During the operational process of electronic components, excessive heat generation results in significant temperature elevation. This elevated temperature poses a significant risk to their service life. Regarding the issue of efficient thermal management of electronic devices in enclosed spaces experiencing high heat flow, a thermal management scheme for electronic equipment using TPMS and a PCM-based heat sink is proposed. The apparent heat capacity method is employed to simulate the melting process of the PCM-based heat sink. The effects of structural parameters w1, w3, and C of TPMS structures on the heat transfer characteristics (including base temperature, liquid fraction, average cell temperature, and average heat transfer coefficient) of the PCM-based heat sink during the melting process are discussed. A temperature testing platform is established. Experimental research is performed to investigate the effect of TPMS structures with two different printing prototypes (Sample 1, and Sample 2) on the heat sink during the intermittent cycle. The results indicate that increasing the parameters C and w1 significantly improves the average heat transfer coefficient (HTC) of the heat sink. When C increases from 0.3 to 0.7, the average HTC increases from 307 W/(m2·K) to 358 W/(m2·K). When w1 increases from 1 to 3, the average HTC increases from 284.5 W/(m2·K) to 321.3 W/(m2·K). Sample 1, possessing superior thermal conductivity, exhibits better heat transfer performance. When the temperature achieves a stable periodic variation, the base temperature of Sample 1 stabilizes within the range of 310 K-340 K. And Sample 2 stabilizes within the range of 315 K-350 K.