Deposition of an iron oxide plaque or coating on roots of rice (Oryza sativa L. cv. M-201 84 Biggs) ameliorated the toxic effects of copper (Cu), nickel (Ni), and Cu + Ni on plant growth and affected patterns of metal uptake and accumulation. Plaque was formed on plants during 24 h in an anaerobic solution containing 20 mg ∙ L−1 iron at pH 5.5. Subsequently two additional coatings were deposited after new growth of roots. Plants were grown hydroponically in one-quarter strength Hoagland's solution and exposed to Cu (0.5 mg ∙ L−1), Ni (2.0 mg ∙ L−1), or Cu + Ni; exposure to metals lasted 21 – 45 days. At the end of the experimental period growth was estimated as total biomass, dry weight of root, dry weight of shoot, length of leaf, and length of root. After harvesting, Fe, Cu, and Ni concentrations in plaque were measured using a dithionite–citrate–bicarbonate extraction, and internal Fe, Cu, and Ni concentrations were measured in roots and leaves using atomic absorption spectrophotometry. Formation of the palque did not affect growth of plants in control solutions. When exposed to Cu, plants with plaque had significantly larger biomass, dry weight of roots, dry weight of leaves, and growth increments of root and leaf than plants without plaque. When exposed to Ni, plants with plaque had signifiantly higher increment in leaf growth than plants without plaque. When exposed to Ni + Cu, plants with plaque had significantly higher biomass than plants without plaque. Toxic symptoms were not observed on plants with plaque grown with excess copper, while all other plants exposed to metals showed chlorosis, necrosis, or both. Metals were detected on the surface of roots, whether plants were allowed to develop a plaque or not. Cu, Ni, and Fe were concentrated in plaque and in roots. Lower concentrations of Cu and Ni were found in leaves of plants with a plaque than in plants without plaque. Comparisons of concentrations of Fe, Cu, and Ni with those of other species grown under field conditions are made. Key words: rice, iron plaque, toxicity of Cu and Ni.