Photonic Research Articles

Study on phase-matching of four-wave mixing spectrum in photonic crystal fiber

In the present paper, the four-wave mixing principle of fiber was analyzed, and the high-gain phase-matching conditions were shown. The nonlinear coefficient and dispersion characteristics of photonic crystal fibers were calculated by multipole method. The phase mismatch characteristics of fibers with multiple zero-dispersion wavelengths were analyzed for the first time. The changing rules of phase matching wavelength with the pump wavelength and the pump power were obtained, and the phase matching curves were shown. The characteristics of phase matching wavelengths for different dispersion curves were analyzed. There are four new excitation wavelengths of four-wave mixing spectrum in two zero-dispersion wavelength photonic crystal fiers. Four-wave mixing spectroscopy of photonic crystal fibers with two zero-dispersion wavelengths was obtained in the experi-ent, which is consistent with the theoretical analysis, and verified the reliability of the phase matching theory. The fiber with multiple zero-dispersion wavelengths can create a ricbhphase-matching topology, excite more four-wave mixing wavelengths, ena-ling enhanced control over the spectral locations of the four-wave mixing and resonant-radiation bands emitted by solitons and short pulses. These provide theoretical guidance for photonic crystal fiber wavelength conversion and supercontinoum generation based on four-wave mixing.

Dragons' den for photonics

Dragons' den for photonics

Partnerships Key to Photonics Innovation, EC VP Tells Photonics21

Partnerships Key to Photonics Innovation, EC VP Tells Photonics21

Can Germanium Replace Silicon in Mid‐Infrared Group IV Photonics?

Can Germanium Replace Silicon in Mid‐Infrared Group IV Photonics?

Prism Awards for photonics innovators

Prism Awards for photonics innovators

Optics on the Brain: OSA’s Mulitphoton and Patterned Optogenetics Incubator

A December 2013 OSA incubator meeting highlighted the role of cutting-edge optics and photonics in solving the mysteries of neuroscience—and helped forge connections between researchers in the two communities.

Bioinspiration brings fresh perspective to photonics

Bioinspiration brings fresh perspective to photonics

Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and Packaging

The large internet companies' investments indicate an ongoing increase of data-based business volume through the next decades with the rise of the internet of things and the continuous growth of communication and data facilities. The two-figure yearly growth rate of exchanged data volume within data centers is challenging the actual short distance communication paradigms. With datacenter architectures getting larger and “flatter”, the availability of high bandwidth, low power and low cost optical links ranging from less than 1 meter to 1 kilometer is a key issue. It is therefore expected that today's 10 Gb/s transceiver data rate soon increase to 28Gb/s, 40 Gb/s and beyond. For such a channel bandwidth, the copper-based wires are no longer suitable in terms of cost, power and bandwidth density. Optical interconnects are expected to replace copper for short distances below 500 m and down to 1 m within servers and between servers of the same data center. They exhibit much higher scalability and flexibility in terms of bandwidth, reach and lower energy consumption down to 1 pJ/b and below. The integration of optical transceivers close to the computational logic is therefore becoming more and more attractive. The enabling technology for optical interconnect is silicon photonics which is maturing and leveraging the well-established knowledge coming from silicon technology. We today have a complete set of silicon photonics technology modules that cover passive components including multiplexers/demultiplexers, coupling functions, photodetectors, modulators and integrated laser sources. Given the constraints coming from the supply chain, we consider a heterogeneous integration of the photonics (PIC) and the electrical integrated circuits (EIC) within a single package, differentiating from a co-integration of both of them on a single die demonstrated in the past, which is not a viable nor scalable option from the economical point of view. Thereby we leverage our expertise in the 3D integration field, and we use a full set of mature technology modules including through-silicon vias (TSV), wafer thinning and micro-bumping. These modules have only been used in the past within electrical circuits, but their implantation in photonics chips has no showstoppers. The 3D integration enables a stacking of the electrical drivers in the EIC die on top of the photodiodes and modulators in the PIC die. The small micro-bump size reduces the parasitic capacitances and enables an optimized electro-optical co-design. The TSV enable the connection of the stack with the rest of the package and to the second-level interconnect with low inductive losses, thus boosting the system performance. The advanced 3D packaging technique also enables the alignment and attachment of the optical fibers using silicon micro-ferrules. Today's active alignment techniques for optical coupling are time-consuming and expensive, and not compatible with usual micro-electronics techniques. The ongoing development of silicon micro-ferrules with mechanical micro-bumps enables a compatible assembly of the optical plugs with the remaining system and a quick assembly process with standard pick-and-place equipment. The paper will introduce today's system demand in the data base market and its translation into technology requirements. It will then survey our silicon photonics technology modules and actual demonstrations. We will then introduce the packaging constraints and the impact of 3D integration on the system assembly. Finally, we will present our advances in terms of packaging of optical micro-connectors.

