Piezoelectric Wafer Active Sensors Transducers Research Articles

Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications.

Piezoelectric materials are defined by their ability to display a charge across their surface in response to mechanical strain, making them great for use in sensing applications. Such applications include pressure sensors, medical devices, energy harvesting and structural health monitoring (SHM). SHM describes the process of using a systematic approach to identify damage in engineering infrastructure. A method of SHM that uses piezoelectric wafers connected directly to the structure has become increasingly popular. An investigation of a novel pitch-catch method of determining instrumentation quality of piezoelectric wafer active sensors (PWASs) used in SHM was conducted as well as an investigation into the effects of defects in piezoelectric sensors and sensor bonding on the sensor response. This pitch-catch method was able to verify defect-less instrumentation quality of pristinely bonded PWASs. Additionally, the pitch-catch method was compared with the electromechanical impedance method in determining defects in piezoelectric sensor instrumentation. Using the pitch-catch method, it was found that defective instrumentation resulted in decreasing amplitude of received and transmitted signals as well as changes in the frequency spectrums of the signals, such as the elimination of high frequency peaks in those with defects in the bonding layer and an increased amplitude of around 600 kHz for a broken PWAS. The electromechanical impedance method concluded that bonding layer defects increase the primary frequency peak's amplitude and cause a downward frequency shift in both the primary and secondary frequency peaks in the impedance spectrum, while a broken sensor has the primary peak amplitude reduced while shifting upward and nearly eliminating the secondary peak.

Excitation and Propagation of Guided Waves in Multilayer Hollow Cylinders Using PWAS Transducers: A Theoretical and Experimental Study

In this paper, the excitation and propagation of guided waves in multilayer hollow cylinders with piezoelectric wafer active sensor (PWAS) transducers were modeled with the normal mode expansion (NME) method using the semi-analytical finite element (SAFE) formulation. The theoretical development of SAFE for hollow cylindrical structures was introduced and used to obtain guided-wave mode shapes and dispersion curves of multilayer hollow cylinders. The SAFE discretization was applied across the thickness. The layers present in the cylinder were modeled by grouping the elements in the region corresponding to the respective layers. Each finite element region was given the property of the layer that it represented. The number of elements in a layer was determined through convergence studies. The PWAS excitation effect, introduced using the ideal-bonding assumption, was represented by a line-force acting on the PWAS boundary. The SAFE-NME solution obtained in the wavenumber domain was resolved in the physical domain through inverse Fourier transform and residue theorem. Experimental validation of theoretical prediction was performed by comparison with scanning laser Doppler vibrometer (SLDV) measurements from a “6-inch schedule-40” pipe of 11 mm thickness installed with a 7-mm square PWAS transducer for wave excitation. Numerical prediction of the guided wave propagation emanating from the PWAS was first performed and wavefront visualization was obtained. An SLDV area scan of the guided waves generated by the PWAS was then performed and compared with numerical predictions. A good match between experiment and prediction was observed.

Recent Advances in Piezoelectric Wafer Active Sensors for Structural Health Monitoring Applications.

In this paper, some recent piezoelectric wafer active sensors (PWAS) progress achieved in our laboratory for active materials and smart structures (LAMSS) at the University of South Carolina: http: //www.me.sc.edu/research/lamss/ group is presented. First, the characterization of the PWAS materials shows that no significant change in the microstructure after exposure to high temperature and nuclear radiation, and the PWAS transducer can be used in harsh environments for structural health monitoring (SHM) applications. Next, PWAS active sensing of various damage types in aluminum and composite structures are explored. PWAS transducers can successfully detect the simulated crack and corrosion damage in aluminum plates through the wavefield analysis, and the simulated delamination damage in composite plates through the damage imaging method. Finally, the novel use of PWAS transducers as acoustic emission (AE) sensors for in situ AE detection during fatigue crack growth is presented. The time of arrival of AE signals at multiple PWAS transducers confirms that the AE signals are originating from the crack, and that the amplitude decay due to geometric spreading is observed.

