Physical Vapor Deposition Sputtering Research Articles

Deposition and characterisation of arc-bond sputter Ti xZr yN coatings from pure metallic and segmented targets

An arc-bond sputtering physical vapour deposition chamber has been used to deposit hard low friction binary and ternary coatings by steered arc evaporation, unbalanced magnetron sputtering and a combination of both techniques. The results of the coating trials using segmented targets manufactured by hot isostatic pressing together with co-sputtering and arc evaporation of pure titanium and zirconium targets are reported. Ti x Zr y N coatings with various metal ratios were deposited on high speed steel and stainless steel substrates and characterized using X-ray diffraction, scanning electron microscopy, glow discharge optical emission spectroscopy, Knoop micro hardness, Talysurf roughness and scratch adhesion methods. The results illustrate the relationship between the coating composition and structure with performance in terms of adhesion, hardness and wear properties. The results also serve to show changes in coating properties with deposition technique and the improved performance of Ti x Zr y N films over binary systems.

Vapor Deposition of Thin-Film Y-Doped ZrO2 For Electrochemical Device Applications

AbstractThe growth of high-quality, pin-hole free, ytrrium doped ZrO2 thin films is of great interest for a variety of electrochemical applications such as fuel cells and oxygen gas separation devices. In the work, we have grown polycrystalline thin films of ytrrium doped ZrO2 on thick porous Al2O3 substrates in multilayer La1-xSrxMEO3/YSZ/La1-xSrxMEO3 (ME = Mn, Co) configurations using a combination of single-target RF magnetron sputtering and electron beam physical vapor deposition techniques. The structure and morphology of these films have been studied using X-ray diffraction, and Scanning Electron Microscopy techniques. The ionic conductivity of the thin films has been measured using AC impedance analysis.