Optics and photonics companies vie in Prism Awards for Photonics Innovation

Optics and photonics companies vie in Prism Awards for Photonics Innovation

二维介质柱型Archimedes(4，82)复式晶格光子晶体禁带特性研究

采用平面波展开法分别模拟了空气背景下由介质圆柱和方柱构造的二维Archimedes（4，8^2）复式晶格光子晶体的能带结构，讨论了介质柱形状、折射率、填充比和旋转对称性等因素对完全光子禁带的影响．研究发现，当折射率在2．60到5．40之间时，介质圆柱和方柱构造的二维Archimedes（4，8^2）复式晶格光子晶体都出现了完全光子禁带．随着折射率的增大，最大完全禁带宽度并非随之增大而是存在峰值，介质圆柱型晶格在折射率为2．80时出现峰值；介质方柱型晶格在折射率为2．80和4．40两处出现峰值，且旋转介质方柱能够明显增大禁带宽度，同时存在最佳旋转角度．分析结果表明，在最大完全禁带处，折射率、填充比以及旋转角度等因素的变化对禁带特性的影响很小．

Photonics innovation in Europe's Horizon 2020

Photonics innovation in Europe's Horizon 2020

Photonics in the development of personalized medicine

Photonics in the development of personalized medicine

Colloidal crystal cladded microfiber for refractive index sensing

We investigate the evanescent field of a microfiber wrapped by colloidal crystals. The microfiber has the diameter of about 1 μm that is drawn from a single-mode fiber with an alcohol lamp. The colloidal spheres are further attached to the microfiber through thermal evaporation, then they self-assemble to crystal-like structures. The 400 nm, 590 nm, and 710 nm-diameter SiO 2 colloidal spheres are used, respectively. The spectral responses are studied theoretically and experimentally, and the results agree with each other. It is revealed that the evanescent field of a microfiber could be modulated by the photonic band-gap of colloidal crystals. This characteristic is very useful in refractive index sensing for liquids.

Update: Photonics calls in Horizon 2020

Update: Photonics calls in Horizon 2020

Optics and photonics groups join SPIE DSS

Optics and photonics groups join SPIE DSS

同轴波导中二维金属光子晶体的电磁特性

同轴波导中二维金属光子晶体的电磁特性

Optical Ring Architecture Performance Evaluation using Ordinary Receiver

Wavelength division multiplexing is an accepted technique to exploit the fiber bandwidth in metro network. Designing innovative architectures for metro network often means finding cost effective combinations of electronic and optic technologies and new network paradigms suited for constraints caused by available photonic components and subsystems. The three different and architectures included in this project the bulk of raw data in the optic domain while the implementation of the complex network formation is in the electronic domain. All the three ringO architectures perform λ monitoring. The basic ringO architecture is based on WDM fiber ring. The three ring architectures are designed and simulated using OptSim 5.3 software.

Respect and fulfillment derived from career in optics, photonics

Respect and fulfillment derived from career in optics, photonics

Photonic Matchmaking

Photonic Matchmaking

Photonic Liquid Crystal Fibers with Polymers

Photonic Liquid Crystal Fibers with Polymers T.R. Woli«ski, M. Tefelska, K. Mile«ko, A. Siarkowskaa,∗, D. Budaszewski, A.W. Doma«ski, S. Ertman, K. Orzechowski, K. Rutkowska, M. Sierakowski, E. Nowinowski-Kruszelnicki, R. Dibrowski and P. Mergo Faculty of Physics, Warsaw University of Technology, Warsaw, Poland Military University of Technology, Warsaw, Poland Maria Curie Skaodowska University, Lublin, Poland