Physical Properties Of Particleboard Research Articles

Properties of Particleboard Manufactured from Oil Palm Trunk Waste Using Polylactic Acid as a Natural Binder

Particleboard from renewal agricultural residues or waste offers a significant effect toward ecological problem. However, hygroscopic nature of waste material contributes to a lower dimensional stability and lower strength properties in comparison to conventional particleboard. Therefore, the objective of this study was to convert oil palm waste, namely oil palm trunk, into particleboard with the addition of polylactic acid (PLA), a type of biodegradable thermoplastic, as a natural binder. Particleboard of oil palm trunk made with a target density of 0.8 g/cm3, at a pressing temperature of 180 °C, a pressing time of 20 min, and a pressure of 5 MPa was added with 10% of PLA. The PLA was added into different thickness particleboards, namely 5 mm, 10 mm, and 15 mm. The mechanical and physical properties of particleboards with the addition of PLA in comparison to binderless particleboards made from oil palm trunk were then evaluated. Thus, thermal degradation, spectroscopic characterization, crystallinity properties, and morphological properties of such types of boards were also examined. The mechanical properties, such as modulus of rupture and internal bond strength, and physical properties, such as thickness swelling and water absorption, had significantly improved with the addition of PLA compared to binderless particleboard. Particleboard with the addition of PLA exhibited satisfactory mechanical properties based on Japanese Industrial Standard for Particleboard Type 8. The thermal stability, spectroscopic characterization, crystallinity, and morphological results indicated that the addition of PLA improved the basic properties of the particleboards made of oil palm trunk.

PRODUCTION OF PARTICLE BOARDS USING POLYSTYRENE AND BAMBOO WASTES

This investigation was able to produce incredibly strong particleboards using bamboo and resinous material obtained from Polystyrene wastes. The particleboards were prepared by mixing the bamboo fibres and Polystyrene based resin (PBR) followed by flat press process at different ratio (v/v). Physical properties were measured, with reference to normal and oven curing methods, according to the ASTM D-1037 standard. Thickness Swelling (TS) of the samples were measured after 2 and 24 hours of immersion in water at 25oC temperature. It was found that the physical properties of particleboards with 20%, 30% and 40% PBR content were all in agreement with low density particleboard classification of American National Standards Institute (ANSI). TS increased as the PBR content decreased in the matrix. Obtained properties convincingly indicate superior bonding ability of the synthesised resinous polystyrene over known industrial adhesives typically used for particleboard production. http://dx.doi.org/10.4314/njt.v36i3.18

PRODUCTION OF PARTICLE BOARDS USING POLYSTYRENE AND BAMBOO WASTES

This investigation was able to produce incredibly strong particleboards using bamboo and resinous material obtained from Polystyrene wastes. The particleboards were prepared by mixing the bamboo fibres and Polystyrene based resin (PBR) followed by flat press process at different ratio (v/v). Physical properties were measured, with reference to normal and oven curing methods, according to the ASTM D-1037 standard. Thickness Swelling (TS) of the samples were measured after 2 and 24 hours of immersion in water at 25oC temperature. It was found that the physical properties of particleboards with 20%, 30% and 40% PBR content were all in agreement with low density particleboard classification of American National Standards Institute (ANSI). TS increased as the PBR content decreased in the matrix. Obtained properties convincingly indicate superior bonding ability of the synthesised resinous polystyrene over known industrial adhesives typically used for particleboard production. http://dx.doi.org/10.4314/njt.v36i3.18Â

Effects of Shelling Ratio and Particle Characteristic on Physical Properties of Three-Layered Particleboard Made from Different Wood Species

Wood waste materials such as flakes, particles, sawdust, planer shaving, which are residues from furniture industry can be utilized to manufacture many composites such as particleboard. The most commonly used particleboard has three layers: two face layers and one core layer. The face layers consist of fine particles and the core layer is made of coarse particles.This study aimed to show the effect of shelling ratio and particle characteristic on physical properties of three-layer particleboard with high density core and different particles on surface layers. The materials used in this study were hinoki (Chamaecyparis obtusa) strand and knife-milled Douglas-fir (Pseudotsuga manziesii) as surface layers and hammer-milled matoa (Pometia sp.) as core layer. The wood particles were collected from a wood company. Adhesive used was MDI resin (methylene diphenyl diisocyanate) with 6 % content in mat preparation. The pressing conditions were: temperature 180°C, pressure 3 MPa and pressing time 5 min. The target density was 0.72 g/cm3 with board size of 340 mm x 320 mm x 10 mm. Factors used in this study were layer structure according to board shelling ratio and particle characteristic. The parameters of this study were density, moisture content, thickness swelling, water absorption, linear expansion and vertical density profile.The results of this study indicate that all boards meet the requirements of JIS A 5908-2003. Higher shelling ratio of surface layers resulted in higher physical performance of three-layer particleboard. In terms of particle type, hinoki strands showed the best performance in board density and linear expansion, while Douglas-fir particle showed the best performance in moisture content, thickness swelling and water absorption. Improvement of physical properties of particleboard with high density wood particles in core layer can be conducted by adding surface layer with higher quality wood particles such as hinoki strands or Douglas-fir particles. Compared to Douglas-fir particles, hinoki strands as surface layers contribute to higher enhancement of three-layer particleboard with matoa as the core layer.

