Abstract
Plastic electronics had met many of the expectations of the 21 st century such as, smaller, smarter, cheaper, flexible, and faster. Recently, tremendous progresses in the organic electronic materials and their packaging technologies have been reported [1-2]. Plastic capacitor laminates, plastic capacitor and resistor pastes, and plastic resistor inks have been developed to replace some traditional ceramic passive components. Plastic capacitors provided a high capacitance of 100 nF/in 2 ; plastic resistor pastes demonstrated a broad resistivity range (0.1-10 6 ohm.Cm); plastic resistor ink showed a low tolerance (CV<1%) during ink jetting. Several plastic packaging technologies such as, embedding, lamination, screen-printing, and ink jetting, have been used to make test boards for performance and reliability tests. The material properties and process as well as its performance and challenges have been addressed in the paper.
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