Calculations are performed for the purpose of determining the steady‐state behavior of plated through‐holes with various aspect ratios during the dc electrodeposition of copper over a wide range of operating conditions. The results indicate that when electrolyte flow is restricted the maximum average current density possible within the through‐holes is much less than 1 mA/cm2 and the current distribution is considerably nonuniform for the high aspect ratio through‐holes. Higher average current densities within the through‐holes are possible only when flow of electrolyte is induced. However, the current distribution remains nonuniform for the high aspect ratio holes. While periodic flow reversal has been shown to improve the current distribution under mass‐transfer limiting situations, the results indicated that the effect on the current distribution will not be significant when operating well below the limiting current density for deposition.