Effects of Gamma Radiation on Resonant and Antiresonant Characteristics of Piezoelectric Wafer Active Sensors

This paper presents gamma radiation effects on resonant and antiresonant characteristics of piezoelectric wafer active sensors (PWAS) for structural health monitoring (SHM) applications to nuclear-spent fuel storage facilities. The irradiation test was done in a Co-60 gamma irradiator. Lead zirconate titanate (PZT) and Gallium Orthophosphate (GaPO4) PWAS transducers were exposed to 225 kGy gamma radiation dose. First, 2 kGy of total radiation dose was achieved with slower radiation rate at 0.1 kGy/h for 20; h then the remaining radiation dose was achieved with accelerated radiation rate at 1.233 kGy/h for 192 h. The total cumulative radiation dose of 225 kGy is equivalent to 256 years of operation in nuclear-spent fuel storage facilities. Electro-mechanical impedance and admittance (EMIA) signatures were measured after each gamma radiation exposure. Radiation-dependent logarithmic sensitivity of PZT-PWAS in-plane and thickness modes resonance frequency (∂(fR)/∂( logeRd)) was estimated as 0.244 kHz and 7.44 kHz, respectively; the logarithmic sensitivity of GaPO4-PWAS in-plane and thickness modes resonance frequency was estimated as 0.0629 kHz and 2.454 kHz, respectively. Therefore, GaPO4-PWAS EMIA spectra show more gamma radiation endurance than PZT-PWAS. Scanning electron microscope (SEM) and X-ray diffraction method (XRD) was used to investigate the microstructure and crystal structure of PWAS transducers. From SEM and XRD results, it can be inferred that there is no significant variation in the morphology, the crystal structure, and grain size before and after the irradiation exposure.

Analytical and experimental investigation of the interaction of Lamb waves in a stiffened aluminum plate with a horizontal crack at the root of the stiffener

This paper addresses an analytical and experimental analysis based on the physics of the Lamb wave propagation and interaction with the discontinuity. An analytical method called “complex modes expansion with vector projection (CMEP)” is used to calculate the scattering coefficients (amplitude of the out-of-plane velocity) of Lamb wave modes from geometric discontinuities. Two cases are considered in this research: (a) a plate with a pristine stiffener and (b) a plate with a cracked stiffener. Complex-valued scattering coefficients are calculated from 50 kHz to 350 kHz for A0 incident waves. Scatter coefficients are compared for both cases to identify a suitable frequency range to excite Lamb waves using a piezoelectric wafer active sensor (PWAS) to detect the crack. The frequency-dependent complex-valued scatter coefficients are then inserted into the global analytical model. The global analytical solution predicts time domain scattered signal from the discontinuity. The crack can be detected by comparing the waveforms for pristine stiffener and cracked stiffener. An experiment was conducted for both pristine stiffener and cracked stiffener to compare with the analytical results. A long PWAS was placed parallel to the waveform to create straight crested Lamb wave modes in the plate. Antisymmetric Lamb wave modes were selectively excited by using two PWAS transducers placed on opposite sides of the plate and energized by out-of-phase signals. A single-point laser Doppler vibrometer (LDV) was used to measure the out-of-plane velocity of scattered Lamb waves on the plate. The obtained experimental results agree well with the analytical predictions.

Guided wave excitation and propagation in damped composite plates

Guided wave attenuation in composites due to material damping is strong, anisotropic, and cannot be neglected. Material damping is a critical parameter in selection of a particular wave mode for long-range structural health monitoring in composites. In this article, a semi-analytical finite element approach is presented to model guided wave excitation and propagation in damped composite plates. The theoretical framework is formulated using finite element method to describe the material behavior in the thickness direction while assuming analytical expressions in the wave propagation direction along the plate. In the proposed method, the Kelvin–Voigt damping model using a complex frequency-dependent stiffness matrix is utilized to account for anisotropic damping effects of composites. Thus, the existing semi-analytical finite element approach is being extended to include material damping effect. Theoretical predictions are experimentally validated using scanning laser Doppler vibrometer measurements of guided wave propagation generated by a circular piezoelectric wafer active sensor transducer in a unidirectional carbon fiber reinforced polymer composite plate. The proposed method achieves good agreement with the experimental results.

