallisation of non-conductive surfaces in the manufacture of electronic devices such as printed circuit boards and antennae. However, when used in subtractive mode, lithography results in the generation of large amounts of organic solvent and metal containing waste and requires high initial capital investment. For these reasons, additive methods of selective metallisation are being widely investigated. In this work, a novel additive approach of Selective Metallisation using a Magnetic Field (SMMF) was studied. This method uses a magnetic catalyst to initiate the electroless plating process. Magnetic catalyst particles composed of magnetite-silicon dioxide-silver were synthesised by a wet-chemical procedure. Their composition was analysed by scanning electron microscopy and energy dispersive X-ray spectroscopy and the phase formation was confirmed by X-ray diffractometry. Catalytic activity towards formaldehyde oxidation and the magnetic properties of particles were confirmed by cyclic voltammetry and vibrating sample magnetometry, respectively. The results showed that the particles can be used as a catalyst for electroless copper plating and are attracted by the magnetic field. The pattern of deposition of the magnetic catalyst is defined by the magnetic field. Two different configurations of magnet and substrate were used to deposit the catalyst dispersion onto the substrate surface. In both cases, the particles were attracted by the magnetic field and deposited exclusively where the magnetic field was applied. Subsequent electroless copper plating also only occurred at these areas. Parallel lines of electroless copper were obtained. The effect of the magnetic field on magnetic catalyst deposition and subsequent electroless plating was studied and key process-specific defects were identified.

Effects of Alkaline Zinc Bath Formulations on Electrochemical Corrosion Behavior of Electrogalvanized Coatings

The effects of alkaline noncyanide zinc plating bath formulation on the plating characteristics and deposit properties are investigated. Scanning electron microscope and x-ray diffractometer are used to study the surface morphology and texture of the zinc deposits, respectively. Uniform and compact coatings with a dominant (110) texture are obtained for all of the bath formulations. Nevertheless, significant differences in surface morphology and relative preferences for the (110) and (100) planes were found to result from the concentrations of zinc and sodium hydroxide in the bath. Electrochemical impedance spectroscopy and potentiodynamic polarization scan were used to evaluate the corrosion resistance. The coatings with a moderate Zn (8 g/L to 11 g/L) and controlled NaOH (120 g/L) contents show good corrosion resistance, with the corrosion current and corrosion rate being the lowest at 8 g/L of Zn and 120 g/L of NaOH. The ratios of texture coefficient, morphology, and compressive residual stress from different bath composition contribute to the corrosion-resistant property. The findings from this work should provide useful information regarding electrogalvanized zinc coatings with enhanced corrosion resistance.

A rice tubulin tyrosine ligase-like 12 protein affects the dynamic and orientation of microtubules.

The detyrosination/retyrosination cycle is the most common post-translational modification of α-tubulin. Removal of the conserved C-terminal tyrosine of α-tubulin by a still elusive tubulin tyrosine carboxypeptidase, and religation of this tyrosine by a tubulin tyrosine ligase (TTL), are probably common to all eukaryotes. Interestingly, for plants, the only candidates qualifying as potential TTL homologs are the tubulin tyrosine ligase-like 12 proteins. To get insight into the biological functions of these potential TTL homologs, we cloned the rice TTL-like 12 protein (OsTTLL12) and generated overexpression OsTTLL12-RFP lines in both rice and tobacco BY-2 cells. We found, unexpectedly, that overexpression of this OsTTLL12-RFP increased the relative abundance of detyrosinated α-tubulin in both coleoptile and seminal root, correlated with more stable microtubules. This was independent of the respective orientation of cortical microtubule, and followed by correspondingly changing growth of coleoptiles and seminal roots. A perturbed organization of phragmoplast microtubules and disoriented cell walls were further characteristics of this phenotype. Thus, the elevated tubulin detyrosination in consequence of OsTTLL12 overexpression affects structural and dynamic features of microtubules, followed by changes in the axiality of cell plate deposition and, consequently, plant growth.

Monitoring metallic sub-micrometric lithium structures in Li-ion batteries by in situ electron paramagnetic resonance correlated spectroscopy and imaging

Monitoring the formation of dendrites or filaments of lithium is of paramount importance for Li-based battery technologies, hence the intense activities in designing in situ techniques to visualize their growth. Herein we report the benefit of correlating in situ electron paramagnetic resonance (EPR) spectroscopy and EPR imaging to analyze the morphology and location of metallic lithium in a symmetric Li/LiPF6/Li electrochemical cell during polarization. We exploit the variations in shape, resonance field and amplitude of the EPR spectra to follow, operando, the nucleation of sub-micrometric Li particles (narrow and symmetrical signal) that conjointly occurs with the fragmentation of bulk Li on the opposite electrode (asymmetrical signal). Moreover, in situ EPR correlated spectroscopy and imaging (spectral-spatial EPR imaging) allows the identification (spectral) and localization (spatial) of the sub-micrometric Li particles created by plating (deposition) or stripping (altered bulk Li surface). We finally demonstrate the possibility to visualize, via in situ EPR imaging, dendrites formed through the separator in the whole cell. Such a technique could be of great help in mastering the Li-electrolyte interface issues that plague the development of solid-state batteries.

