Plastic Packaging Technology Research Articles

PELATIHAN PEMBUATAN KERIPIK SINGKONG DAN PEMANFAATAN SOSIAL MEDIA UNTUK PEMASARAN PRODUK INDUSTRI RUMAHAN PADA BUMDES DESA TERU

Around 57.9 million people in Indonesia who run UKM, only 9 percent use the internet seriously to sell their products, 37 percent use the basic internet and 36 percent haven't touched the internet at all. Selling online can also cut 71 percent of advertising costs that have been a large expenditure item for businesses. In the village of Teru, a village-owned enterprise (BUMDES) has been implemented to increase the productivity of activists in their village. The program has been run in 2018, but there are still some obstacles in running the program, such as packaging brands for products from activists that do not yet exist to the readiness of Human Resources in the use of internet technology in marketing their products. Following up on the problems at the BUMDES, the proposer would like to channel ideas in the form of community service to the village of Teru in overcoming and dealing with these problems, namely by developing plastic packaging technology and improving the quality of human resources in Teru village to face digital competition. Teru BUMDES is one that produces snacks. It is owned by residents of Teru, Simpang Katis District, Central Bangka, Bangka Belitung. The product of this activity is cassava chips. In addition to the use of practical packaging technology to attract consumers with attractive packaging, training is also conducted to improve the quality of existing human resources in Teru Village so that existing human resources are trained and can compete.

Sonication Assisted Synthesis of Biocomposite from Starch/Nanoclay and its Properties

The potential development of the biodegradable plastic packaging technology in Indonesia is enormous because Indonesia has abundant biodiversity of agricultural and marine products to be developed into polymers. Cassava starch as the matrix biocomposite in packaging manufacturer has a great potential because in Indonesia there are various starch-producing plants. The research objective was to determine the influence of the sonication process on the strength of biocomposite starch reinforced by nanoclay. The method was a synthesis of biocomposite using a casting procedure. The sonication process of 5% (b/b) nanoclay in solution was conducted in 15, 30, 45, and 60 min using the ultrasonic homogenizer and then poured into the mold. The mechanical properties were measured using a tensile test machine with a maximum load of 50 N. The results showed that the duration of the sonication process affects the tensile strength of biocomposite starch reinforced by nanoclay. This result was demonstrated by the term of the sonication process by 15, 30, 45, and 60 minutes resulting in biocomposites strength and elongation of 11.79, 14.77, 20.52, 28.01 MPa, respectively. It showed that the duration of the sonication process of more than or equal to 45 minutes enhances both tensile strength and surface smoothness.

Plastic Electronics and Their Packaging Technologies

Plastic electronics had met many of the expectations of the 21 st century such as, smaller, smarter, cheaper, flexible, and faster. Recently, tremendous progresses in the organic electronic materials and their packaging technologies have been reported [1-2]. Plastic capacitor laminates, plastic capacitor and resistor pastes, and plastic resistor inks have been developed to replace some traditional ceramic passive components. Plastic capacitors provided a high capacitance of 100 nF/in 2 ; plastic resistor pastes demonstrated a broad resistivity range (0.1-10 6 ohm.Cm); plastic resistor ink showed a low tolerance (CV<1%) during ink jetting. Several plastic packaging technologies such as, embedding, lamination, screen-printing, and ink jetting, have been used to make test boards for performance and reliability tests. The material properties and process as well as its performance and challenges have been addressed in the paper.

A novel robust and low cost chips package and its thermal performance

In an attempt to provide a high density memory solution, especially for workstation and PC servers, a stack chips package (SCP) has been developed. The major characteristics of SCP are as follows: (1) SCP contains a plurality of both memory chips and lead frames within a molded plastic package; (2) chip selection is made through the wire bonding option, resulting in the package with a memory capacity twice or four times that of monolithic chip; (3) plural lead frames are electrically interconnected all at once, using metal solders electroplated on the lead frame surface; and (4) SCP is found reliable and cost competitive when compared to other stack packages because it basically adopts the molded plastic packaging technology as well as the metal solder interconnection method. As electrical interconnection methods, both a fluxless soldering joint of Ag/Sn and a high-pressure mechanical joint of Ag were evaluated extensively and they successfully provided a reliable electrical conduction path without any signal degradation. Temperature cycle test and pressure cooker test were proved not to produce any micro cracks across the joint. The thermal performance of SCP was simulated by a thermal model based on finite element method (FEM) and also experimentally verified, showing good agreement within 10% deviation from simulated value. 128M SCP showed better thermal performance than stacked two TSOP's because one chip could serve as a heat sink while the other chip is activated and thermal conduction path through the lead frame is short.

Understanding Plastic Packaging Technology [book review

Understanding Plastic Packaging Technology [book review

Characterisation of chip-on-board and flip chip packaging technologies by acoustic microscopy

In recent years scanning acoustic microscopy (SAM) has been found to be a very successful technique when used in the microelectronics industry to evaluate, from a reliability perspective, standard plastic packaging technologies such as PQFP's, PLCC's, DIP's and SOP's. Very little research has been reported in the application of SAM as a technique for determining the quality and reliability of packaging technologies such as Chipon-Board (COB) and Flip Chip adhered devices, however. These areas will be addressed in this paper.

Level 1 crackfree plastic packaging technology

Cracking of plastic packages during printed circuit board (PCB) mounting is a serious customer concern as VLSI plastic packages house ever-increasing die sizes and are made thinner. Evolutionary improvements in package materials cannot prevent package cracking in the short term, especially in thin packages. A novel design, termed the "window flag", employs a central hole punched in the die pad to minimize the metal-polymer interface and maximize the silicon-mold compound interface in the die pad region. This window flag design results in crackfree performance following Level 1 preconditioning in QFPs, TQFPs, and SOJs. This solution stems from the key discovery that the silicon-mold compound interface is intrinsically very strong under preconditioning stresses.

Unified life cycle engineering : Harris M. Burte and Anthony Copolla. Proc. a. Reliab. Maintainab. Symp., 8 (1987)

In recent years scanning acoustic microscopy (SAM) has been found to be a very successful technique when used in the microelectronics industry to evaluate, from a reliability perspective, standard plastic packaging technologies such as PQFP's, PLCC's, DIP's and SOP's. Very little research has been reported in the application of SAM as a technique for determining the quality and reliability of packaging technologies such as Chipon-Board (COB) and Flip Chip adhered devices, however. These areas will be addressed in this paper.