Effect of structural damping on the tuning between piezoelectric wafer active sensors and Lamb waves

Piezoelectric wafer active sensors have been widely used for Lamb-wave generation and acquisition. For selective preferential excitation of a certain Lamb-wave mode and rejection of other modes, the piezoelectric wafer active sensor size and the excitation frequency should be tuned. However, structural damping depends on the structure material and the excitation frequency and it will affect the amplitude response of piezoelectric wafer active sensor–excited Lamb waves in the structure, that is, tuning curves. Its influence on the piezoelectric wafer active sensor tuning reflects the effect of structural health monitoring configuration considered in the excitation. Therefore, it is important to have knowledge about the effect of structural damping on the tuning between piezoelectric wafer active sensor and Lamb waves. In this article, the analytical tuning solution of undamped media is extended to damped materials using the Kelvin–Voigt damping model, in which a complex Young’s modulus is utilized to include the effect of structural damping as an improvement over existing models. This extension is particularly relevant for the structural health monitoring applications on high-loss materials, such as metallic materials with viscoelastic coatings and fiber-reinforced polymer composites. The effects of structural damping on the piezoelectric wafer active sensor tuning are successfully captured by the improved model, with experimental validations on an aluminum plate with adhesive films on both sides and a quasi-isotropic woven composite plate using circular piezoelectric wafer active sensor transducers.

Acoustic emission sensor effect and waveform evolution during fatigue crack growth in thin metallic plate

In this article, the effect of the acoustic emission sensor on the acoustic emission waveforms from fatigue crack growth in a thin aerospace specimen is presented. In situ acoustic emission fatigue experiments were performed on the test coupons made of aircraft grade aluminum plate. Commercial Mistras S9225 acoustic emission sensor and piezoelectric wafer active sensor were used to capture the acoustic emission waveforms from the fatigue crack. It has been shown that the piezoelectric wafer active sensor transducer successfully captured the fatigue crack–related acoustic emission waveforms in the thin plate. The piezoelectric wafer active sensor transducer seems to capture more frequency information of the acoustic emission waveform than the conventional acoustic emission sensor in this particular application. We have also shown the evolution of the acoustic emission waveforms as the fatigue crack grows. The signatures of the fatigue crack growth were captured by the evolution of the acoustic emission waveforms. This waveform evolution is highly related to the physical boundary conditions of the cracks as well as the fatigue crack growth mechanism. The fatigue loading and acoustic emission measurement were synchronized using the same acoustic emission instrumentation. This synchronization provided the exact load level when the acoustic emission signals had occurred during the fatigue crack growth.

Multiphysics Simulation of Low-Amplitude Acoustic Wave Detection by Piezoelectric Wafer Active Sensors Validated by In-Situ AE-Fatigue Experiment.

Piezoelectric wafer active sensors (PWAS) are commonly used for detecting Lamb waves for structural health monitoring application. However, in most applications of active sensing, the signals are of high-amplitude and easy to detect. In this article, we have shown a new avenue of using the PWAS transducer for detecting the low-amplitude fatigue-crack related acoustic emission (AE) signals. Multiphysics finite element (FE) simulations were performed with two PWAS transducers bonded to the structure. Various configurations of the sensors were studied by using the simulations. One PWAS was placed near to the fatigue-crack and the other one was placed at a certain distance from the crack. The simulated AE event was generated at the crack tip. The simulation results showed that both PWAS transducers were capable of sensing the AE signals. To validate the multiphysics simulation results, an in-situ AE-fatigue experiment was performed. Two PWAS transducers were bonded to the thin aerospace test coupon. The fatigue crack was generated in the test coupon which had produced low-amplitude acoustic waves. The low-amplitude fatigue-crack related AE signals were successfully captured by the PWAS transducers. The distance effect on the captured AE signals was also studied. It has been shown that some high-frequency contents of the AE signal have developed as they travel away from the crack.

Irreversibility effects in piezoelectric wafer active sensors after exposure to high temperature

This paper presents an experimental and analytical study of irreversible change in piezoelectric wafer active sensor (PWAS) electromechanical (E/M) impedance and admittance signature under high temperature exposure. After elevated to high temperatures, change in the material properties of PWAS can be quantified through irreversible changes in its E/M impedance and admittance signature. For the experimental study, circular PWAS transducers were exposed to temperatures between 50 °C and 250 °C at 50 °C intervals. E/M impedance and admittance data were obtained before and after each heating cycle. Irreversible temperature sensitivity of PWAS resonance and anti-resonance frequency was estimated as 0.0246 kHz °C−1 and 0.0327 kHz °C−1 respectively. PWAS transducer material properties relevant to impedance or admittance signature such as dielectric constant, dielectric loss factor, mechanical loss factor, and in plane piezoelectric constant were determined experimentally at room temperature before and after the elevated temperature tests. The in-plane piezoelectric coefficient was measured by using optical-fiber strain transducer system. It was found that the dielectric constant and in-plane piezoelectric coefficient increased linearly with temperature. Dielectric loss also increases with temperature but remains within 0.2% of initial room temperature value. Change in dielectric properties and piezoelectric constant may be explained by depinning of domains or by domain wall motion. The piezoelectric material degradation was investigated microstructurally and crystallographically by using scanning electron microscope and x-ray diffraction method respectively. There were no noticeable changes in microstructure, crystal structure, unit cell dimension, or symmetry. The degraded PWAS material properties were determined by matching impedance and admittance spectrums from experimental results with a closed form circular PWAS analytical model. Analytical results showed that impedance and admittance strongly depend on elastic coefficient, dielectric constant, mechanical loss factor, dielectric loss tangent and in plane piezoelectric constant. These properties were found to be susceptible to change after high temperature exposure.