Effect of Compressive Residual Stress on Film Formed by Mechanochemical Multifunction Cavitation Processing

Recently, mechanochemical multifunction cavitation (MC-MFC) was developed to improve the corrosion resistance of the magnesium surface. MFC is a technology that combines water jet peening and ultrasound cavitation. MC-MFC is a technology that adds phosphoric acid to water. It can improve the corrosion resistance by forming a phosphate film on the Mg surface. Conventional anodic oxidation, plating, and chemical vapor deposition can improve corrosion resistance by forming a film on the Mg surface, but it is difficult to improve characteristics such as compressive residual stress on the surface. MFC-treated surfaces have previously imparted various properties such as imparting compressive residual stress necessary to improve the fatigue strength to Al alloys and Cr-Mo steels. In this study, the effect of film formed on MC-MFC processed surface on compressive residual stress was investigated.

Fabrication of Electrically Conductive Patterns on Acrylonitrile-Butadiene-Styrene Polymer Using Low-Pressure Cold Spray and Electroless Plating

AbstractPrevious studies have shown that metallic coatings can be successfully cold sprayed (CS) onto several polymer substrates. However, the electrical performance of the cold-sprayed polymers is not generally enough to utilize them as an electronic device. In this study, an environment-friendly metallization technique has been proposed to achieve highly electrically conductive metal patterns onto polymer substrates using cold spray deposition and subsequent electroless copper plating (ECP). Copper feedstock powder was CS onto the surface of the acrylonitrile-butadiene-styrene (ABS) parts. The as-CS powders then served as the activating agent for the selective ECP to modify the surface of the polymers to be electrically conductive. A series of characterizations were conducted to investigate the morphology, analyze the surface chemistry, evaluate the electrical performance, mechanical adhesion, and mechanical strength performance of the fabricated coatings. Moreover, simple electrical circuits were presented for the ABS parts through the described method. Findings demonstrated that low-pressure cold spray copper deposition followed by the ECP processes could be used as an environmental-friendly manufacturing method of electrically conductive patterns on ABS polymer.

Performance degradation due to anodic failure mechanisms in lithium-ion batteries

We report a mechano-chemical model for anodic degradation during fast-charging of nickel-manganese-cobalt (NMC)/graphite (C) cell due to SEI growth, lithium plating/stripping, dead lithium storage, and film fracture of composite SEI and plated lithium film. Degradation of the battery is analyzed for a range of charging rates from 1 to 6 C-rates, and the influence of plating mechanisms – lithium plating and dead lithium deposition and recovery during stripping – on the film resistance of the anode are accounted for in the model. Dynamic evolution of the interfacial properties is modeled using rule-of-mixture approach. Model predictions of plating associated stress fields are used to compute critical energy release rate for film cracking. The results indicate an increased tendency of fracture for thinner SEI film with lithium plating at higher charging rates. The process of reforming the cracked film absorbs a significant portion of the electrode current thereby reducing the cell capacity and plating efficiency. The mechano-chemical model provides an extensive analytical framework for understanding the synergistic coupling of anodic degradation mechanisms, prognosticating conditions of SEI failure, and evaluating the capacity fade and efficiency of lithium-ion battery.

Microstructure and mechanical properties of a CrCN/Cr multilayer film

CrCN/Cr multilayer films were synthesized by multi-arc ion plating deposition technique, and the microstructure, mechanical and tribological properties of films were systematically investigated. The results showed that the thickness of the CrCN and Cr layers in CrCN/Cr multilayer films was between 2.1 μm to 0.45 μm and 90 nm, respectively. X-Ray diffraction results indicated that the composite films were composed of CrN, Cr7C3 and metallic Cr phase, then the mechanical and tribological properties results confirmed that the multilayer structure not only increased the hardness and toughness of the CrCN multilayer film but also decreased the friction coefficient (16%) and wear rate (45%) when compared with a CrN film. This result was attributed to the presence of a complete and dense lubricating film on the worn surface. Therefore, the excellent performance of the CrCN/Cr multilayer films supports their potential application as a replacement for CrN films in industrial applications.