Enhancing mechanical properties of particleboards using plasma treated wood particles

The surface properties of wood particles are one of the key factors for the development of mechanical and physical properties of particleboards. Particles were treated with plasma at atmospheric pressure with ambient air in order to enhance the polarity of wooden surfaces. One-layer particle boards were produced from the plasma-treated particles by using 3, 5, and 8 % urea formaldehyde adhesive (related to the particles). For all adhesive ratios, internal bond strength was increased by approximately 0.1 MPa compared to the respective controls. The modulus of rupture, modulus of elasticity and water related properties were only improved compared to the respective controls at the lowest adhesive content. It is therefore concluded that the plasma treatment can improve the bonding quality and water related properties of particleboards particularly at low adhesive contents.

Investigation of a new natural adhesive composed of citric acid and sucrose for particleboard II: effects of board density and pressing temperature

A natural adhesive composed of only citric acid and sucrose was recently proposed, and its detailed bonding performance has been researched in some wood-based materials. In this study, the effects of board density and press temperature on the physical properties of particleboard were investigated. As physical properties, the bending properties, internal bond strength and thickness swelling of the boards were evaluated. When the density was changed from 0.4 to 1.0 g/cm3 under a press temperature of 200 °C and a press time of 10 min, the board with a density of 0.8 g/cm3 had the best physical properties. When the board was manufactured at press temperatures ranging from 140 to 240 °C for a press time of 10 min and a target density of 0.8 g/cm3, the board manufactured at 200 °C had the best physical properties. The physical properties of the board with a density of 0.8 g/cm3 manufactured at 200 °C met the type 18 requirements of the Japanese industrial standard for particleboard (JIS A 5908). The results obtained from Fourier transform infrared spectra suggested that the ester linkages resulting from the reaction between citric acid and wood and/or sucrose were the main adhesion mechanism and resulted in particleboard with excellent physical properties.

Measurement of mechanical and physical properties of particleboard by hybridization of kenaf with rubberwood particles

Kenaf is one of the potential raw materials available in Malaysia to use for particleboard manufacturing as an alternative solution to balance shortage of rubberwood (RW) supply. In this study, particleboard manufactured from kenaf stem (KS) and RW particle blends at different RW loading (0%, 50%, 70%, 100%) and resin levels (6%, 8%, 10%). Urea formaldehyde resin is used as a binder. The effects of RW:KS ratio and resin content on mechanical and dimensional stability properties of hybrid particleboard were determined. The results indicated that particleboards bonded with 10% resin level and 50:50 (RW:KS) had the highest strength (19.08MPa) while particleboards made of 70:30 (RW:KS) display better stiffness (2.23GPa). Statistical analysis using ANOVA and LSD were conducted on the obtained results. The results show that RW:KS ratio has greater influence over thickness swelling (TS) and water absorption (WA) of particleboard than the level of resin content. The relationship between internal bonding (IB) and TS of particleboards were also examined and obtained strong inverse relationship between IB and TS. Hybrid particleboards made from 70% RW and 30% KS with 10% resin content display over all good properties and comparable with 100% RW (control) samples. It concluded that kenaf stem can replace rubberwood particles up to 50% but the resin level must be kept at 10% or more because lower resin level (⩽8%) significantly decrease strength of the particleboard.

Study of the Feasibility of mix of Species from Sawmill Waste and Limiting for Particleboard

This study aims to determine physical properties of particleboard made of sawmill waste, as a mix of several wood species, and two adhesives: urea-formaldehyde, usually employed in industry (even with drawbacks or formaldehyde emission during pressing) and FASTBOND ® , water based resin, still poorly referenced in literature. Sixteen panels have been produced, in four experimental conditions, defined by using two adhesives and a 12 mm thick limiter (or not). Variance analysis was adopted to evaluate influence of experimental conditions on physical properties of produced panels, manufactured in nominal dimensions 350x350mm; 10% resin related to particles mass (at 5% moisture); 3.5 MPa compaction pressure, temperature 130°C, in a 10 min cycle. Tests to determine density, moisture content, swelling and water absorption were carried out based on normative parameters of ABNT NBR 14810:2006. Results have been satisfactory to panels produced with urea-formaldehyde but those manufactured with polychloroprene based resin (FASTBOND

Waste Utilization as Fine Coconut Fiber for Core and Wood Waste Bayur to The Face Layer of The Physical and Mechanical Properties of Particle Board Produced