Radiation, temperature, and vacuum effects on piezoelectric wafer active sensors

The effect of radiation, temperature, and vacuum (RTV) on piezoelectric wafer active sensors (PWASs) is discussed. This study is relevant for extending structural health monitoring (SHM) methods to space vehicle applications that are likely to be subjected to harsh environmental conditions such as extreme temperatures (hot and cold), cosmic radiation, and interplanetary vacuums. This study contains both theoretical and experimental investigations with the use of electromechanical impedance spectroscopy (EMIS). In the theoretical part, analytical models of circular PWAS resonators were used to derive analytical expressions for the temperature sensitivities of EMIS resonance and antiresonance behavior. Closed-form expressions for frequency and peak values at resonance and antiresonance were derived as functions of the coefficients of thermal expansion, the Poisson ratio, and its sensitivity, the relative compliance gradient and the Bessel function root, and its sensitivity, In the experimental part, tests were conducted to subject the PWAS transducers to RTV conditions. In one set of experiments, several RTV exposure, cycles were applied with EMIS signatures recorded at the beginning and after each of the repeated cycles. In another set of experiments, PWAS transducers were subjected to various temperatures and the EMIS signatures were recorded at each temperature after stabilization. The processing of measured EMIS data from the first set of experiments revealed that the resonance and antiresonance frequencies changed by less than 1% due to RTV exposure, whereas the resonance and antiresonance amplitudes changed by around 15%. After processing an individual set of EMIS data from the second set of experiments, it was determined that the relative temperature sensitivity of the antiresonance frequency ( is approximately and the relative temperature sensitivity of the antiresonance amplitude (ReZ) is approximately A tentative statistical analysis and comparative plots of the data from sets of PWAS transducers revealed that the trends observed on an individual PWAS are also observed on the entire set of PWAS transducers. The article concludes with a summary, conclusions, and suggestions for further work.

Assessment of temperature effect in structural health monitoring with piezoelectric wafer active sensors

This paper presents theoretical and experimental evaluation of the structural health monitoring (SHM) capability of piezoelectric wafer active sensors (PWAS) at elevated temperatures. This is important because the technologies for structural sensing and monitoring need to account for the thermal effect and compensate for it. Permanently installed PWAS transducers have been One of the extensively employed sensor technologies for in-situ continuous SHM. In this paper, the electro-mechanical impedance spectroscopy (EMIS) method has been utilized as a dynamic descriptor of PWAS behavior and as a high frequency standing wave local modal technique. Another SHM technology utilizes PWAS as far-field transient transducers to excite and detect guided waves propagating through the structure. This paper first presents how the EMIS method is used to qualify and quantify circular PWAS resonators in an increasing temperature environment up to 230 deg C. The piezoelectric material degradation with temperature was investigated and trends of variation with temperature were deduced from experimental measurements. These effects were introduced in a wave propagation simulation software called Wave Form Revealer (WFR). The thermal effects on the substrate material were also considered. Thus, the changes in the propagating guided wave signal at various temperatures could be simulated. The paper ends with summary and conclusions followed by suggestions for further work.

Predictive Modeling of Piezoelectric Wafer Active Sensors for Structural Health Monitoring

Piezoelectric wafer active sensors (PWAS) are lightweight and inexpensive transducers made from ferroelectric piezoceramic wafers attached to safety-critical structure. PWAS transducers enable a large class of structural health monitoring (SHM) applications. The focus of this paper is on the predictive modeling of structurally-attached PWAS. After a brief introduction, the paper reviews the PWAS-based SHM principles. Then, it follows with a discussion of shear-lag analysis, the transfer matrix method approach and the investigation of power and energy transduction between PWAS and structure. Finally, the paper presents a multi-physics finite element (MP-FEM) simulation. The paper ends with summary and conclusion.