Porous graphene oxide nanosheets warped by Ni(OH)2 platelets as an efficient binder-free electrode material for supercapacitors

This article describes synthesis of the nickel hydroxide nanostructures (Ni(OH)2)@porous reduced graphene oxide (p-RGO) on 3-D nickel foam (NF) through a cost-effective one-step electrochemical strategy. This method composed of electrophoretic deposition of porous RGO plates and in situ formation of hydroxide nanostructures onto NF electrode. For comparison, the pristine Ni(OH)2/NF electrode was also fabricated via the similar method. The prepared nano-composite structure showed high surface area of 269.3 m2 g–1 with mesoporous texture and mean pore diameter of 3.58 nm, where the pure Ni hydroxide exhibited only surface area of 73.5 m2 g–1 and pore diameter of 2.75 nm. Both prepared samples were characterized via XRD, IR, FE-SEM, Raman, BET, TGA/DSC and TEM analyses. The nickel hydroxide@p-RGO composite deposited onto NF electrode has high specific capacitances as well as high electrical conductivity, where it delivered higher capacity of 1792 F g–1 at a current load of 2 A g–1 when compared with the Ni(OH)2 electrode (1175 F g–1 at the same current density), which nearly 65 % increment in capacity was observed. The composite material exhibited an outstanding capacity retention of ∼95.3 % and 87.6 % after 4000 cycles at the current densities of 1 and 7 A g–1, respectively. This methodology provides a feasible route for preparation of the metal hydroxide/graphene hybrid materials for electrochemical energy storage applications.

Characterization of Weld Bead Deposited on Low Carbon Steel Plate with TIG Welding Process

The characterization of weld bead deposited on low carbon steel plate with TIG welding is carried out in the present study. Three beads on plate deposits were made on a low carbon steel plate by setting the current at 75, 100 and 125 Amp, voltage at 40 Volt and the weld speed at 0.5 mm/s. The wire is fed at the rate of 2.67 mm/s. A 1.8 mm filler wire made with low carbon steel was used. The macroscopic and microscopic examination of the sample was carried out. The depth of penetration was more with respect to rise in current value for the selected weld speed. At the heat affected zone (HAZ) fine grains were seen, closer to the HAZ recrystalised grains were noted. At the base metal large ferrite grains with fine carbide particles dispersed along the grain boundaries are observed.

Influence of Pd(P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu multilayer

Autocatalytic plating deposition of a Pd(P) film over a Ni(P) metallization pad, such as Au/Pd(P)/Ni(P) (electroless nickel/electroless palladium/immersion gold, ENEPIG), has been widely used in microelectronic industry for the past decade. However, the data regarding its soderability with eutectic Sn-Ag (Sn-3.5Ag) is still lacking in the literature. We investigated the effects of Pd(P) thickness (δPd(P)) on the interfacial reaction between Sn-3.5Ag and ENEPIG and the mechanical reliability of the joint system. A slight increase in δPd(P) from 0 μm to 0.2 μm caused the nucleation of a pronounced amount of (Pd,Ni)Sn4 in the solder matrix after reflow, which gradually migrated to the joint interface and formed a (Pd,Ni)Sn4/Ni3Sn4 dual layer after subsequent solid-state aging. The formation of the (Pd,Ni)Sn4 dense layer slowed the growth of Ni3Sn4, facilitated the depletion of the Ni(P) film, and seriously deteriorated the mechanical characteristics of the solder joints. This (Pd,Ni)Sn4-induced embrittlement in solder joints (termed the “Pd-embrittlement phenomenon”) had never been found previously in the Sn-Ag reaction system. The formation and migration of (Pd,Ni)Sn4 was dictated by thermodynamics and could be rationalized using a Pd-Ni-Sn isotherm. The above observations indicated that δPd(P) was an important factor of the ENEPIG solderability and should be strictly controlled to be 0.1 μm or less to prevent the undesired Pd-embrittlement phenomenon in Sn-Ag micro joints.

Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH

ABSTRACT This research proposed intermediate materials between Cu filler and Si wafer to reduce the coefficient of thermal expansion (CTE) mismatch in the through silicon via (TSV) structure. The proposed material is Ni underlayer because it has CTE value between Cu and SiO2 which is 13 ppm/°C (Cu = 17 ppm/°C, SiO2 = 0.6 ppm/°C). The deposition process of nickel underlayer was conducted using electroless deposition process at various pH value (4.5, 5.5 and 6.5) of plating bath and deposition time (20, 40 and 60 minutes). The deposition behaviour was studied through surface and cross-sectional analysis under scanning electron microscopy (SEM). The Ni thickness was measured using cross-sectional analysis under SEM. The chemical composition of Ni deposits was measured using energy dispersive spectroscopy equipped on SEM. The performance test analysis was conducted using Standard ASTM D3359 (Cross Hatch Tape-Test) for coating adhesion test and 4-Point Probe Test for resistivity measurement. It was found that the optimum pH of the Ni bath is 6.5 due to high stability of plating bath to form uniform Ni deposited on silicon wafer. These optimum coating parameters showed homogeneous and uniform distribution of Nickel deposited on the surface of silicon with excellent adhesion properties for all pH value.