This study aims to determine the effect of wood particle bayur comparison to the outer layer of coconut husk particle board smooth the physical and mechanical properties of the resulting particle board . The design used was completely randomized design ( CRD ) with 5 treatments with 3 replications for each treatment used is the use of wood particles bayur as the outer layer of particle board and refined coconut fiber as a core that is 80 % : 20 % , 70 % : 30 % , 60 % : 40 % , 50 % : 50 % , 40 % : 60 % observational data physical and mechanical properties were analyzed using analysis of variance if significantly different then performed with a further test of Duncan's New Multiple Range Test ( DMNRT ) at the 5% significance level . Observations made on the physical properties of particle board include : water content , water absorption and thickness expansion. The mechanical properties of particle board : strength broken , the pressure parallel and bonding strength. Based on the research that has been carried out showed that the utilization of wood waste bayur as the outer layer of particle board on a percentage varying significantly different effect on strength broken , water content , water absorption , expansion of thick , strength pressure bonding parallel to the internal surface . The results show the percentage of particle board with wood bayur with delicate coconut husk ( 40:60 ) is the best board with a water content of 6.11% , water absorption 20.56 % 10.93 % thicker expansion, density of 0.84 % , bonding strength of 56.90 kg / cm 2 pressure and parallel fiber determination 146.65 kg /cm 2.

Evaluation of Mechanical and Physical Properties of Particleboards with the Core Layer Made from Willow (Salix viminalis)

The objective of this study was to investigate some mechanical and physical properties of three-layer particleboards with the core layer made from various willow (Salix viminalis) and industrial pine wood particle mixtures. Increasing willow content slightly worsened the modulus of elasticity and modulus of rupture but improved internal bond, screw holding, water absorption, and thickness swelling. The effects of resin content in the core layer and the density of particleboards were also studied. Mechanical properties, especially modulus of elasticity and internal bond, of particleboards with willow particles met the requirements of EN 312 standard for boards of type P2. The willow (Salix viminalis) can be considered as a substitute for pine wood for the manufacturing of the core layer of three-layer particleboards.

The role of solid content of adhesive and panel density on the dimensional stability and mechanical properties of particleboard

The aim of this study was to investigate the role of the panel density and solid content of adhesive on the physical (thickness swelling) and mechanical properties (modulus of rupture, modulus of elasticity, and internal bonding strength) of particleboard composite. For the changing panel density, two different target densities (0.60 and 0.65 g/cm3), three different hot pressing pressures (20, 25, and 30 kg/cm2), two different shelling ratios (35% and 45%), and two different surface coating materials (at 70 and 90 g/m2grammage) were applied during the manufacturing of test panels. Increasing pressure improved all the properties of particleboard. However, applying lower or higher pressure level than required and necessary level negatively affected the thickness of the panels. Shelling ratio was found to be effective on the mechanical and physical properties of particleboard. Increasing panel density improved the strength properties and thickness swelling after 2 h immersion. However, high panel density negatively affected the thickness swelling after 24 h immersion. Coating of particleboard surfaces caused superior mechanical, except for internal bond strength, and physical properties. Melamine-impregnated paper grammage significantly improved the modulus of rupture, modulus of elasticity, and thickness swelling. Increasing paper grammage improved these properties. However, internal bond strength was not affected by paper grammage. Decreasing solid content of adhesive in the surface layers significantly improved all the properties of particleboard composite.

Thermal insulation and physical properties of particleboards from pineapple leaves

The aims of this research were to study the production processes and properties of thermal insulation produced from pineapple leaves using natural rubber latex as a binder. Thermal insulation boards were made by spraying the pretreated natural rubber latex onto pineapple fiber to form a squared thermal insulation with the size of 20 and 1.5 cm thickness. Test results on thermal and physical properties showed that the thermal insulation produced from pineapple leaves fiber exhibited a considerably good thermal insulation. The thermal conductivity of the thermal insulation was 0.035 W/m.K with density of 210 kg/m3, which was closed to the commercial insulator. The result showed that pineapple fibrous insulator was extremely potential to replace the synthesis fibrous insulator. Key words: Agricultural residue, spray process, insulating boards, low thermal conductivity.

Estimation of physical and mechanical properties of agro-based particleboards by near infrared spectroscopy

Partial least square regression (PLS-R) calibrations based on near infrared (NIR) spectroscopic data were developed in order to predict mechanical and physical properties of agro-based particleboards. The panels were manufactured using Eucalyptus and Pinus wood particles and sugar cane bagasse. The following panel properties were evaluated according to standard methods: modulus of elasticity (MOE), modulus of rupture (MOR), internal bonding (IB) strength, water absorption (WA24H), and thickness swelling (TS24H) after 24 hours of immersion. NIR spectra information was measured on samples cut from each particleboard and correlated with their physical and mechanical properties by PLS-R to build predictive NIR models. The NIR models for IB, WA24H and TS24H presented satisfactory coefficient of determination (0.73; 0.72 and 0.75, respectively.) The key role of resins (adhesives), cellulose, and lignin for NIRS calibrations of mechanical and physical properties of the particleboards is shown. These models can be useful to quickly verify such properties in unknown agro-based particleboards.

The effects of wetting and redrying cycle on physical properties of particleboard

The physical properties of six type particleboards bonded with different formaldehyde based resins were tested. After wetting and redrying, three PF bonded boards retained much higher proportion of their initial dry strength than the boards bonded with resins containing urea. The strength loss is the results of mechanical forces, caused by particle movement, breaking adhesive bonds.