Experimental and numerical investigations on the intermittent heat transfer performance of phase change material (PCM)-based heat sink with triply periodic minimal surfaces (TPMS)

Abstract

The excessive heat generated during the operation of electronic components leads to significant temperature increases, posing a significant risk to their service life. For the problem of efficient thermal management of electronic devices in confined spaces experiencing high heat flow, a scheme using triply periodic minimal surfaces and a phase change material-based active–passive cooling heat sink is proposed to control the temperature of electronic equipment. The apparent heat capacity method is employed to simulate the intermittent process of the phase change material-based heat sink. The optimization based on Box-Behnken Design and Nondominated Sorting Genetic Algorithm II is analyzed to obtain an improved triply periodic minimal surface structure. The effect of thermal performance (including base temperature, liquid fraction, and Grashof number) of an intermittent heat sink based on an improved structure is discussed. Visualization and temperature testing platforms are established. Through visualization experiments, the internal temperature and liquid fraction distribution of the heat sink are obtained, and the simulation results are in good agreement with the test results. The results show that the base temperature, liquid fraction, and Grashof number achieve a steady periodic variation during the intermittent process. Specifically, the base temperature remains stable in the range of 314 K to 340 K, the liquid fraction stabilizes between 0.8 and 1.0, and the Grashof number stabilizes between 100 and 1000. At heating power of 30 W or below, the base temperature of the heat sink exhibits a steady periodic variation. At the heating power of 40 W, the maximum base temperature of the heat sink exceeds 370 K.