Predictive model of fatigue crack detection in thick bridge steel structures with piezoelectric wafer active sensors

This paper presents numerical and experimental results on the use of guided waves for structural health monitoring (SHM) of crack growth during a fatigue test in a thick steel plate used for civil engineering application. Numerical simulation, analytical modeling, and experimental tests are used to prove that piezoelectric wafer active sensor (PWAS) can perform active SHM using guided wave pitch-catch method and passive SHM using acoustic emission (AE). AE simulation was performed with the multi-physic FEM (MP-FEM) approach. The MP-FEM approach permits that the output variables to be expressed directly in electric terms while the two-ways electromechanical conversion is done internally in the MP-FEM formulation. The AE event was simulated as a pulse of defined duration and amplitude. The electrical signal measured at a PWAS receiver was simulated. Experimental tests were performed with PWAS transducers acting as passive receivers of AE signals. An AE source was simulated using 0.5-mm pencil lead breaks. The PWAS transducers were able to pick up AE signal with good strength. Subsequently, PWAS transducers and traditional AE transducer were applied to a 12.7-mm CT specimen subjected to accelerated fatigue testing. Active sensing in pitch catch mode on the CT specimen was applied between the PWAS transducers pairs. Damage indexes were calculated and correlated with actual crack growth. The paper finishes with conclusions and suggestions for further work.

Exact Shear-Lag Solution for Guided Waves Tuning with Piezoelectric-Wafer Active Sensors

This paper addresses some unresolved predictive modeling issues related to the use of piezoelectric-wafer active sensors for ultrasonic structural health monitoring. An exact model for the shear-lag transfer between the piezoelectric-wafer active sensor transducer and the structure in the presence of N generic guided wave modes is derived from first principles using the normal-mode expansion formulation. The resulting integral–differential equation is solved using the variational iteration approach. The resulting solution is used to derive an improved modelforthetuningbetweenpiezoelectric-waferactivesensortransducersandthemultimodalguidedwavesusedin ultrasonic structural-health-monitoring applications. The numerical predictions generated by the improved tuning model are compared with experimental results obtained through pitch–catch experiments between two 7 mm piezoelectric-waferactivesensortransducersplacedona1-mm2024-T3aluminumplate.The10–700kHzfrequency range was explored. It was concluded that the improved model using the exact shear-lag solution matches much better the experimental results than previous models. Further theoretical and experimental work is warranted as a follow-up on the work reported in this paper to study the accuracy and convergence properties of the solution, to explore experimental comparison beyond the A1-mode cutoff frequency, and to extend the approach to layered structures and composite materials.

Piezoelectric Wafer Active Sensors in Lamb Wave-Based Structural Health Monitoring

Recent advancements in sensors and information technologies have resulted in new methods for structural health monitoring (SHM) of the performance and deterioration of structures. The enabling element is the piezoelectric wafer active sensor (PWAS). This paper presents an introduction to PWAS transducers and their applications in Lamb wave-based SHM. We begin by reviewing the fundamentals of piezoelectric intelligent materials. Then, the mechanism of using PWAS transducers as Lamb wave transmitters and receivers is presented. PWAS interact with the host structure through the shear-lag model. Lamb wave mode tuning can be achieved by judicious combination of PWAS dimensions, frequency value, and Lamb mode characteristics. Finally, use of PWAS Lamb wave SHM for damage detection on plate-like aluminum structures is addressed. Examples of using PWAS phased array scanning, quantitative crack detection with array imaging, and quantitative corrosion detection are given.

Piezoelectric Wafer Active Sensors for Structural Health Monitoring of Composite Structures Using Tuned Guided Waves

Piezoelectric wafer active sensors (PWAS) are lightweight and inexpensive transducers that enable a large class of structural health monitoring (SHM) applications such as: (a) embedded guided wave ultrasonics, i.e., pitch-catch, pulse-echo, phased arrays; (b) high-frequency modal sensing, i.e., the electro-mechanical (E/M) impedance method; and (c) passive detection (acoustic emission and impact detection). The focus of this paper is on the challenges posed by using PWAS transducers in the composite structures as different from the metallic structures on which this methodology was initially developed. After a brief introduction, the paper reviews the PWAS-based SHM principles. It follows with a discussion of guided wave propagation in composites and PWAS tuning effects. Then, it discusses damage modes in composites. Finally, the paper presents some experimental results with damage detection in composite specimens. Hole damage and impact damage were detected using pitch-catch method with tuned guided waves being sent between a transmitter PWAS and a received PWAS. Root mean square deviation (RMSD) damage index (DI) were shown to correlate well with hole size and impact intensity. The paper ends with summary and conclusion; suggestions for further work are also presented.

