This paper presents the use of Additive Manufacturing (AM) in packaging applications. Specifically, the design, fabrication, and test of an AM packaged receiver phased array front-end will be shown. As part of this work, an LNA and phase shifter bare die will be directly integrated on board with the antenna array. The bare die integration is conducted through attaching the die to a pocket milled into the dielectric of a copper laminate. Filet bridges between the chip and board are then applied using a photocurable dielectric ink, and aerosol-jet silver conductors are printed overtop. Rigorous modeling of the phase shifter and LNA die are conducted and compared to measured data. The two-element array will be printed alone with spacing and amplitude/phase excitation for broadside radiation and the measured results for the antenna will be compared with simulated results from Ansys HFSS modeling tool. Finally, the fully integrated system will be assembled on a single substrate and tested