Space Application of Piezoelectric Wafer Active Sensors for Structural Health Monitoring

Piezoelectric wafer active sensors (PWAS) are lightweight and inexpensive enablers for a large class of structural health monitoring (SHM) applications. This paper presents and discusses the challenges and opportunities related to the use of PWAS in the structures specific to space applications. The challenges posed by space structures are often different from those encountered in conventional structures. After a review of PWAS principles, the paper discusses the multi-physics power and energy transduction between structurally guided waves and PWAS; predictive modeling results using a simplified analytical approach are presented. Experimental results on space-like specimen structures are presented. Survivability of PWAS transducers under cryogenic space-like conditions is experimentally verified. The paper ends with conclusions and suggestions for further work.

Shear lag solution for tuning ultrasonic piezoelectric wafer active sensors with applications to Lamb wave array imaging

An analytical investigation of the interaction between piezoelectric wafer active sensor (PWAS), guided Lamb waves, and host structure is presented in this paper, supported with application examples. The analytical investigation assumes a PWAS transducer bonded to the upper surface of an isotropic flat plate. Shear lag transfer of tractions and strains is assumed, and an analytical solution using the space-wise Fourier transform is reviewed, closed-form solutions are presented for the case of both ideal bonding (i.e., load transfer mechanism localized at the PWAS boundary) and not ideal bonding (i.e., load transfer mechanism localized close the PWAS boundary). The analytical solutions are used to derive Lamb wave mode tuning curves which indicate that frequencies exist at which the A0 mode or the S0 mode can be either suppressed or enhanced. The paper further shows that the capability to excite only one desired Lamb wave mode is critical for practical structural health monitoring applications such as PWAS phased array technique (e.g., the embedded ultrasonics structural radar, EUSR) and the sparse array imaging. Extensive experimental tests that verify the tuning mechanism and prediction curves are reported. Examples of correctly tuned EUSR images vs. detuned cases illustrate the paramount importance of Lamb wave mode tuning for the success of PWAS based damage detection.

Durability and Survivability of Piezoelectric Wafer Active Sensors on Metallic Structure

Piezoelectric wafer active sensors are small, inexpensive, noninvasive, elastic wave generators/receptors that can be easily affixed to a structure. Piezoelectric wafer active sensor installation on the health-monitored structure is an important step that may have significant bearing on the success of the health monitoring process. The purpose of this paper is to explore the durability and survivability issues associated with various environmental conditions on piezoelectric wafer active sensors for structural health monitoring. The durability and survivability of the piezoelectric wafer active sensor transducers under various exposures (cryogenic and high temperature, temperature cycling, outdoor environment, operational fluids, large strains, fatigue load cycling) were considered over a long period of time. Both free piezoelectric wafer active sensors and bonded piezoelectric wafer active sensors on metallic structural substrates were used. Different adhesives and protective coatings were compared to find the candidate for piezoelectric wafer active sensor application in structural health monitoring. In most cases, piezoelectric wafer active sensors survived the tests successfully. The cases when piezoelectric wafer active sensors did not survive the tests were closely examined and possible causes of failure were discussed. The test results indicate that lead zirconate titanate piezoelectric wafer active sensors can be successfully used in a cryogenic environment; however, it does not seem to be a good candidate for high temperature. Repeated differential thermal expansion and extended environmental attacks can lead to piezoelectric wafer active sensor failure. This emphasizes the importance of achieving the proper design of the adhesive bond between the piezoelectric wafer active sensor and the structure, and of using a protective coating to minimize the ingression of adverse agents. The high-strain tests indicated that the piezoelectric wafer active sensors remained operational up to at least 3000 microstrain and failed beyond 6000 microstrain. In the fatigue cyclic loading, conducted up to 12 millions of cycles, the piezoelectric wafer active sensor transducers sustained at least as many fatigue cycles as the structural coupon specimens on which they were installed.